Patents by Inventor Bae Hyung Kim

Bae Hyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10588602
    Abstract: A portable ultrasound apparatus includes a sampler configured to obtain an in-phase signal and a quadrature signal from an ultrasound signal; a memory configured to store the in-phase signal and the quadrature signal and output the stored in-phase signal and the stored quadrature signal according to a first time delay; an interpolator configured to interpolate the in-phase signal and the quadrature signal outputted from the memory; and a phase rotator configured to apply a second time delay to the interpolated in-phase signal and the interpolated quadrature signal.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae Hyung Kim, Kyu Hong Kim, Su Hyun Park
  • Patent number: 10327735
    Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il Cho, Jong Keun Song, Bae Hyung Kim, Young Il Kim, Seung Heun Lee
  • Patent number: 10111647
    Abstract: Provided is an ultrasonic image generating apparatus that may generate an ultrasonic image by using an ultrasonic transducer which has a wideband frequency transfer characteristic or an ultra-wideband frequency transfer characteristic, such as a micromachined ultrasonic transducer (MUT). A pulse generator of the ultrasonic image generating apparatus may generate a first ultrasonic pulse having a first center frequency and a first bandwidth and a second ultrasonic pulse having a second center frequency and a second bandwidth. The ultrasonic transducer may simultaneously transmit the first ultrasonic pulse and the second ultrasonic pulse.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: October 30, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae Hyung Kim, Young-Il Kim, Jong-Keun Song, Seung-Heun Lee, Kyung-Il Cho
  • Publication number: 20180263603
    Abstract: A medical image processing apparatus includes a weight applier configured to, when a difference between a first imaginary component of a first frame image and a second imaginary component of a second frame image, the second frame image being adjacent to the first frame image, is less than or equal to a first threshold value, apply a first weight to the second imaginary component to increase the difference; and an image generator configured to generate a movement-amplified image based on the first frame image and the second frame image to which the first weight is applied so that a movement of interest corresponding to the increased difference is amplified.
    Type: Application
    Filed: May 15, 2018
    Publication date: September 20, 2018
    Inventors: Joo Young KANG, Kyu Hong KIM, Bae Hyung KIM, Su Hyun PARK, Young Ihn KHO, Jung Ho KIM, Sung Chan PARK
  • Publication number: 20180214126
    Abstract: Disclosed is a Capacitive Micromachined Ultrasonic Transducer (cMUT) including: an anchor; and a membrane coupled with the anchor, wherein the anchor includes at least one anchor groove. According to the cMUT, a probe, and a method of manufacturing the probe, it is possible to widen a contact area between the cMUT and a lens. Accordingly, it is possible to increase the interfacial strength between the cMUT and the lens while protecting the membrane of the cMUT. Also, the peeling phenomenon of the lens can be prevented, and the durability of transducers can be improved.
    Type: Application
    Filed: July 15, 2015
    Publication date: August 2, 2018
    Inventors: Young Il KIM, Kyung Il CHO, Bae Hyung KIM, Jong Keun SONG, Eun Sung LEE, Min Seog CHOI
  • Patent number: 10016182
    Abstract: A medical image processing apparatus includes a weight applier configured to, when a difference between a first imaginary component of a first frame image and a second imaginary component of a second frame image, the second frame image being adjacent to the first frame image, is less than or equal to a first threshold value, apply a first weight to the second imaginary component to increase the difference; and an image generator configured to generate a movement-amplified image based on the first frame image and the second frame image to which the first weight is applied so that a movement of interest corresponding to the increased difference is amplified.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: July 10, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo Young Kang, Kyu Hong Kim, Bae Hyung Kim, Su Hyun Park, Young Ihn Kho, Jung Ho Kim, Sung Chan Park
  • Patent number: 9675324
    Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: June 13, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il Cho, Bae Hyung Kim, Young Il Kim, Jong Keun Song, Seung Heun Lee
  • Publication number: 20160296204
    Abstract: There are provided an ultrasonic imaging apparatus for imaging an ultrasonic signal and a method of controlling the same. A method of controlling an ultrasonic imaging apparatus according to an embodiment which uses a 2D array probe in which a plurality of elements are two-dimensionally arranged, the method includes setting an ultrasound to be transmitted using all of the plurality of elements and an echo ultrasound to be received using some predetermined elements among the plurality of elements, determining whether a section of interest of an object is included in a weak resolution region determined by the setting, and generating an ultrasound image of the section of interest according to a beamforming method corresponding to focusing of the transmitted ultrasound by transmitting the ultrasound and receiving the echo ultrasound in accordance with the setting when the section of interest is included in the weak resolution region.
