Patents by Inventor Atsushi Yamaguchi

Atsushi Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9603295
    Abstract: In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: March 21, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Atsushi Yamaguchi, Hisahiko Yoshida, Arata Kishi, Naomichi Ohashi
  • Patent number: 9589582
    Abstract: A PMR writer is disclosed wherein a hot seed layer (HS) made of a 19-24 kilogauss (kG) magnetic material is formed between a gap layer and a 10-16 kG magnetic layer in the side shields, and between the leading gap and a 16-19 kG magnetic layer in the leading shield to improve the track field gradient and cross-track field gradient while maintaining write-ability. The HS is from 10 to 100 nm thick and has a first side facing the write pole with a height of ?0.15 micron, and a second side facing a main pole flared side that may extend to a full side shield height of ?0.5 micron. The trailing shield has a second hot seed layer on the write gap and a 16-19 kG magnetic layer that contacts the 10-16 kG side shield magnetic layer thereby forming an all wrap around (AWA) shield configuration.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: March 7, 2017
    Assignees: Headway Technologies, Inc., TDK Corporation
    Inventors: Yue Liu, Atsushi Yamaguchi, Yuhui Tang, Jiun-Ting Lee, Yaguang Wei, Xiaomin Liu, Hideyuki Ukita, Moris Dovek, Michitaka Nishiyama
  • Patent number: 9577715
    Abstract: A resonance system that receives power from a power source section is configured by at least a primary resonance coil, a secondary resonance coil, and a load. The output frequency fo of the power source section is set to lie within one of the frequency ranges f1?fn?f2, f3?fo?f4, . . . , f2n-1?fo?f2n. The frequencies f1, f2, f3, f4, . . . , f2n-1, f2n (f1<f2<f3< . . . <f2n-1<f2n) are defined such that, if the input impedances of the resonant system at the time of supply of power of the frequencies f1, f2, f3, f4, . . . f2n-1, f2n (f1<f2<f3< . . . <f2n-1<f2n) to the resonant system are represented by Z1, Z2, Z3, . . . , Z2n-1, Z2n, the input impedances satisfy Z1=Z2, Z3=Z4, . . . , Z2n-1=Z2n.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: February 21, 2017
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Yuichi Taguchi, Atsushi Yamaguchi
  • Patent number: 9564668
    Abstract: A battery module joined to a joint body. Each heat transfer plate of the battery module has a sandwiched portion provided between adjacent battery cells and a joined portion. A first heat conductive layer that contacts a battery cell and has a first thickness is provided on the sandwiched portion of each heat transfer plate. A second heat conductive layer is provided on the facing surface of each heat transfer plate other than the heat transfer plate that is the closest to the joint body when the joined portion is joined to the joint body. The second heat conductive layer is configured to contact the joint body. The second heat conductive layer on the heat transfer plate that is the farthest from the joint body when the joined portion is joined to the joint body has a second thickness, which is greater than the first thickness.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: February 7, 2017
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Naoto Morisaku, Takayuki Kato, Shintaro Watanabe, Hidefumi Oishi, Takashi Sakai, Yuki Chujo, Hiromi Ueda, Kazuki Maeda, Hirohisa Kato, Tomonori Sasaki, Atsushi Yamaguchi
  • Patent number: 9564143
    Abstract: An audio signal transmission device for encoding an audio signal includes an audio encoding unit that encodes an audio signal and a side information encoding unit that calculates and encodes side information from a look-ahead signal. An audio signal receiving device for decoding an audio code and outputting an audio signal includes: an audio code buffer that detects packet loss based on a received state of an audio packet, an audio parameter decoding unit that decodes an audio code when an audio packet is correctly received, a side information decoding unit that decodes a side information code when an audio packet is correctly received, a side information accumulation unit that accumulates side information obtained by decoding a side information code, an audio parameter missing processing unit that outputs an audio parameter upon detection of audio packet loss, and an audio synthesis unit that synthesizes decoded audio from the audio parameter.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: February 7, 2017
    Assignee: NTT DOCOMO, INC.
