Abstract: The present invention provides a unique method of making a barrier rib structure for a plasma display panel. Instead of employing the traditional screen printing method of making barrier ribs, the present invention employs a section of low temperature cofired ceramic dielectric. The unique method includes the steps of providing a fusible dielectric composition in an organic binder, applying the composition on a glass sheet, applying a photoresist composition, placing a mask over the coated plate to provide a pattern of openings in the photoresist corresponding to the pattern of the picture subcells, using a laser to remove the portions of the coating not covered by the photoresist to form the color subcells and heating the resulting assembly to a sintering temperature to fuse the dielectric composition to form the barrier rib structure and to fuse the barrier rib structure to the glass plate.

Abstract: The present invention relates to a method of making conductive electrodes for use in multilayer ceramic capacitors or inductors using organometallic ink. The method includes the steps of providing an organometallic ink which is free of any particles in excess of 0.1 micron in diameter and which contains an organometallic compound containing at least one of tin or ruthenium, applying the organometallic ink to a dielectric substrate, and sintering the organometallic ink to form a metal oxide film having a thickness of less than about 1.5 microns.

Abstract: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

Abstract: The present invention provides new and improved dielectric materials. In one preferred embodiment such novel dielectric material is formed by firing a composition including a glass composition comprising in weight percent from about 22% to about 45% ZnO, from about 4% to about 22% MgO, from about 1% to about 16% Al.sub.2 O.sub.3, from about 20% to about 49% SiO.sub.2, from about 2% to about 11% BaO, up to about 10% ZrO.sub.2, from about 0.05% to about 1.1% Fe.sub.2 O.sub.3 and from about 0.05% to about 0.95% PbO.

Abstract: A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-900.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2, and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 7.9, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

Abstract: A low dielectric, low temperature fired glass ceramic produced by firing at about 800.degree.-950.degree. C. a mixture comprising at least one glass consisting of, by weight percent, 0 to 50% B.sub.2 O.sub.3, 35 to 65% CaO, and 10 to 65% SiO.sub.2 l , and selected from the glasses of CaO-B.sub.2 O.sub.3 -SiO.sub.2 glass system. The glass ceramic is light weight, exhibits a dielectric constant of less than about 5.2, has adequate mechanical strength and thermal conductivity, and is compatible with precious metal conductors. The glass ceramic is useful in the manufacture of integrated circuits and any other electronic or mechanical components where a glass ceramic exhibiting this particular combination of characteristics is suitable.

Abstract: A method of bonding a dielectric material to a substrate comprising the steps of:I. providing a substrate;II. providing a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a mixture of two glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-2) a mixture of three glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.;III.

Abstract: This invention provides for a porous dielectric composition comprising at least one crystallized glass, at least one non-crystallized glass, and at least one Group IIA metal silicate, the porosity of said composition ranging from about 2% to about 50% by volume open space, the average diameter of the pore spaces in said composition ranging from about 1 to about 30 micrometers. The invention also provides for dielectric pastes and dieletric tapes for providing these dielectric compositions. The invention also provides for a process for making these dielectric compositions. These dielectric compositions are useful in making multilayered circuits, thick film circuits and other electronic components.

Abstract: This invention relates to a dielectric composition comprising:(a) about 30% to about 100% by weight of a glass composition selected from the group consisting of:(a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.;(a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or(a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C.