Patents by Inventor Atsushi Ozawa

Atsushi Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030175134
    Abstract: In an automotive compressor, a pulley (6) is rotatably supported on a compressor housing (1) through a bearing (5) to have an axial gap (10) left between the compressor housing and the pulley. A waterproof cover (13) covers the axial gap and serves to suppress water from the outside from reaching the bearing. The waterproof cover is fixed to the compressor housing by a ring-shaped fastener (14). Instead of use of the waterproof cover, the axial gap may be controlled in size thereof.
    Type: Application
    Filed: March 13, 2003
    Publication date: September 18, 2003
    Inventors: Tomohiko Matsubara, Atsushi Ozawa
  • Patent number: 6554730
    Abstract: An auxiliary equipment of driving force for bicycle is provided wherein a reduction gear of the traction roller type is adopted, and the contact pressure between the outer peripheral surfaces of the traction rollers and the outer peripheral surface of the rotatable shaft and the inner peripheral surface of the outer ring is controlled corresponding to the torque to be transmitted, so that the battery is less exhausted and that the traveling distance of the electrically power augmented bicycle is prolonged.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: April 29, 2003
    Assignee: NSK Ltd.
    Inventors: Koichi Sakai, Ryoichi Otaki, Hisashi Machida, Atsushi Ozawa
  • Patent number: 6392682
    Abstract: The printer device of the present invention makes use of a thermal head to transfer ink to recording paper on a platen roller, and includes a thermal head support member, cooling means, and a support member that supports the cooling means. The thermal head support member has a support component that supports the thermal head, and a recess provided to the back side, which is the opposite side from the support component, and is movably disposed between a transfer position where the ink is transferred and a retracted position to which the thermal head support member) is retracted from the transfer position. The cooling means radiates the heat generated by the thermal head. The support member supports the cooling means such that at least part of the cooling means will enter the recess when the thermal head support member is moved to its retracted position.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: May 21, 2002
    Assignee: Olympus Optical Co., Ltd.
    Inventor: Atsushi Ozawa
  • Publication number: 20010022610
    Abstract: The printer device of the present invention makes use of a thermal head to transfer ink to recording paper on a platen roller, and comprises a thermal head support member, cooling means, and a support member that supports the cooling means. The thermal head support member has a support component that supports the thermal head, and a recess provided to the back side, which is the opposite side from the support component, and is movably disposed between a transfer position where the ink is transferred and a retracted position to which the thermal head support member) is retracted from the transfer position. The cooling means radiates the heat generated by the thermal head. The support member supports the cooling means such that at least part of the cooling means will enter the recess when the thermal head support member is moved to its retracted position.
    Type: Application
    Filed: February 8, 2001
    Publication date: September 20, 2001
    Applicant: Olympus Optical Co., Ltd.
    Inventor: Atsushi Ozawa
  • Patent number: 5808872
    Abstract: A semiconductor package includes a semiconductor chip having a plurality of electrodes on a main surface thereof, and a package substrate having first and second parallel surfaces, wherein the package substrate is fixed to the semiconductor chip in such a positional relationship that the main surface of the semiconductor chip faces the first surface, and has substantially the same size as a size of the semiconductor chip as viewed on a projection plane vertical to the first surface, and wherein the package substrate has a passage extending between the first and the second surfaces for electrically connecting the electrodes of the semiconductor chip to predetermined portions of the circuit board. A method of mounting the above-mentioned semiconductor package to the circuit board comprises electrically connecting the electrodes of the semiconductor chip to predetermined portions of the circuit board by bonding wires or bumps, through the passage provided to the semiconductor package.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: September 15, 1998
    Assignee: Nippon Steel Corporation
    Inventor: Atsushi Ozawa