    Inventors: Kimitaka Tsutsumi, Kei Kikuiri, Atsushi Yamaguchi
  • Publication number: 20170011911
    Abstract: A nitride semiconductor element capable of accommodating GaN electron transfer layers of a wide range of thickness, so as to allow greater freedom of device design, and a nitride semiconductor element package with excellent voltage tolerance performance and reliability. On a substrate, a buffer layer including an AlN layer, a first AlGaN layer and a second AlGaN layer is formed. On the buffer layer, an element action layer including a GaN electron transfer layer and an AlGaN electron supply layer is formed. Thus, an HEMT element is constituted.
    Type: Application
    Filed: September 21, 2016
    Publication date: January 12, 2017
    Applicant: ROHM CO., LTD.
    Inventors: Shinya TAKADO, Norikazu ITO, Atsushi YAMAGUCHI
  • Publication number: 20160352321
    Abstract: The gate drive circuit includes: a gate resistance RG1 connected to a gate G1 of a switching device Q1; and a gated diode DG1 connected in parallel to the gate resistance RG1, wherein a relationship of Vth(Di)<Vth(Tr) is satisfied, where Vth(Di) is a forward threshold voltage of the gated diode DG1, and Vth(Tr) is a threshold voltage of the switching device Q1. There is provided: a gate drive circuit having high speed switching performance in which a misoperation is suppressed and surge voltage is reduced; and a power supply mounted with such a gate drive circuit.
    Type: Application
    Filed: August 10, 2016
    Publication date: December 1, 2016
    Applicant: ROHM CO., LTD.
    Inventor: Atsushi YAMAGUCHI
  • Patent number: 9509216
    Abstract: A switching power supply circuit includes: a voltage generation circuit that generates an output voltage by smoothing, with a capacitor, a voltage produced in an inductor; an integration circuit that integrates a switching voltage to generate a first ripple voltage including a first ripple component; a feedback voltage generation circuit that divides the output voltage to generate a feedback voltage; a comparison circuit that compares the feedback voltage with a reference voltage to output the result of the comparison as a comparison result signal; an integration circuit that integrates the comparison result signal to generate a second ripple voltage including a second ripple component; and a drive circuit that controls the turning on and off of a switch element based on the comparison result signal, where the first ripple component and the second ripple component are added to the feedback voltage.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: November 29, 2016
    Assignee: Rohm Co., Ltd.
    Inventors: Atsushi Yamaguchi, Yohei Moriyama, Koki Sakamoto
  • Publication number: 20160329295
    Abstract: A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the surface of the circuit board, and the semiconductor package is mounted on the circuit board. The solder bonding part electrically connects the semiconductor package with the wiring. The resin reinforcing part is formed on a side surface of the solder bonding part such that the solder bonding part is partially exposed. The bonding part has a first solder region formed closer to the semiconductor package than the circuit board, and a second solder region formed closer to the circuit board than the semiconductor package.
    Type: Application
    Filed: July 9, 2015
    Publication date: November 10, 2016
    Inventors: Atsushi YAMAGUCHI, Yasuo FUKUHARA
  • Publication number: 20160320191
    Abstract: A fuel oil information providing server device acquires a reference fuel oil price at bunkering locations on a sailing route specified by a voyage ID input to a terminal device by a user or at which a ship is able to call from the sailing route, and data indicating conditions for correcting the reference fuel oil price, and specifies a fuel oil price obtained by correcting the reference fuel oil price indicated by the acquired data in accordance with the conditions. Fuel oil information providing server device generates display instruction data for instructing that a specified fuel oil price be displayed as a list along with determination rules for a bunkering amount at one or more bunkering locations, and outputs the data to a terminal device that displays information to be used for formulating a bunkering plan.
