Composite seal member for semiconductor production apparatus
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1. Composite seal member for semiconductor production apparatus
2. Composite seal member for semiconductor production apparatus
The present article is a composite seal member for semiconductor production apparatus, such as dry etching apparatus; the characteristic features of the design 1 lie in the shape; the characteristic features of the design 2 lie in the combination of the shape, pattern, and color; protection for color of the design 2 is claimed; the back view and the right view are omitted because they are identical with the front view; the bottom view is omitted because it is identical with the top view.
Claims
The ornamental design for a composite seal member for semiconductor production apparatus as shown and described.
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Type: Grant
Filed: Jul 26, 2023
Date of Patent: Jul 8, 2025
Inventor: Ayaka Yoshida (Wakayama)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Jonathan E Fiencke
Application Number: 35/521,785