Abstract: An optical-communication module includes a transceiver to communicate with another optical-communication module (another module); and a control circuit to transmit a first signal to the another module at activation of the own module, execute a first control where a second signal transmitted to the first signal is received from the another module, and execute a second control after the first control, wherein one of the first and second control is a control to adjust an intensity of a signal from the transceiver to the another module based on a feedback signal from the another module to a signal from the transceiver, and wherein the other one of the first and second control is a control causing the another module to adjust a signal intensity from the another module to the transceiver by transmitting a feedback signal to the another module to a signal from the another module.

Abstract: A communication device includes: an optical-communication circuit that is capable of performing optical communication with a different communication device and transmits a first electric signal to the different communication device at a startup time of the communication device; an electro-communication circuit that is capable of performing electro communication with the different communication device and receives a second electric signal transmitted from the different communication device in response to the first electric signal; and a control circuit that transmits error information indicating an error in the optical communication to a device after the second electric signal is received by the electro-communication circuit.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and (1-1) a roughness Ra is 0.08 to 0.20 ?m, (1-2) a roughness Rz is 1.00 to 2.00 ?m, (1-3) a roughness Sq is 0.16 to 0.30 ?m, (1-4) a roughness Ssk is ?0.6 to ?0.35, (1-5) a roughness Sa is 0.12 to 0.23 ?m, (1-6) a roughness Sz is 2.20 to 3.50 ?m, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.

Abstract: An alarm register stores therein failure information having a first size and related to a failure that has occurred in communication performed by each of the CPUs 103 and 104. A failure information transmitting unit reads, from the alarm register, failure information in units of a second size including a plurality of pieces of the failure information with the first size, and deletes the read failure information from the alarm register. An information acquiring unit 121 stores, in a failure information buffer 122, the failure information that has been read in units of the second size. An information notifying unit 123 reads failure information in units of the first size from the failure information buffer 122, and gives a notice of the read failure information to the CPU 103 or 104 corresponding to communication in which a failure indicated by the read failure information has occurred.

Abstract: The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 ?m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Abstract: An information processing device includes: a receiver configured to receive information from another information processing device that mutually communicates the information; and a processor configured to process the information received by the receiver, the receiver: detects occurrence of a burst error in the received information; sequentially writes the received information in a first memory; stops the writing of the information to the first memory based on detection of the burst error; shuts off transmission of the information received from the another information processing device based on a reproducing instruction; and transmits the information read from the first memory.

Abstract: Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ?E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

Abstract: Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.

Abstract: Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

Abstract: A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, containing a heat generating component and a heat radiating member for radiating heat from the heat generating component, wherein the heat radiating member has a layer structure containing a metal material for heat radiation and a graphite sheet.

Abstract: A communication device includes: an optical-communication circuit that is capable of performing optical communication with a different communication device and transmits a first electric signal to the different communication device at a startup time of the communication device; an electro-communication circuit that is capable of performing electro communication with the different communication device and receives a second electric signal transmitted from the different communication device in response to the first electric signal; and a control circuit that transmits error information indicating an error in the optical communication to a device after the second electric signal is received by the electro-communication circuit.

Abstract: An optical-communication module includes a transceiver to communicate with another optical-communication module (another module); and a control circuit to transmit a first signal to the another module at activation of the own module, execute a first control where a second signal transmitted to the first signal is received from the another module, and execute a second control after the first control, wherein one of the first and second control is a control to adjust an intensity of a signal from the transceiver to the another module based on a feedback signal from the another module to a signal from the transceiver, and wherein the other one of the first and second control is a control causing the another module to adjust a signal intensity from the another module to the transceiver by transmitting a feedback signal to the another module to a signal from the another module.

Abstract: An optical component includes a light emitter; an optical receiver; first and second electro-optical crystal layers configured to intersect with each other; and a control line configured to supply a signal for changing refractive indexes of the first and second electro-optical crystal layers, wherein the first and second electro-optical crystal layers are switched according to the signal between a first state where light from the light emitter is transmitted through the first electro-optical crystal layer and a second state where the light is reflected by the first and second electro-optical crystal layers and the reflected light is incident on the optical receiver.

Abstract: A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, comprising a heat generating component, a heat generating component protective member that is provided to cover a part or the entire of the heat generating component and to be spaced from the heat generating component, and a heat radiating member that is provided on a face of the heat generating component protective member on the side of the heat generating component to be spaced from a surface of the heat generating component on the side of the heat generating component protective member, wherein the heat radiating member contains a metal material for heat radiation at least on a surface of the heat radiating member on the side of the heat generating component.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.

Abstract: A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate, a metal layer 1 and a metal layer 2 in this order.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.

Abstract: To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiO2 conversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.