    Type: Application
    Filed: January 9, 2014
    Publication date: November 3, 2016
    Applicant: NIPPON YUSEN KABUSHIKI KAISHA
    Inventors: Atsushi YAMAGUCHI, Masaharu URABE, Yoshihiko MAEDA, Ryo KAKUTA
  • Publication number: 20160307586
    Abstract: A PMR writer is disclosed wherein a hot seed layer (HS) made of a 19-24 kilogauss (kG) magnetic material is formed between a gap layer and a 10-16 kG magnetic layer in the side shields, and between the leading gap and a 16-19 kG magnetic layer in the leading shield to improve Hy_grad and Hy_grad_x while maintaining write-ability. The HS is from 10 to 100 nm thick and has a first side facing the write pole with a height of ?0.15 micron, and a second side facing a main pole flared side that may extend to a full side shield height of ?0.5 micron. First and second sides may form a continuous curve or a double tapered design where first and second sides have different angles with respect to a center plane. The side shield design described herein is especially beneficial for side gaps of 20-60 nm.
    Type: Application
    Filed: May 23, 2016
    Publication date: October 20, 2016
    Inventors: Yue Liu, Atsushi Yamaguchi, Yuhui Tang, Jiun-Ting Lee, Yaguang Wei, Xiaomin Liu, Hideyuki Ukita, Moris Dovek, Michitaka Nishiyama
  • Patent number: 9472623
    Abstract: A nitride semiconductor element capable of accommodating GaN electron transfer layers of a wide range of thickness, so as to allow greater freedom of device design, and a nitride semiconductor element package with excellent voltage tolerance performance and reliability. On a substrate, a buffer layer including an AlN layer, a first AlGaN layer (with an average Al component of 50%) and a second AlGaN layer (with an average Al component of 20%) is formed. On the buffer layer, an element action layer including a GaN electron transfer layer and an AlGaN electron supply layer is formed. Thus, an HEMT element is constituted.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: October 18, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Shinya Takado, Norikazu Ito, Atsushi Yamaguchi
  • Publication number: 20160282125
    Abstract: A ship assignment device acquires voyage schedule information including an operation time schedule and a sailing route of a voyage. The ship assignment device acquires, from a database, weather information related to the operation time schedule and the sailing route included in the schedule information. The ship assignment device acquires information regarding variations in fuel consumption rate from a database that stores the information for each of plural ships. On the basis of the acquired weather information and acquired information regarding each ship, the ship assignment device calculates the fuel consumption for when each ship sails on the sailing route included in the acquired voyage schedule information in accordance with the operation time schedule included in the voyage schedule information. On the basis of the calculation result, the ship assignment device outputs information identifying plural ships.
    Type: Application
    Filed: May 28, 2013
    Publication date: September 29, 2016
    Applicant: NIPPON YUSEN KABUSHIKI KAISHA
    Inventors: Yuji OTSUKA, Atsushi YAMAGUCHI, Masaharu URABE, Ryo KAKUTA
  • Publication number: 20160284366
    Abstract: A magnetic head includes a main pole, a write shield and a gap section. The write shield includes a trailing shield, a leading shield and two side shields. The gap section includes a trailing gap section, a leading gap section and two side gap sections. Each of the two side gap sections and the leading gap section increases in thickness with increasing distance from a medium facing surface. In the medium facing surface, the thickness of the leading gap section is greater than the width of each of the two side gap sections, and the width of each of the two side gap sections decreases with decreasing distance to the leading gap section.
    Type: Application
    Filed: March 24, 2015
    Publication date: September 29, 2016
    Inventors: Atsushi YAMAGUCHI, Michitaka NISHIYAMA, Kei HIRATA, Kenkichi ANAGAWA
  • Publication number: 20160267399
    Abstract: An analysis device acquires various sorts of information related to a schedule of the voyage such as a ship name, a departure port name, a destination port name, names of ports of call between the departure port and the destination port, scheduled dates of arrival at each port on a sailing route of the voyage, scheduled dates of departure from each port on the sailing route, etc. The analysis device acquires from a first database a table containing dates of events that occur at ports on the sailing route indicated by the acquired information. The analysis device counts a number of days on which the time schedule of the voyage is affected by the events by use of the acquired information related to the schedule and the acquired table, and displays the counted number of days.
