Patents by Inventor Aurelio J. Gutierrez
Aurelio J. Gutierrez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140377996Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.Type: ApplicationFiled: June 30, 2014Publication date: December 25, 2014Inventors: Victor H. Renteria, Aurelio J. Gutierrez, William Mahlerbe, Gary L. Hurd, Russell L. Machado
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Patent number: 8860543Abstract: A wire-less inductive device and methods of manufacturing and use are disclosed. In one embodiment, the inductive device comprises a plurality of through-hole vias which act to replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a plurality of connection elements disposed or formed within channels which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices is disclosed. In a third aspect of the invention, an electronics assembly and circuit comprising the wire-less inductive devices are disclosed.Type: GrantFiled: November 13, 2007Date of Patent: October 14, 2014Assignee: Pulse Electronics, Inc.Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez
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Patent number: 8845367Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.Type: GrantFiled: July 29, 2013Date of Patent: September 30, 2014Assignee: Pulse Electronics, Inc.Inventors: Aurelio J. Gutierrez, Russell L. Machado, Christopher P. Schaffer, Victor H. Renteria
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Patent number: 8764493Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.Type: GrantFiled: April 2, 2012Date of Patent: July 1, 2014Assignee: Pulse Electronics, Inc.Inventors: Victor H. Renteria, Aurelio J. Gutierrez, William Mahlerbe, Gary L. Hurd, Russell L. Machado
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Patent number: 8754734Abstract: A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.Type: GrantFiled: February 8, 2011Date of Patent: June 17, 2014Assignee: Pulse Electronics, Inc.Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez
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Publication number: 20140036459Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.Type: ApplicationFiled: July 29, 2013Publication date: February 6, 2014Inventors: Aurelio J. Gutierrez, Russell L. Machado, Christopher P. Schaffer, Victor H. Renteria
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Publication number: 20130323974Abstract: Low-cost and high-precision inductive devices and methods of manufacturing and using the same. In one embodiment, the inductive device comprises a substrate-based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations, these substrate-based inductive devices are integrated into a discrete electronic device. In another embodiment, the substrate-based inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned discrete substrate-based inductive devices and substrate-based integrated connector modules are also disclosed.Type: ApplicationFiled: May 21, 2013Publication date: December 5, 2013Inventors: Aurelio J. Gutierrez, Christopher P. Schaffer
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Patent number: 8591262Abstract: Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.Type: GrantFiled: September 3, 2010Date of Patent: November 26, 2013Assignee: Pulse Electronics, Inc.Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez
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Patent number: 8496499Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.Type: GrantFiled: April 5, 2006Date of Patent: July 30, 2013Assignee: Pulse Electronics, Inc.Inventors: Aurelio J. Gutierrez, Russell L. Machado, Chris Schaffer, Victor H. Renteria
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Publication number: 20130033353Abstract: Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.Type: ApplicationFiled: August 6, 2012Publication date: February 7, 2013Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez, Alan Lindner
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Publication number: 20120196456Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.Type: ApplicationFiled: April 2, 2012Publication date: August 2, 2012Inventors: Victor H. Renteria, Aurelio J. Gutierrez, William Mahlerbe, Gary L. Hurd, Russell L. Machado
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Patent number: 8147278Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.Type: GrantFiled: February 28, 2008Date of Patent: April 3, 2012Assignee: Pulse Electronics, Inc.Inventors: Victor H. Renteria, Aurelio J. Gutierrez, William Mahlerbe, Gary L. Hurd, Russell L. Machado
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Publication number: 20120058676Abstract: Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.Type: ApplicationFiled: September 3, 2010Publication date: March 8, 2012Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez
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Publication number: 20110193669Abstract: A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.Type: ApplicationFiled: February 8, 2011Publication date: August 11, 2011Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez
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Patent number: 7982572Abstract: Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.Type: GrantFiled: July 15, 2009Date of Patent: July 19, 2011Assignee: Pulse Engineering, Inc.Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez, Alan Lindner
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Patent number: 7942700Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.Type: GrantFiled: May 10, 2010Date of Patent: May 17, 2011Assignee: Pulse Engineering, Inc.Inventors: Aurelio J. Gutierrez, Russell L. Machado, Christopher P. Schaffer, Victor H. Renteria
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Publication number: 20100284160Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.Type: ApplicationFiled: May 10, 2010Publication date: November 11, 2010Inventors: Aurelio J. Gutierrez, Russell L. Machado, Christopher P. Schaffer, Victor H. Renteria
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Publication number: 20100013589Abstract: Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.Type: ApplicationFiled: July 15, 2009Publication date: January 21, 2010Inventors: Christopher P. Schaffer, Aurelio J. Gutierrez, Alan Lindner
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Patent number: 7524206Abstract: An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.Type: GrantFiled: March 22, 2006Date of Patent: April 28, 2009Assignee: Pulse Engineering, Inc.Inventors: Aurelio J. Gutierrez, Victor H. Renteria, Russell L. Machado, Chris Schaffer, Henry Hinrichs
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Publication number: 20080233803Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.Type: ApplicationFiled: February 28, 2008Publication date: September 25, 2008Inventors: Victor H. Renteria, Aurelio J. Gutierrez, William Mahlerbe, Gary L. Hurd, Russell L. Machado