Abstract: This alignment device aligns a stage 10 and a wafer 50 by comparing alignment images captured by respective two chips of the wafer 50 on the stage 10. The alignment device comprises: the stage 10 that holds the wafer 50; an alignment illumination light source 60 that irradiates the wafer 50 held on the stage 10 with light; an alignment image processing unit 67 that receives light from the wafer 50 and acquires the alignment images; an information input/output unit 4 that inputs and outputs information; and an alignment processing unit 3 that processes information from the image processing unit 67 for alignment and the information input/output unit 4.

Abstract: A depressurized multilayer glass panel 10 includes: a first glass plate 11; a second glass plate 12; a sealing portion forming an air gap portion 13 sealed in a depressurized state between the first glass plate 11 and the second glass plate 12; and a plurality of columns 16 disposed between the first glass plate 11 and the second glass plate 12, each column 16 including contact surfaces 21 in contact with facing surfaces 17, 18 of the first glass plate 11 and the second glass plate 12, and non-contact portion 23 provided around the contact surface 21 and spaced apart from the facing surfaces 17, 18 of the first glass plate 11 and the second glass plate 12, wherein the non-contact portion 23 is configured such that when the facing first glass plate 11 or second glass plate 12 is deformed by being subjected to a first external force, at least a part of the non-contact portion 23 is contactable with the deformed first glass plate 11 or second glass plate 12.

Abstract: A storage device includes: a memory; and a processor configured to, at the time of writing data into the memory, generate a first check code common to a plurality of types of error correction codes from the data on the basis of a correlation relationship between the plurality of types of error correction codes, add the first check code to the data and write the data into the memory, convert the first check code into a second check code based on any one of the plurality of types of error correction codes at the time of reading the data from the memory, and perform error correction by using the second check code.

Abstract: A storage device includes: a memory; and a processor configured to, at the time of writing data into the memory, generate a first check code common to a plurality of types of error correction codes from the data on the basis of a correlation relationship between the plurality of types of error correction codes, add the first check code to the data and write the data into the memory, convert the first check code into a second check code based on any one of the plurality of types of error correction codes at the time of reading the data from the memory, and perform error correction by using the second check code.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni concentration of 0.1 to 15.0 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO2) for 1 minute. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 ?g/dm2 and a Zn deposited amount of 20 to 1,000 ?g/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements R?q according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

Abstract: The communication cable comprising a first failure information region that stores first failure information and a second failure information region that stores second failure information, and in a case where a communication failure occurs, the manager apparatus reads the first failure information from the first failure information region, and the communication controller apparatus reads the second failure information from the second failure information region. With this configuration, in a case where a communication failure occurs, correlated failure information can be easily and surely obtained.

Abstract: An object is to enable sealing of a peripheral portion of a glass panel with less effort and time. A first metal introduction device 5A is moved from one first corner A at which two sides intersect each other of a pair of rectangular glass plates, toward another end of a first side Vab of the two sides, while performing filling with a metal material. Before the metal material filling the first corner A is solidified, a second metal introduction device 5B is moved from the first corner A toward another end of another second side Vad, while performing filling with a metal material. After the first side Vab and the second side Vad are filled with the metal material, both glass plates are rotated by 180 degrees, and the first metal introduction device 5A is moved toward another end of a fourth side Vcd of two sides intersecting each other at a second corner C diagonal to the first corner A, while performing filling with a metal material.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni concentration of 0.1 to 15.0 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO2) for 1 minute. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements R?q according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 ?g/dm2 and a Zn deposited amount of 20 to 1,000 ?g/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Abstract: A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

Abstract: An object is to enable suppression of thermal leakage at a peripheral portion of a pair of glass plates disposed so as to be opposed to each other with a gap interposed therebetween. A pair of glass plates 1A, 1B are disposed so as to be opposed to each other with a gap V interposed therebetween, and a periphery sealing metal material 3 is provided which joins the pair of glass plates 1A, 1B at a peripheral portion V1 thereof so as to seal the gap V in an airtight state. The periphery sealing metal material 3 interposed between opposed inner surfaces of the pair of glass plates 1A, 1B contains, in a mixed manner, a thermal insulation material 30 having lower thermal conductivity than that of the periphery sealing metal material 3.

Abstract: The value range for which an error in a digital signal can be corrected is expanded. A control unit generates characteristic information indicating the relationship between an input and an output of an A/D converter and sets a value range. The control unit, in a case in which a value indicated by a first digital signal obtained by the A/D converter converting a first analog voltage signal is within the value range, A/D converts the first analog voltage signal and generates corrected digital information on the basis of the first digital signal and characteristic information, and in a case in which a value indicated by the first digital signal is not within the value range, A/D converts the first analog voltage signal and generates corrected digital information on the basis of a second digital signal obtained by the A/D converter converting the second analog voltage signal and characteristic information.

Abstract: The communication cable comprising a first failure information region that stores first failure information and a second failure information region that stores second failure information, and in a case where a communication failure occurs, the manager apparatus reads the first failure information from the first failure information region, and the communication controller apparatus reads the second failure information from the second failure information region. With this configuration, in a case where a communication failure occurs, correlated failure information can be easily and surely obtained.

Abstract: An information processing apparatus of a first information processing apparatus coupled to a second information processing apparatus via an optical fiber, the information processing apparatus includes a memory, and a processor coupled to the memory and the processor configured to store, into the memory, a first reception power of an optical signal received via the optical fiber when an initial value is stored in the memory, store, into the memory, a second reception power of the optical signal received via the optical fiber when the first reception power is stored in the memory, and stop receiving the optical signal when a difference between the first reception power and the second reception power is equal to or greater than a first threshold value.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 ?m, a roughness Rz is 1.00 to 2.00 ?m, a roughness Sq is 0.16 to 0.30 ?m, a roughness Ssk is ?0.6 to ?0.35, a roughness Sa is 0.12 to 0.23 ?m, a roughness Sz is 2.20 to 3.50 ?m, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 ?m, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.