    Type: Application
    Filed: June 18, 2013
    Publication date: September 15, 2016
    Applicant: NIPPON YUSEN KABUSHIKI KAISHA
    Inventors: Kazuto KOYAMA, Atsushi YAMAGUCHI
  • Publication number: 20160265920
    Abstract: The present invention provides an arrangement for providing a bunkering plan (bunkering ports and bunkering amounts at the bunkering ports) that reduces fuel costs in a voyage of a ship. According to one embodiment of the present invention, if a bunkering plan that brings about a lower fuel costs according to the current bunkering plan occurs in accordance with the change in fuel price at a specific port, for example, for a ship that is being sailed, a user such as a ship operation manager is notified of this event. Accordingly, a user is able to know easily which bunkering plan is suitable.
    Type: Application
    Filed: October 31, 2013
    Publication date: September 15, 2016
    Applicant: NIPPON YUSEN KABUSHIKI KAISHA
    Inventors: Atsushi YAMAGUCHI, Masaharu URABE, Ryo KAKUTA
  • Publication number: 20160264750
    Abstract: A hollow polymer particle includes a structure body that contains a structure including (1) a core polymer formed by copolymerizing a monomer mixture (a) consisting of 20 to 60% by weight of an acid group-containing monomer and 80 to 40% by weight of another monomer that is copolymerizable with the acid group-containing monomer and (2) a shell polymer formed by copolymerizing a monomer mixture (b) consisting of 0 to 15% by weight of an acid group-containing monomer and 100 to 85% by weight of another monomer that is copolymerizable with the acid group-containing monomer so that the shell polymer substantially surrounding the core polymer. The structure body has at least one void formed by neutralization of at least one portion of an acid group contained in the core polymer. The hollow polymer particle is obtained by adding a preservative during a time period after formation of the core polymer and before formation of the shell polymer.
    Type: Application
    Filed: December 10, 2015
    Publication date: September 15, 2016
    Inventor: Atsushi YAMAGUCHI
  • Patent number: 9445458
    Abstract: An induction heating device includes: a resonant circuit provided with a coil heating a workpiece inductively and a capacitor, the coil and the capacitor being coupled in parallel with each other; a switching element coupled in series with the resonant circuit; a power supply which applies to the resonant circuit, a direct-current input voltage whose instantaneous value can be changed with the lapse of time; and a power controller which controls power to the workpiece by turning the switching element ON at a certain time and changing an ON period of the switching element, and the power controller is characterized by turning the switching element ON with a delay of an integral multiple of a resonant period of the resonant circuit if a value of power to the workpiece is equal to or lower than a first threshold which is predetermined.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: September 13, 2016
    Assignee: KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.
    Inventors: Seiichi Kirikubo, Atsushi Yamaguchi, Yutaka Yamamoto, Takahiro Tsujimoto, Hiroyuki Watanabe, Hidenori Mine, Masato Ishii
  • Publication number: 20160240202
    Abstract: An audio signal processing device comprises a discontinuity detector configured to determine an occurrence of a discontinuity from a sudden increase of an amplitude of decoded audio obtained by decoding the first audio packet which is received correctly after an occurrence of a packet loss, and a discontinuity corrector for correcting the discontinuity of the decoded audio.
    Type: Application
    Filed: April 28, 2016
    Publication date: August 18, 2016
    Inventors: Kimitaka TSUTSUMI, Kei KIKUIRI, Atsushi YAMAGUCHI
  • Publication number: 20160232261
    Abstract: A non-transitory computer-readable recording medium stores an analysis model adjustment program. The analysis model adjustment program makes a computer execute the following processes. The computer compares a first attribute value that indicates an operating point of a fan in a first analysis model that represents an apparatus that includes the fan with a second attribute value that indicates an operating point of the fan in a second analysis model that is more simplified than the first analysis model. Next, the computer changes an aperture ratio of the second analysis model according to a result of the comparing the first attribute value with the second attribute value.
    Type: Application
    Filed: January 20, 2016
    Publication date: August 11, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Hiroyuki Furuya, Akihiro Otsuka, Akira Ueda, Atsushi Yamaguchi