Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.

Abstract: A recording material conveying device includes: a first conveyor that constitutes a conveyance path of a recording material; a second conveyor that branches from the first conveyor and constitutes a conveyance path of the recording material different from the conveyance path of the first conveyor; and a detector that detects recording material characteristics of the recording material, the detector being arranged in the second conveyor on a downstream side in a conveyance direction of the recording material with respect to a branch portion where the first conveyor and the second conveyor branch.

Abstract: This hot-dip Zn—Al—Mg-based plated steel includes: a steel; and a plating layer formed on a surface of the steel, in which the plating layer contains, as an average composition, Mg: 1 to 10 mass %, Al: 4 to 22 mass %, and a remainder consisting of Zn and impurities, the plating layer includes an (Al—Zn mixed structure) in an area ratio of 10% to 70% in a cross section of the plating layer in a matrix of an (Al/Zn/MgZn2 ternary eutectic structure), the (Al—Zn mixed structure) includes a first region that has a Zn concentration in a range of 75 mass % or more and less than 85 mass % and a second region that is present inside the first region and has a Zn concentration in a range of 67 mass % or more and less than 75 mass %, and an area ratio of the second region in the (Al—Zn mixed structure) in the cross section of the plating layer is more than 0% and 40% or less.

Abstract: An indoor unit includes: a casing that has an air outlet and an air inlet, and inside which an air passage is formed; a cross flow fan disposed in the air passage and configured to blow out, through the air outlet, air sucked in from the air inlet; a stabilizer configured to stabilize vortex of air caused by circulation of air and generated inside the cross flow fan upon rotation thereof; and a guide wall having a surface defining an outlet side air passage being a part of the air passage, the part being in downstream of the cross flow fan, wherein the stabilizer has a first surface that defines a surface opposite to the guide wall in the outlet side air passage, and a part of the outlet side air passage is formed such that a distance in a vertical direction from the first surface to the guide wall gradually decreases toward the downstream.

Abstract: A package includes: a first portion having defined therein a mounting region in which an electronic component is mounted; and a second portion connected to the first portion. An area of the second portion is larger than an area of the first portion in plain view viewed from the direction normal to a surface through which the first portion and the second portion are connected.

Abstract: Semiconductor device A1 includes: first terminal 201A and second terminal 201B; first switching element 1A including first gate electrode 12A, first source electrode 13A and first drain electrode 14A; and second switching element 1B including second gate electrode 12B, second source electrode 13B and second drain electrode 14B. First switching element 1A and second switching element 1B are connected in series to each other between first terminal 201A and second terminal 201B. Semiconductor device A1 includes first capacitor 3A connected in parallel to first switching element 1A and second switching element 1B between first terminal 201A and second terminal 201B. First switching element 1A and second switching element 1B are aligned in y direction. First capacitor 3A overlaps with at least one of first switching element 1A and second switching element 1B as viewed in z direction. These arrangements serve to suppress surge voltage.

Abstract: A coil component includes a primary winding generating a magnetic field by current input from outside, and a secondary winding an induced current generated by the magnetic field passes. The primary winding includes ring-shaped primary first/second turns as viewed in first direction. The secondary winding includes ring-shaped secondary first/second turns as viewed in first direction. The primary and secondary first turns are alternately arranged in first direction to form a first tubular portion. The primary and secondary second turns are alternately arranged in first direction to form a second tubular portion. The second tubular portion is located inside the first tubular portion as viewed in first direction. The input current in each primary first turn and the input current in each primary second turn flow in the same direction.

Abstract: This semiconductor light-emitting device includes a substrate having a substrate main surface, a semiconductor light-emitting element having a light-emitting element main surface mounted on the substrate main surface and facing the same side as the substrate main surface, and a light-emitting element side surface that is a light-emitting surface facing a direction intersecting the light-emitting element main surface, a switching element and a capacitor mounted on the substrate main surface and serving as drive elements used in driving the semiconductor light-emitting element, a translucent member formed from a material having a greater linear expansion coefficient than the substrate and transmitting light emitted from the light-emitting side surface, the translucent member covering the light-emitting element side surface, and a sealing resin formed from a material that has a smaller linear expansion coefficient than the translucent member, the sealing resin sealing the semiconductor light-emitting element, th

Abstract: Semiconductor device A1 includes: first terminal 201A and second terminal 201B; first switching element 1A including first gate electrode 12A, first source electrode 13A and first drain electrode 14A; and second switching element 1B including second gate electrode 12B, second source electrode 13B and second drain electrode 14B. First switching element 1A and second switching element 1B are connected in series to each other between first terminal 201A and second terminal 201B. Semiconductor device A1 includes first capacitor 3A connected in parallel to first switching element 1A and second switching element 1B between first terminal 201A and second terminal 201B. First switching element 1A and second switching element 1B are aligned in y direction. First capacitor 3A overlaps with at least one of first switching element 1A and second switching element 1B as viewed in z direction. These arrangements serve to suppress surge voltage.

