Composite seal member for semiconductor production apparatus

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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

1. Composite seal member for semiconductor production apparatus

2. Composite seal member for semiconductor production apparatus

1.1 : Perspective

1.2 : Front

1.3 : Left

1.4 : Top

1.5 : Cross-sectional view taken along line 1.5 in fig. 1.4

1.6 : Partial enlarged view of part 1.6 in fig. 1.5

2.1 : Perspective

2.2 : Front

2.3 : Left

2.4 : Top

2.5 : Cross-sectional view taken along line 2.5 in fig. 2.4

2.6 : Partial enlarged view of part 2.6 in fig. 2.5

The present article is a composite seal member for semiconductor production apparatus, such as dry etching apparatus; the characteristic features of the design 1 lie in the shape; the characteristic features of the design 2 lie in the combination of the shape, pattern, and color; protection for color of the design 2 is claimed; the back view and the right view are omitted because they are identical with the front view; the bottom view is omitted because it is identical with the top view.

Claims

The ornamental design for a composite seal member for semiconductor production apparatus as shown and described.

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Patent History
Patent number: D1083043
Type: Grant
Filed: Jul 26, 2023
Date of Patent: Jul 8, 2025
Inventor: Ayaka Yoshida (Wakayama)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Jonathan E Fiencke
Application Number: 35/521,785