Patents by Inventor Audel A. Sanchez
Audel A. Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11343919Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.Type: GrantFiled: July 22, 2019Date of Patent: May 24, 2022Assignee: NXP USA, Inc.Inventors: Fernando A. Santos, Audel Sanchez, Lakshminarayan Viswanathan, Jerry Lynn White
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Publication number: 20210217685Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.Type: ApplicationFiled: March 26, 2021Publication date: July 15, 2021Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, JERRY LYNN WHITE, HAMDAN ISMAIL, FRANK DANAHER, DAVID JAMES DOUGHERTY, ARUNA MANOHARAN
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Patent number: 10998255Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.Type: GrantFiled: July 12, 2018Date of Patent: May 4, 2021Assignee: NXP USA, Inc.Inventors: Audel Sanchez, Jerry Lynn White, Hamdan Ismail, Frank Danaher, David James Dougherty, Aruna Manoharan
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Patent number: 10861774Abstract: Internally-shielded microelectronic packages having increased resistances to electromagnetic cross-coupling are disclosed, as are methods for fabricating such microelectronic packages. In embodiments, the internally-shielded microelectronic package includes a substrate having a frontside and a longitudinal axis. A first microelectronic device is mounted to the frontside of the substrate, while a second microelectronic device is further mounted to the frontside of the substrate and spaced from the first microelectronic device along the longitudinal axis. An internal shield structure includes or consists of a shield wall, which is positioned between the first and second microelectronic devices as taken along the longitudinal axis. The internal shield structure is at least partially composed of a magnetically-permeable material, which decreases electromagnetic cross-coupling between the first and second microelectronic devices during operation of the internally-shielded microelectronic package.Type: GrantFiled: March 12, 2020Date of Patent: December 8, 2020Assignee: NXP USA, Inc.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Vikas Shilimkar, Ramanujam Srinidhi Embar
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Publication number: 20200211932Abstract: Internally-shielded microelectronic packages having increased resistances to electromagnetic cross-coupling are disclosed, as are methods for fabricating such microelectronic packages. In embodiments, the internally-shielded microelectronic package includes a substrate having a frontside and a longitudinal axis. A first microelectronic device is mounted to the frontside of the substrate, while a second microelectronic device is further mounted to the frontside of the substrate and spaced from the first microelectronic device along the longitudinal axis. An internal shield structure includes or consists of a shield wall, which is positioned between the first and second microelectronic devices as taken along the longitudinal axis. The internal shield structure is at least partially composed of a magnetically-permeable material, which decreases electromagnetic cross-coupling between the first and second microelectronic devices during operation of the internally-shielded microelectronic package.Type: ApplicationFiled: March 12, 2020Publication date: July 2, 2020Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, VIKAS SHILIMKAR, RAMANUJAM SRINIDHI EMBAR
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Patent number: 10629518Abstract: Internally-shielded microelectronic packages having increased resistances to electromagnetic cross-coupling are disclosed, as are methods for fabricating such microelectronic packages. In embodiments, the internally-shielded microelectronic package includes a substrate having a frontside and a longitudinal axis. A first microelectronic device is mounted to the frontside of the substrate, while a second microelectronic device is further mounted to the frontside of the substrate and spaced from the first microelectronic device along the longitudinal axis. An internal shield structure includes or consists of a shield wall, which is positioned between the first and second microelectronic devices as taken along the longitudinal axis. The internal shield structure is at least partially composed of a magnetically-permeable material, which decreases electromagnetic cross-coupling between the first and second microelectronic devices during operation of the internally-shielded microelectronic package.Type: GrantFiled: August 29, 2018Date of Patent: April 21, 2020Assignee: NXP USA, Inc.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Vikas Shilimkar, Ramanujam Srinidhi Embar
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Publication number: 20200075463Abstract: Internally-shielded microelectronic packages having increased resistances to electromagnetic cross-coupling are disclosed, as are methods for fabricating such microelectronic packages. In embodiments, the internally-shielded microelectronic package includes a substrate having a frontside and a longitudinal axis. A first microelectronic device is mounted to the frontside of the substrate, while a second microelectronic device is further mounted to the frontside of the substrate and spaced from the first microelectronic device along the longitudinal axis. An internal shield structure includes or consists of a shield wall, which is positioned between the first and second microelectronic devices as taken along the longitudinal axis. The internal shield structure is at least partially composed of a magnetically-permeable material, which decreases electromagnetic cross-coupling between the first and second microelectronic devices during operation of the internally-shielded microelectronic package.Type: ApplicationFiled: August 29, 2018Publication date: March 5, 2020Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, VIKAS SHILIMKAR, RAMANUJAM SRINIDHI EMBAR