Abstract: A driving circuit controls driving of a switching element by outputting a driving signal to the switching element. The driving circuit includes an air-core transformer having a plurality of primary windings and a secondary winding magnetically coupled to each of the plurality of primary windings. An AC signal is input to each of the plurality of primary windings of the air-core transformer. The plurality of primary windings includes a first primary winding and a second primary winding. There is a phase difference between an AC signal input to the first primary winding and an AC signal input the second primary winding.

Abstract: An audio signal processing system and method is executed by an audio signal processing device to decode an audio packet to obtain decoded audio and determine an occurrence of a discontinuity occurring with a sudden increase of an amplitude of the decoded audio obtained by decoding the audio packet. The audio packet may be received correctly after an occurrence of a packet loss, and corrected to improve subjective quality of the decoded audio, wherein correcting the discontinuity of the decoded audio comprises causing distances between ISF/LSF parameters corresponding to a frame in which a packet loss has occurred to be equal.

Abstract: An audio signal transmission device for encoding an audio signal includes an audio encoding unit that encodes an audio signal and a side information encoding unit that calculates and encodes side information from a look-ahead signal. An audio signal receiving device for decoding an audio code and outputting an audio signal includes: an audio code buffer that detects packet loss based on a received state of an audio packet, an audio parameter decoding unit that decodes an audio code when an audio packet is correctly received, a side information decoding unit that decodes a side information code when an audio packet is correctly received, a side information accumulation unit that accumulates side information obtained by decoding a side information code, an audio parameter missing processing unit that outputs an audio parameter upon detection of audio packet loss, and an audio synthesis unit that synthesizes decoded audio from the audio parameter.

Abstract: Semiconductor device includes: semiconductor elements electrically connected in parallel; pad portion electrically connected to the semiconductor elements; and terminal portion electrically connected to the pad portion. As viewed in thickness direction, the semiconductor elements are aligned along first direction perpendicular to the thickness direction. The pad portion includes closed region surrounded by three line segments each formed by connecting two of first, second and third vertex not disposed on the same straight line. As viewed in thickness direction, the first vertex overlaps with one semiconductor element located in outermost position in first sense of the first direction. As viewed in the thickness direction, the second vertex overlaps with one semiconductor element located in outermost position in second sense of the first direction. As viewed in the thickness direction, the third vertex is located on perpendicular bisector of the line segment connecting the first and second vertex.

Abstract: Provided is a register that can more surely suppress abnormal noise caused by air passing through a space between a damper and a retainer. An inner wall of an upper side wall of the retainer is formed with a plurality of rib parts provided on a downstream side relative to an outer periphery on the downstream side of a plate member in a closed state of a damper. The plurality of rib parts is arranged in a direction parallel to a turning axis of the damper, and adjacent rib parts are formed into different shapes. A soft seal member is provided with a plurality of protrusion parts on an upper surface of the outer periphery on the downstream side of the plate member.

Abstract: An objective of the present invention is to correct a temporal envelope shape of a decoded signal with a small information volume and to reduce perceptible distortions.

Abstract: The purpose of the present invention is to reduce distortion a frequency band component encoded with a small number of bits in a time domain and improve quality. An audio decoding device (10) decodes an encoded audio signal and outputs the audio signal. A decoding unit (10a) decodes an encoded sequence containing an encoded audio signal and obtains a decoded signal. A selective temporal envelope shaping unit (10b) shapes a temporal envelope of a decoded signal in the frequency band on the basis of decoding related information concerning decoding of the encoded sequence.

Abstract: An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa·s or less at 140° C.; a temperature of 150° C. to 170° C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20° C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve.

Abstract: A semiconductor rectifier includes a transistor and a diode. The transistor includes a source electrode, a drain electrode and a gate electrode. The diode includes an anode electrode and a cathode electrode. The anode electrode is electrically connected to the gate electrode, and the cathode electrode is electrically connected to the source electrode.

Abstract: This semiconductor laser device comprises: a semiconductor laser element; a switching element connected in series to the semiconductor laser element, the switching element having a gate electrode, a drain electrode, and a source electrode; capacitors connected in parallel to the semiconductor laser element and the switching element; first drive electroconductive parts to which first terminals of the capacitors are connected; a second drive electroconductive part positioned apart from the first drive electroconductive parts; first drive connection members that connect the first drive electroconductive parts and the source electrode; and a second drive connection member that connects the second drive electroconductive part and the source electrode.

Abstract: The purpose of the present invention is to reduce distortion a frequency band component encoded with a small number of bits in a time domain and improve quality. An audio decoding device (10) decodes an encoded audio signal and outputs the audio signal. A decoding unit (10a) decodes an encoded sequence containing an encoded audio signal and obtains a decoded signal. A selective temporal envelope shaping unit (10b) shapes a temporal envelope of a decoded signal in the frequency band on the basis of decoding related information concerning decoding of the encoded sequence.