Abstract: The present invention is a surface treatment composition which is supplied as vapor to the surface of a wafer having an uneven pattern on the surface and is used for forming a water-repellent protective film on the surface, the surface treatment composition including a silylating agent and a solvent, in which the silylating agent includes a silicon compound represented by (R1)3Si-X (R1's are each independently a group selected from the group consisting of a hydrocarbon group having 1 to 10 carbon atoms and a hydrocarbon group having 1 to 10 carbon atoms in which some or all hydrogen atoms are substituted with fluorine atoms, and X is an amino group), and in which the solvent includes 75% by mass or more of a hydrocarbon solvent in 100% by mass of the total amount of the solvent.

Abstract: A composition for film formation according to the present disclosure is used for forming a water-repellent film on at least a part of a surface of a substrate by being supplied to the substrate, in which the surface is covered with a protic liquid, the composition containing a silylating agent which silylates the surface of the substrate, a catalytic compound which promotes a silylation reaction by the silylating agent, and an aprotic solvent, in which a content of the catalytic compound is 1.0% by mass or more with respect to 100% by mass of the composition for film formation.

Abstract: The method for producing a substrate of the present invention includes a preparation step of preparing a substrate that has an uneven structure at the surface thereof, an arrangement step of arranging the substrate in a chamber with a cleaning liquid held in at least recessed portions of the uneven structure, a supply step of supplying a sublimable substance in a liquid state or supplying a sublimable film formation composition in a liquid state that includes a sublimable substance to at least the recessed portions of the substrate arranged in the chamber, and a sublimation drying step of coagulating, sublimating, and thereby removing a film of the sublimable substance or sublimable film formation composition that has been supplied, the sublimation drying step is controlled such that Tdp and Tmin satisfy Tmin>Tdp.