Abstract: A Rack Information Handling System (RIHS) has a liquid cooling subsystem that provides cooling liquid to liquid cooled (LC) nodes received in chassis-receiving bays of a rack. Leak collection structures are positioned to receive cooling liquid that leaks from the liquid cooling subsystem. Liquid sensors detect a presence of leaked cooling liquid in the leak collection structures. A leak detection subsystem responds to a detected presence of liquid by providing a leak indication. In one or more embodiments, the liquid cooling subsystem has a liquid rail formed by more than one rack interconnections vertically aligned in a rear section of the rack that are connected by modular rail conduits for node-to-node fluid transfer. The leak collection structures include a pipe cover received over at least one modular rail conduit. A liquid cavity of each pipe cover spills over into another lower pipe cover at a rate that can be correlated to severity of the leak.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: An airflow control system includes a chassis defining a chassis housing that includes at least one airflow inlet and an airflow outlet. A cooled device is located in the chassis housing between the at least one airflow inlet and the airflow outlet. A convection enhancing heat element is located in the chassis housing between the cooled device and the airflow outlet. A controller is coupled to the convection enhancing heat element and configured to activate the convection enhancing heat element such that a convective airflow through the chassis housing is increased.

Abstract: A method provides a service mode within a direct-injection liquid-cooled (DL) Rack Information Handling System (RIHS) having at least one liquid-cooled (LC) node. The method includes: in response to detecting selection of the service mode trigger, transmitting a first control signal to cause a proportional valve to move to an open position for enhanced cooling of the node; monitoring a temperature being sensed in the node; and in response to the temperature reaching a pre-established service mode temperature: forwarding a second control signal, to cause the proportional valve to move to a fully closed position; and generating a notification of an entry of the RIHS into a service mode during which an LC node can be re-engaged with the supply and return port, without affecting an operational on-state of the RIHS and without incurring significant hydraulic pressure when re-engaging the LC node with the liquid cooling system.

Abstract: A system for heat exchange includes a first condenser that places a first working fluid vapor in proximity to a second working fluid liquid. The two working fluids have respective saturation temperatures that enable the second working fluid to absorb sufficient amounts of heat from the first working fluid vapor to vaporize, while the first working fluid vapor condenses back into a liquid. The second working fluid vapor exits the first condenser via a first conduit and enters a first heat exchanger which places the second working fluid vapor in proximity to a third working fluid. The relative saturation temperatures of the second and third working fluids enables the transfer of sufficient amounts of heat from the second working fluid vapor to cause the second working fluid vapor to condense back into liquid while at least a portion of the third working fluid liquid vaporizes into third working fluid vapor.

Abstract: An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port.

Abstract: A rack-based information handling system (IHS) includes a rack having a modular structure that supports insertion of different numbers and sizes of information technology (IT) gear to create one or more IT nodes. A fan bay module is attached to the rack and supports insertion of multiple different fan configurations in more than one fan receptacle. At least one fan is inserted within corresponding at least one fan receptacle of the fan bay module to conform to at least a first fan configuration. A block controller is configurable to control each of the different fan configurations and which, in response to detecting the first fan configuration of the at least one fan inserted within the fan bay module, activates a corresponding first control algorithm that enables the detected first fan configuration to be utilized to provide rack-level cooling for one or more of the IT nodes inserted within the rack.

Abstract: A liquid handling (LH) block of an Information Handling System (IHS) having a first transfer conduit having node-receiving intake port/s sealably engaged for fluid transfer to node intake port/s of Liquid Cooled (LC) node/s and having supply connection/s. A second transfer conduit has node-receiving outlet port/s sealably engaged for fluid transfer to LC node output port/s of the LC node/s and having return connection/s. A radiator includes a portion of the second transfer conduit. A cooling liquid distribution subsystem has a user selectable first and second sets of liquid conduits connectable to the module in one of an open-loop configuration utilizing facility supplied cooling liquid and a closed-loop configuration to recirculate cooling liquid between the block radiator and the node-level system of conduits.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: Systems and methods for component population optimization are described. In some embodiments, an Information Handling System (IHS) may include a logic circuit and a memory coupled to the logic circuit, the memory having information stored thereon that, upon access by the logic circuit, enable the IHS to: identify a connector provided on a Printed Circuit Board (PCB), wherein the connector is configured to receive a device and to couple the device to a processor; and visually indicate a status of the connector.

Abstract: A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.

Abstract: In accordance with embodiments of the present disclosure, an apparatus for minimizing heat transfer may include a first member substantially planar in shape, a second member substantially planar in shape and substantially perpendicular to the first member, and a gasket mechanically coupling the first member to the second member. The apparatus may be formed such that the first member, second member, and the gasket define a plenum wherein the first member, the second member, and the gasket prevent transfer of fluid between an interior and exterior of the plenum.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: A pressure control system within a multi-phase heat transfer immersion cooling tank includes: a differential pressure transducer that measures a differential pressure between a first vapor pressure internal to the immersion cooling tank and a second pressure outside of the immersion cooling tank; and a condenser inflow valve assembly that controls a flow rate of condensation liquid within the condenser located within the immersion tank. The pressure control system also includes a controller coupled to both the differential pressure transducer and the condenser inflow valve assembly having control logic that, in response to the measured differential pressure exceeding a pre-set threshold difference, triggers the condenser inflow valve assembly to increase a flow rate of the condensation fluid in order to reduce an amount of vapor within the immersion tank and bring the measured differential pressure back to below the threshold difference.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: A method of manufacturing a chassis that cools thermal energy generating components of an information handling system (IHS) includes: forming an enclosure with a chassis that has a base wall for provisioning a thermal energy generating component; forming one or more stiffeners each having one or more air channels formed transversely through for directing air proximate to the base wall; attaching the one or more stiffeners laterally across the base wall; and attaching a planar member that is horizontally on top of the one or more stiffeners for engaging one or more forward compute components on top of the planar member that substantially block air flow above the planar member to the thermal energy generating component. The one or more air channels eliminate thermal shadowing caused by thermal energy generating components provisioned in a rear area of the chassis.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: A system for cooling hard disk drives (HDDs) includes: an enclosure having (i) a lower volume within which a cooling liquid is heated to a boiling point to cause some of the cooling liquid to evaporate, creating a plume of rising vapor and (ii) an upper volume having (a) a HDD cooling area with HDD(s) placed in the direct path of the rising vapor, which cools the HDD(s) during functional operation of the HDD(s) and (b) a condenser located above the HDD cooling area and which cools a substantial portion of the rising vapor that impacts the condenser within the upper volume such that the rising vapor condenses back into liquid phase on contact with the condenser; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature.

Abstract: An airflow control system includes a chassis defining a chassis housing that includes at least one airflow inlet and an airflow outlet. A cooled device is located in the chassis housing between the at least one airflow inlet and the airflow outlet. A convection enhancing heat element is located in the chassis housing between the cooled device and the airflow outlet. A controller is coupled to the convection enhancing heat element and configured to activate the convection enhancing heat element such that a convective airflow through the chassis housing is increased.

Abstract: A chassis directs cooling air around compute components of an information handling system (IHS). The chassis includes an enclosure having a base wall, an air intake at a front side, and an air exhaust at a rear side. Stiffeners are attached laterally across the base wall and positioned between the front side and a rear area of the base wall. A planar member is horizontally attached on top of the one or more stiffeners. The planar member is provisioned with the compute components, which substantially block air flow above the planar member causing thermal shadowing of the thermal energy generating component that is provisioned in the rear area. Air channels formed through each of the stiffeners direct air flow under the planar member toward the rear area that is provisioned with the thermal energy generating component.