Patents by Inventor Avinash Rajagiri

Avinash Rajagiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10324859
    Abstract: Certain apparatuses, systems, methods, and computer program products are used for multi-plane memory management. An apparatus includes a failure detection circuit that detects a failure of a storage element during an operation. An apparatus includes a test circuit that performs a test on a storage element. An apparatus includes a recycle circuit that enables a portion of a storage element for use in operations in response to the portion of the storage element passing a test.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: June 18, 2019
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Daniel Joseph Linnen, Ashish Ghai, Dongxiang Liao, Srikar Peesari, Avinash Rajagiri, Philip Reusswig, Bin Wu
  • Patent number: 10290354
    Abstract: A partial memory die is missing one or more components. One example of a partial memory die includes an incomplete memory structure such that the partial memory die is configured to successfully perform programming, erasing and reading of the incomplete memory structure.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: May 14, 2019
    Assignee: SanDisk Technologies LLC
    Inventors: Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Avinash Rajagiri, Shantanu Gupta, Jagdish Sabde, Ashish Ghai, Deepak Bharadwaj, Sukhminder Singh Lobana, Shrikar Bhagath
  • Publication number: 20190129861
    Abstract: A partial memory die comprises a memory structure that includes a first plane of non-volatile memory cells and a second plane of non-volatile memory cells. The second plane of non-volatile memory cells is incomplete. A first buffer is connected to the first plane. A second buffer is connected to the second plane. A data path circuit is connected to an input interface, the first buffer and the second buffer. The data path circuit is configured to map data received at the input interface and route the mapped data to either the first buffer or the second buffer. An inter-plane re-mapping circuit is connected to the first buffer and the second buffer, and is configured to re-map data from the first buffer and store the re-mapped data in the second buffer for programming into the second plane.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 2, 2019
    Applicant: SANDISK TECHNOLOGIES LLC
    Inventors: Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Avinash Rajagiri, Shantanu Gupta, Jagdish Sabde, Ashish Ghai, Deepak Bharadwaj
  • Publication number: 20190130978
    Abstract: A partial memory die is missing one or more components. One example of a partial memory die includes an incomplete memory structure such that the partial memory die is configured to successfully perform programming, erasing and reading of the incomplete memory structure.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 2, 2019
    Applicant: SANDISK TECHNOLOGIES LLC
    Inventors: Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Avinash Rajagiri, Shantanu Gupta, Jagdish Sabde, Ashish Ghai, Deepak Bharadwaj, Sukhminder Singh Lobana, Shrikar Bhagath
  • Patent number: 10242750
    Abstract: Techniques are presented for testing the high-speed data path between the IO pads and the read/write buffer of a memory circuit without the use of an external test device. In an on-chip process, a data test pattern is transferred at a high data rate between the read/write register and a source for the test pattern, such as register for this purpose or the read/write buffer of another plane. The test data after the high-speed transfer is then checked against its expected, uncorrupted value, such as by transferring it back at a lower speed for comparison or by transferring the test data a second time, but at a lower rate, and comparing the high transfer rate copy with the lower transfer rate copy at the receiving end of the transfers.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: March 26, 2019
    Assignee: SanDisk Technologies LLC
    Inventors: Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Shantanu Gupta, Avinash Rajagiri, Dongxiang Liao, Jagdish Sabde, Rajan Paudel
  • Publication number: 20180373644
    Abstract: Apparatuses, systems, methods, and computer program products are disclosed for multi-plane memory management. An apparatus includes a failure detection circuit that detects a failure of a storage element during an operation. An apparatus includes a test circuit that performs a test on a storage element. An apparatus includes a recycle circuit that enables a portion of a storage element for use in operations in response to the portion of the storage element passing a test.
    Type: Application
    Filed: June 26, 2017
    Publication date: December 27, 2018
    Applicant: Western Digital Technologies, Inc.
    Inventors: Daniel Joseph Linnen, Ashish Ghai, Dongxiang Liao, Srikar Peesari, Avinash Rajagiri, Philip Reusswig, Bin Wu
  • Publication number: 20180350445
    Abstract: Techniques are presented for testing the high-speed data path between the IO pads and the read/write buffer of a memory circuit without the use of an external test device. In an on-chip process, a data test pattern is transferred at a high data rate between the read/write register and a source for the test pattern, such as register for this purpose or the read/write buffer of another plane. The test data after the high-speed transfer is then checked against its expected, uncorrupted value, such as by transferring it back at a lower speed for comparison or by transferring the test data a second time, but at a lower rate, and comparing the high transfer rate copy with the lower transfer rate copy at the receiving end of the transfers.
    Type: Application
    Filed: May 31, 2017
    Publication date: December 6, 2018
    Applicant: SANDISK TECHNOLOGIES LLC
    Inventors: Daniel Linnen, Srikar Peesari, Kirubakaran Periyannan, Shantanu Gupta, Avinash Rajagiri, Dongxiang Liao, Jagdish Sabde, Rajan Paudel