Patents by Inventor Atsushi Kazuno
Atsushi Kazuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8303372Abstract: A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 40° C. or less, and (3) 4,4?-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.Type: GrantFiled: August 22, 2007Date of Patent: November 6, 2012Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Atsushi Kazuno, Tetsuo Shimomura, Yoshiyuki Nakai, Kazuyuki Ogawa, Tsuyoshi Kimura
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Patent number: 8148441Abstract: A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.Type: GrantFiled: February 27, 2006Date of Patent: April 3, 2012Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Masato Doura, Takeshi Fukuda, Kazuyuki Ogawa, Atsushi Kazuno, Hiroshi Seyanagi, Masahiko Nakamori, Takatoshi Yamada, Tetsuo Shimomura
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Publication number: 20110218263Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.Type: ApplicationFiled: May 13, 2011Publication date: September 8, 2011Applicant: Toyo Tire & Rubber Co., Ltd.Inventors: Atsushi KAZUNO, Kazuyuki Ogawa, Masahiko Nakamori, Takatoshi Yamada, Tetsuo Shimomura
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Publication number: 20110053377Abstract: An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.Type: ApplicationFiled: March 12, 2008Publication date: March 3, 2011Applicant: TOYO TIRE * RUBBER CO., LTD.Inventors: Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura, Tetsuo Shimomura
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Patent number: 7871309Abstract: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).Type: GrantFiled: December 8, 2005Date of Patent: January 18, 2011Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Kazuyuki Ogawa, Tetsuo Shimomura, Atsushi Kazuno, Yoshiyuki Nakai, Masahiro Watanabe, Takatoshi Yamada, Masahiko Nakamori
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Patent number: 7731568Abstract: The object of the invention is to provide a polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of use to the end of use even if polishing is performed with an alkaline or acid slurry, as well as a method of manufacturing a semiconductor device with this polishing pad. The polishing pad of the invention is used in chemical mechanical polishing and has a polishing region and a light-transmitting region, wherein the light-transmitting region satisfies that the difference ?T (?T=T0?T1) (%) between T0 and T1 is within 10(%) over the whole range of measurement wavelengths of from 400 to 700 nm, wherein T1 is the light transmittance (%) of the light-transmitting region measured at the measurement wavelength ? after dipping for 24 hours in a KOH aqueous solution at pH 11 or an H2O2 aqueous solution at pH 4 and T0 is the light-transmittance (%) measured at the measurement wavelength ? before the dipping.Type: GrantFiled: October 20, 2004Date of Patent: June 8, 2010Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Kazuyuki Ogawa, Atsushi Kazuno, Masahiro Watanabe
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Publication number: 20100048102Abstract: A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.Type: ApplicationFiled: March 13, 2008Publication date: February 25, 2010Applicant: Toyo Tire & Rubber Co., LtdInventors: Yoshiyuki Nakai, Atsushi Kazuno, Tsuyoshi Kimura, Tetsuo Shimomura, Kazuyuki Ogawa
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Patent number: 7651761Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.Type: GrantFiled: October 3, 2002Date of Patent: January 26, 2010Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Takashi Masui, Shigeru Komai, Koichi Ono, Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura, Hiroshi Seyanagi
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Publication number: 20100015893Abstract: An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 40° C. or less, and (3) 4,4?-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt %).Type: ApplicationFiled: August 22, 2007Publication date: January 21, 2010Applicant: Toyo Tire & Rubber Co., Ltd.Inventors: Atsushi Kazuno, Tetsuo Shimomura, Yoshiyuki Nakai, Kazuyuki Ogawa, Tsuyoshi Kimura
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Publication number: 20100003896Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.Type: ApplicationFiled: August 17, 2007Publication date: January 7, 2010Applicant: Toyo Tire & Rubber Co., Ltd.Inventors: Yoshiyuki Nakai, Tsuyoshi Kimura, Atsushi Kazuno, Kazuyuki Ogawa, Tetsuo Shimomura
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Publication number: 20090253353Abstract: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).Type: ApplicationFiled: December 8, 2005Publication date: October 8, 2009Applicant: TOYO TIRE & RUBBER CO., LTDInventors: Kazuyuki Ogawa, Tetsuo Shimomura, Atsushi Kazuno, Yoshiyuki Nakai, Masahiro Watanabe, Takatoshi Yamada, Masahiko Nakamori
