Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.

Abstract: Methods for bonding semiconductor surfaces leverage hybrid bonding processes to enable heterogeneous integration architectures. In some embodiments, the methods may comprise forming a semiconductor structure on a silicon-based substrate with a first set of exposed conductive connections on a top surface of the semiconductor structure. The first set of exposed conductive connections having a pitch of less than approximately 10 microns. Forming an advanced rectangular substrate panel with a second set of exposed conductive connections. The second set of exposed conductive connections having a pitch of less than approximately 10 microns. Bonding a top surface of the semiconductor structure to a top surface of the advanced rectangular substrate panel using a hybrid bonding process to bond the semiconductor structure to the advanced rectangular substrate panel.

Abstract: A transparent plastic container comprising an aqueous liquid laundry detergent composition wherein the liquid detergent composition comprises: from 5 to 60 wt. % of surfactant; and from of 0.0005 to 0.01 wt. % of an amylase and/or from 0.0005 to 0.01 wt. % of a protease; and from 0.00005 to 0.02 wt. % of a dye comprising an anthraquinone chromophore which contains an amine group or an acid amide group in the 1-position of the anthraquinone ring; and wherein the container has an internal volume of from 0.1 to 10 L.

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.

Abstract: The present invention relates to a child safe packaged-product system with multi-operational access control. The invention further relates to packaged-product system that facilitates interaction with the user so as to render child safe state of the package after use. The synergistic operational combination of the said package holding provision, package fixing provision, an assembly of the package and package fixing provision operably connected by the said restrictive means results in a multi-operational access control to access the package after the completion of the child resistant activity obviating the problem of package access as a part of the child resistant activity. Further provision of the said means to remind/alert user of reengaging/repositioning the package in the child-safe state after use renders child resistant state to the package after use enhancing the effectiveness of the child resistant function of the package.

Abstract: The present invention relates to a one piece re-closable unit pack comprising a first layered structure (1) wherein one or plurality of containment(s) (2) are formed to contain product(s) wherein the said containment(s) (2) up stand from first surface of the said first layered structure (1) thereby creating one or plurality of corresponding opening/s on the second surface of the said first layered structure, a second layered structure (3) affixed to the unformed region of the second surface of the first layered structure (1) wherein portion of the second layered structure (3) corresponding to the opening of the containment(s) (2) is ruptured to remove the product, at least one portion (10) comprising the containment(s) (2) wherein the region (4) between the said portions (10, 20) is foldable; optionally one or plurality of unformed portion/s, optionally constructed to provide child resistant capability and/or unique identifiers to authenticate a packaged product.

Abstract: The present invention relates to a child safe packaged-product system with multi-operational access control. The invention further relates to packaged-product system that facilitates interaction with the user so as to render child safe state of the package after use. The synergistic operational combination of the said package holding provision, package fixing provision, an assembly of the package and package fixing provision operably connected by the said restrictive means results in a multi-operational access control to access the package after the completion of the child resistant activity obviating the problem of package access as a part of the child resistant activity. Further provision of the said means to remind/alert user of reengaging/repositioning the package in the child-safe state after use renders child resistant state to the package after use enhancing the effectiveness of the child resistant function of the package.

Abstract: The present invention relates to a child access restricted/child safe packaged-product system. The invention further relates to child resistant closures for packaged-product. The synergistic combination of a closure means provided with engaging provisions adapted to removably receive and engage package wherein combination of multiple operations is necessary to access the product by disengaging the package from the said closure provides child access restricted/child safe packaged-product system. The system comprises of a closure means provided with engaging member/s adapted to removably receive and engage a package wherein combination of multiple operation is necessary to access the product by disengaging the package from the said closure. The package is provided with a provision to removably receive the said engaging member/s.