Abstract: An apparatus for cooling an information handling system has at least one component requiring cooling. The apparatus includes a heat reservoir configured to be coupled to a chassis of the information handling system containing the component requiring cooling. A fluid reservoir is defined within the heat reservoir. A thermal fluid is disposed within the heat reservoir. A thermal conduit has a first end and a second end. The first end of the thermal conduit is coupled to the heat reservoir such that the thermal conduit is in thermal communication with the thermal fluid and the second end is coupled to the component requiring cooling such that the thermal conduit is in thermal communication with the component requiring cooling.

Abstract: An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs.

Abstract: A method that controls pressure within an immersion cooling tank having condensation fluid flowing through a condenser, includes: a controller receiving a signal that indicates a current level of vapor pressure within the tank; determining from the signal when the current level of vapor pressure exceeds or is below a first preset threshold pressure level; and in response to the current level of vapor pressure exceeding or being below the first preset threshold pressure level, signaling a flow control mechanism that modulates a flow rate of the condensation fluid through the condenser to increase or decrease the rate of flow from a current rate of flow. The controller receives the signal by a pressure sensor within the immersion cooling tank detecting the current vapor pressure, generating the signal and forwarding the signal to the controller. The pressure sensor can be a differential pressure transducer that measures a differential pressure internal to and outside of the immersion tank.

Abstract: In accordance with embodiments of the present disclosure, an apparatus for minimizing heat transfer may include a first member substantially planar in shape, a second member substantially planar in shape and substantially perpendicular to the first member, and a gasket mechanically coupling the first member to the second member. The apparatus may be formed such that the first member, second member, and the gasket define a plenum wherein the first member, the second member, and the gasket prevent transfer of fluid between an interior and exterior of the plenum.

Abstract: A system for cooling hard disk drives (HDDs) includes: an enclosure having (i) a lower volume within which a cooling liquid is heated to a boiling point to cause some of the cooling liquid to evaporate, creating a plume of rising vapor and (ii) an upper volume having (a) a HDD cooling area with HDD(s) placed in the direct path of the rising vapor, which cools the HDD(s) during functional operation of the HDD(s) and (b) a condenser located above the HDD cooling area and which cools a substantial portion of the rising vapor that impacts the condenser within the upper volume such that the rising vapor condenses back into liquid phase on contact with the condenser; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: A chassis directs cooling air around compute components of an information handling system (IHS). The chassis includes an enclosure having a base wall, an air intake at a front side, and an air exhaust at a rear side. Stiffeners are attached laterally across the base wall and positioned between the front side and a rear area of the base wall. A planar member is horizontally attached on top of the one or more stiffeners. The planar member is provisioned with the compute components, which substantially block air flow above the planar member causing thermal shadowing of the thermal energy generating component that is provisioned in the rear area. Air channels formed through each of the stiffeners direct air flow under the planar member toward the rear area that is provisioned with the thermal energy generating component.

Abstract: A method for cooling components of an information handling system (IHS) includes detecting, via a thermal control system, at least one pressure reading, at least one temperature reading and at least one current cooling device setting of the IHS. At least one new cooling device setting is calculated based on the pressure reading and the temperature reading. The new cooling device setting is compared to the current cooling device setting associated with one or more cooling devices of the IHS. In response to the new cooling device setting being different from the current cooling device setting, one or more of the corresponding cooling devices are triggered to adjust its/their current cooling device setting to the new cooling device setting corresponding to the respective cooling device.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: A fluid level control system includes: a first immersion cooling tank having a first volume of immersion cooling liquid and an inlet/outlet pipe extending from a base wall of the tank by which immersion cooling liquid can flow into and out of the first immersion cooling tank; at least one second volume of cooling liquid held within a liquid containing unit having a corresponding inlet/outlet pipe; and a pipe distribution system that physically connects the second volume of immersion cooling liquid to the first volume of immersion cooling liquid via respective inlet/outlet pipes and which enables fluid equilibrium to be maintained between the first volume of liquid and the second volume of liquid via gravitational equilibrium and/or passive level control such that a first volume level of the first volume of immersion cooling liquid remains substantially equal to a second volume level of the second volume of immersion cooling liquid.

Abstract: A system for cooling hard disk drives (HDDs) includes: an enclosure having a lower volume within which a cooling liquid is heated to a boiling point temperature to cause some of the cooling liquid to evaporate into a plume of rising vapor; a HDD cooling area with at least one HDD placed in the direct path of the rising vapor, which cools the at least one HDD during functional operation of the at least one HDD; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature. The system can also include a condenser located above both the HDD cooling area. A substantial portion of the rising vapor that passes through the HDD cooling area and cools the at least one HDD is condensed back into liquid phase on contact with the condenser.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink.

Abstract: An information handling system (IHS) has a server chassis assembly including a server chassis with a cold air inlet and a hot air exhaust and provisioned with compute components that are series aligned. A ducting structure positioned in the server chassis defines a cold air plenum in fluid communication with the cold air inlet and a hot air plenum in fluid communication with the hot air exhaust. A shroud of the ducting structure separates the cold air plenum and the hot air plenum. Air drops are provided longitudinally along the shroud corresponding respectively to the respective compute components being cooled. The air drops are each in fluid communication between the cold air plenum and the hot air plenum. Hot air from one compute component is routed directly to the hot air plenum away from other compute components.

Abstract: An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Abstract: A method and an information handling system for selecting or scaling system performance. The method of scaling performance of an information handling system includes a controller receiving component data that identifies a heat removal effectiveness of a cooling component, selecting a performance characteristics of the information handling system based on the received component data, and adjusting the operating parameters of the information system to achieve the selected performance characteristics and heat removal capability. The controller communicates with the cooling component through a serial signal bus. The cooling component includes a cooling device and storage.

Abstract: An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs.

Abstract: An immersion server includes: a first surface that is exposed when the server is submerged within a cooling liquid; and at least one vapor bubble deflector physically abutting the first surface and extending away from the first surface at an angle. The deflector divides the first surface into an upper segment and a lower segment when the server is upright. When the server is submerged, the cooling liquid surrounding the lower segment absorbs sufficient heat to evaporate and generate vapor bubbles rising to the liquid surface. The vapor bubble deflector deflects the rising vapor bubbles away from the surface of the upper segment. This enables superior liquid contact with heat dissipating components at the upper segment and better cooling of those components. The deflector can be a device-level deflector separating two or more components or a component-level deflector separating a lower segment from an upper segment of a single component.

Abstract: An immersion cooling tank comprises: a dielectric liquid disposed within a lower volume of the tank; at least one electronic equipment immersed within the dielectric liquid and which requires electrical power to operate; and at least one power distribution unit and/or a bus bar distribution system submerged beneath a surface of the dielectric liquid and providing electrical power to the at least one electronic equipment. The immersion cooling tank further includes a condenser located vertically above the dielectric fluid and the at least one electronic equipment, and through which is flowing a condensation fluid that has a lower density than the dielectric liquid. A leak of the condensation fluid into the tank volume results in the condensation fluid floating atop the dielectric liquid and prevents the condensation liquid from coming into contact with the power distribution unit. The bus bar distribution system enables blind mating of inserted electronic components.