Abstract: The invention relates to an electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes, particularly in electrical devices, particularly in temperature sensitive electrical devices or solar cells, particularly in HIT (Heterojunction with Intrinsic Thin-layer) solar cells. In particular, the invention relates to a paste, a process for preparing a paste, a precursor, a process for preparing an electrical device and a module comprising electrical devices. The invention relates to a paste comprising the following paste constituents: a. Ag particles, b. a polymer system; wherein the Ag particles have a multi-modal distribution of particle diameter with at least a first maximum in the range from about 1 nm to about less than 1 ?m and at least a further maximum in the range from about 1 ?m to about less than 1 mm; wherein the difference between the first and the further maximum is at least about 0.3 ?m; wherein at least 50 wt.

Abstract: Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. Core-shell conductive particles provide the conductivity of the compositions and devices contemplated herein.

Abstract: Solar cell conductor formulations made are from two silver powders having different particle size distributions, an aluminum powder, and two frit glass compositions having softening points in the range of 250-700° C. and whose softening points differ by at least 10° C.

Abstract: Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

Abstract: Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain a nickel intermetallic compound such as nickel silicide, nickely boride or nickel phosphide, a glass frit, a metal additive and an organic vehicle system. The paste can be used for making a solar cell contact.

Abstract: Electrically conductive polymeric compositions curable at temperatures below 250° C. are disclosed. The compositions are particularly well suited for forming electrodes used in association with certain solar cells.

Abstract: A dielectric coating material system for use in a single-sided back contact solar cell is disclosed. The material system serves to electrically isolate electrodes of opposite polarity types on the same side of a silicon-based solar call, and includes titanium and phosphorus.

Abstract: A method of reducing bow and/or improving the electrical performance of an aluminum back contacted silicon solar cell includes applying to a silicon wafer substrate a paste including aluminum and an organometallic compound, and firing the substrate. The organometallic compound is a C1 to C30 organometallic compound of a metal selected from the group consisting of Ag, Al, Ba, Bi, Ca, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Nd, Ni, Sb, Si, Sn, Sr, Ta, V, Zn, Zr. A paste is formed having an exothermic reaction peak at a temperature of at least 300° C. to less than 660° C.

Abstract: Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain silver, a glass frit, a metal additive and an organic vehicle system. The metal additive is at least one selected from the group consisting of yttrium, an organo-vanadium compound, organo-antimony compound, organo-phosphorus compound, and an organo-yttrium compound. The paste can be used for making a solar cell contact.

Abstract: Silicon solar cells and contacts thereof are printed in at least a two stage printing process where the busbars and fingerlines may be printed separately. A reduction in silver content in busbars and fingerlines through use of the techniques of the invention have been realized, including the use of certain base metals, while maintaining low contact resistance similar to silve pastes.

Abstract: Formulations and methods of making solar cells are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a solids portion and an organics portion, wherein the solids portion comprises from about 85 to about 99 wt % of a metal component, and from about 1 to about 15 wt % of a lead-free glass component. Both front contacts and back contacts arc disclosed.

Abstract: Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.

Abstract: Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain a nickel intermetallic compound such as nickel silicide, nickely boride or nickel phosphide, a glass frit, a metal additive and an organic vehicle system. The paste can be used for making a solar cell contact.

Abstract: Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.

Abstract: Silicon solar cells and contacts thereof are printed in at least a two stage printing process where the busbars and fingerlines may be printed separately. A reduction in silver content in busbars and fingerlines through use of the techniques of the invention have been realized, including the use of certain base metals, while maintaining low contact resistance similar to silver pastes.

Abstract: Solar cell conductor formulations made are from two silver powders having different particle size distributions, an aluminum powder, and two frit glass compositions having softening points in the range of 250-700° C. and whose softening points differ by at least 10° C.

Abstract: A dielectric coating material system for use in a single-sided back contact solar cell is disclosed. The material system serves to electrically isolate electrodes of opposite polarity types on the same side of a silicon-based solar call, and includes titanium and phosphorus.

Abstract: This invention relates an aluminum conductor paste formulation and its method of application on rear side passivated locally opened vias; dot or line geometry or combination thereof employing laser ablation or chemical etching methods. Such Back Surface Passivated Si-solar cells include dielectric layers of Al203, SiNx, Si02, SiC, ?-Si, Si02/SiNx, Al203/SiNx, Si02/Al203/SiNx. The Al-conductor paste of this invention achieves; (i) non-degradation of passivation stack, (ii) defect free surfaces and void free vias, (iii) a strong and uniform Back Surface Field (BSF) layer within dot vias and line vias.

Abstract: Paste compositions, methods of making paste compositions, contacts, and methods of making contacts are disclosed. The paste compositions include a solid portion and a vehicle system. The solid portion includes a conductive metal component and a glass binder. The vehicle system includes organometallic compound containing zinc. The organometallic compounds containing zinc can be dissolved in the vehicle system and the vehicle system does not include particles that contain zinc. The paste compositions can be used to form contacts in solar cells or other related components.

Abstract: Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.