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Publication number: 20200020614Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.Type: ApplicationFiled: July 12, 2018Publication date: January 16, 2020Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, JERRY LYNN WHITE, HAMDAN ISMAIL, FRANK DANAHER, DAVID JAMES DOUGHERTY, ARUNA MANOHARAN
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Patent number: 10529638Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.Type: GrantFiled: December 5, 2018Date of Patent: January 7, 2020Assignee: NXP USA, Inc.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla
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Publication number: 20190343005Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.Type: ApplicationFiled: July 22, 2019Publication date: November 7, 2019Inventors: Fernando A. Santos, Audel Sanchez, Lakshminarayan Viswanathan, Jerry Lynn White
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Patent number: 10396006Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange, retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside, and retention tabs having openings through which the retention posts are received. A molded package body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts may be staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.Type: GrantFiled: October 18, 2018Date of Patent: August 27, 2019Assignee: NXP USA, Inc.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla
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Patent number: 10375833Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.Type: GrantFiled: May 24, 2018Date of Patent: August 6, 2019Assignee: NXP USA, Inc.Inventors: Lakshminarayan Viswanathan, Audel A. Sanchez, Fernando A. Santos, Jerry L. White
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Publication number: 20190109060Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, FERNANDO A. SANTOS, JAYNAL A. MOLLA
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Patent number: 10241151Abstract: A die crack detector and method are provided. A first metal trace is formed over a substrate with the first metal trace configured to extend around a perimeter of a semiconductor die. A second metal trace is formed over the first metal trace with the second metal trace configured to overlap the first metal trace. A dielectric material is disposed between the first and second metal traces. A first detector terminal is coupled to the first metal trace and a second detector terminal coupled to the second metal trace. The detector terminals are configured to receive a predetermined voltage.Type: GrantFiled: July 26, 2017Date of Patent: March 26, 2019Assignee: NXP USA, INC.Inventors: Audel Sanchez, Jose Luis Suarez, Michele Lynn Miera
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Publication number: 20190051571Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange, retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside, and retention tabs having openings through which the retention posts are received. A molded package body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts may be staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.Type: ApplicationFiled: October 18, 2018Publication date: February 14, 2019Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, FERNANDO A. SANTOS, JAYNAL A. MOLLA
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Publication number: 20190043775Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.Type: ApplicationFiled: August 7, 2017Publication date: February 7, 2019Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, FERNANDO A. SANTOS, JAYNAL A. MOLLA
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Publication number: 20190043774Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange, retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside, and retention tabs having openings through which the retention posts are received. A molded package body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts may be staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.Type: ApplicationFiled: August 7, 2017Publication date: February 7, 2019Applicant: NXP USA, INC.Inventors: AUDEL SANCHEZ, LAKSHMINARAYAN VISWANATHAN, FERNANDO A. SANTOS, JAYNAL A. MOLLA
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Patent number: 10199303Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.Type: GrantFiled: August 7, 2017Date of Patent: February 5, 2019Assignee: NXP USA, INC.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla
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Patent number: 10199302Abstract: Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange, retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside, and retention tabs having openings through which the retention posts are received. A molded package body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts may be staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.Type: GrantFiled: August 7, 2017Date of Patent: February 5, 2019Assignee: NXP USA, INC.Inventors: Audel Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla
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Publication number: 20190033365Abstract: A die crack detector and method are provided. A first metal trace is formed over a substrate with the first metal trace configured to extend around a perimeter of a semiconductor die. A second metal trace is formed over the first metal trace with the second metal trace configured to overlap the first metal trace. A dielectric material is disposed between the first and second metal traces. A first detector terminal is coupled to the first metal trace and a second detector terminal coupled to the second metal trace. The detector terminals are configured to receive a predetermined voltage.Type: ApplicationFiled: July 26, 2017Publication date: January 31, 2019Inventors: AUDEL SANCHEZ, Jose Luis Suarez, Michele Lynn Miera