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Publication number: 20090093201Abstract: An object of the invention is to provide a polishing pad which hardly generates a scratch on a surface of a polishing object, and is excellent in planarization property. In addition, an object of the invention is to provide a polishing pad which has a high polishing rate and is excellent in planarization property. In addition, an object of the invention is to provide a polishing pad in which a groove is scarcely clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, a polishing rate is scarcely reduced.Type: ApplicationFiled: May 10, 2006Publication date: April 9, 2009Inventors: Atsushi Kazuno, Kazuyuki Ogawa, Masahiko Nakamori, Takatoshi Yamada, Tetsuo Shimomura
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Patent number: 7488236Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.Type: GrantFiled: August 24, 2006Date of Patent: February 10, 2009Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Shigeru Komai, Koichi Ono, Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura
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Patent number: 7470170Abstract: The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 ?m/(gf/cm2).Type: GrantFiled: February 22, 2005Date of Patent: December 30, 2008Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Tetsuo Shimomura, Atsushi Kazuno, Kazuyuki Ogawa, Yoshiyuki Nakai, Masahiko Nakamori, Takatoshi Yamada
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Patent number: 7378454Abstract: A polyurethane composition containing solid beads dispersed therein, is formed of a microcellular polyurethane foam, and the composition has a storage modulus of elasticity at 40° C. of 270 MPa or more as measured by means of a dynamic elasticity measuring device. Another polyurethane composition of this invention contains solid beads dispersed therein, that are capable of swelling with or are soluble in an aqueous medium. The former composition has excellent flattening capability, and the latter composition can provide a polished surface which combines good flatness and good uniformity and can also reduce scratches on the surface.Type: GrantFiled: April 4, 2002Date of Patent: May 27, 2008Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Takashi Masui, Masahiko Nakamori, Takatoshi Yamada, Koichi Ono, Kazuyuki Ogawa, Atsushi Kazuno, Hiroshi Seyanagi
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Publication number: 20080085943Abstract: A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.Type: ApplicationFiled: February 27, 2006Publication date: April 10, 2008Applicant: Toyo Tire & Rubber Co., Ltd.Inventors: Masato Doura, Takeshi Fukuda, Kazuyuki Ogawa, Atsushi Kazuno, Hiroshi Seyanagi, Masahiko Nakamori, Takatoshi Yamada, Tetsuo Shimomura
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Publication number: 20070190905Abstract: The object of the invention is to provide a polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of use to the end of use even if polishing is performed with an alkaline or acid slurry, as well as a method of manufacturing a semiconductor device with this polishing pad. The polishing pad of the invention is used in chemical mechanical polishing and has a polishing region and a light-transmitting region, wherein the light-transmitting region satisfies that the difference ?T (?T=T0?T1) (%) between T0 and T1 is within 10(%) over the whole range of measurement wavelengths of from 400 to 700 nm, wherein T1 is the light transmittance (%) of the light-transmitting region measured at the measurement wavelength ? after dipping for 24 hours in a KOH aqueous solution at pH 11 or an H2O2 aqueous solution at pH 4 and T0 is the light-transmittance (%) measured at the measurement wavelength ? before the dipping.Type: ApplicationFiled: October 20, 2004Publication date: August 16, 2007Inventors: Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Kazuyuki Ogawa, Atsushi Kazuno, Masahiro Watanabe
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Publication number: 20070178812Abstract: The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 ?m/(gf/cm2).Type: ApplicationFiled: February 22, 2005Publication date: August 2, 2007Applicant: TOYO TIRE & RUBBER CO., LTD.Inventors: Tetsuo Shimomura, Atsushi Kazuno, Kazuyuki Ogawa, Yoshiyukii Nakai, Masahiko Nakamori, Takatoshi Yamada
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Publication number: 20060280929Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.Type: ApplicationFiled: August 24, 2006Publication date: December 14, 2006Inventors: Tetsuo SHIMOMURA, Masahiko NAKAMORI, Takatoshi YAMADA, Takashi MASUI, Shigeru KOMAI, Koichi ONO, Kazuyuki OGAWA, Atsushi KAZUNO, Tsuyoshi KIMURA, Hiroshi SEYANAGI
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Publication number: 20060280930Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.Type: ApplicationFiled: August 24, 2006Publication date: December 14, 2006Inventors: Tetsuo SHIMOMURA, Masahiko NAKAMORI, Takatoshi YAMADA, Takashi Masui, Shigeru KOMAI, Koichi ONO, Kazuyuki OGAWA, Atsushi KAZUNO, Tsuyoshi KIMURA, Hiroshi Seyanagi