    Type: Application
    Filed: November 18, 2014
    Publication date: October 13, 2016
    Inventors: Su Hyun Park, Kyu Hong Kim, Bae Hyung Kim, Jong Keun Song, Seung Heun Lee, Kyung IL Cho
  • Publication number: 20160228092
    Abstract: A portable ultrasound apparatus includes a sampler configured to obtain an in-phase signal and a quadrature signal from an ultrasound signal; a memory configured to store the in-phase signal and the quadrature signal and output the stored in-phase signal and the stored quadrature signal according to a first time delay; an interpolator configured to interpolate the in-phase signal and the quadrature signal outputted from the memory; and a phase rotator configured to apply a second time delay to the interpolated in-phase signal and the interpolated quadrature signal.
    Type: Application
    Filed: February 10, 2016
    Publication date: August 11, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae Hyung KIM, Kyu Hong KIM, Su Hyun PARK
  • Publication number: 20160217574
    Abstract: A medical image processing apparatus includes a weight applier configured to, when a difference between a first imaginary component of a first frame image and a second imaginary component of a second frame image, the second frame image being adjacent to the first frame image, is less than or equal to a first threshold value, apply a first weight to the second imaginary component to increase the difference; and an image generator configured to generate a movement-amplified image based on the first frame image and the second frame image to which the first weight is applied so that a movement of interest corresponding to the increased difference is amplified.
    Type: Application
    Filed: January 15, 2016
    Publication date: July 28, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo Young KANG, Kyu Hong KIM, Bae Hyung KIM, Su Hyun PARK, Young Ihn KHO, Jung Ho KIM, Sung Chan PARK
  • Patent number: 9304192
    Abstract: A beamforming method includes generating a control signal for implementing a delay time for each of a plurality of transducers of each of a plurality of two-dimensional (2D) transducer-arrays, transmitting the control signal to a plurality of driving units respectively corresponding to the plurality of 2D transducer-arrays via an interposer that electrically connects the plurality of 2D transducer-arrays to each other, and driving each 2D transducer-array of the plurality of 2D transducer-arrays with a corresponding driving unit of the plurality of driving units according to the control signal transmitted via the interposer.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: April 5, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-keun Song, Kyung-il Cho, Dong-wook Kim, Bae-hyung Kim
  • Publication number: 20160081665
    Abstract: An ultrasonic probe includes a transducer circuit configured to receive ultrasonic waves reflected from an object and output an ultrasonic signal based on the ultrasonic waves; a simulated circuit having circuit characteristics substantially the same as the transducer circuit and configured to output a noise signal; and a differential amplifier circuit configured to output a voltage difference between the ultrasonic signal and the noise signal.
    Type: Application
    Filed: July 22, 2015
    Publication date: March 24, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: SUNGCHAN PARK, JUNGHO KIM, Kyuhong KIM, Bae hyung KIM, Jooyoung KANG
  • Patent number: 9225365
    Abstract: A sampling method for generating a diagnostic image of an object is provided. The sampling method may include receiving an echo signal reflected from an object; sampling the received echo signal by using a sampling frequency and storing the I component data and the Q component data extracted according to a result of the sampling.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: December 29, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae-hyung Kim, Kyung-il Cho, Dong-wook Kim, Jong-keun Song, Seung-heun Lee
  • Patent number: 9202457
    Abstract: An apparatus for driving a two-dimensional transducer array, a medical imaging system and a method of driving a two-dimensional transducer array are provided. An apparatus for driving a two-dimensional (2D) transducer array including one or more transducers includes one or more drivers configured to respectively drive the transducers, each of the drivers including a register, a comparator, a pulse frequency setter, a multi-pulse controller, a transmission signal generator, a signal transceiver, a transmission and reception switch, and a reception signal amplifier, and a driving controller configured to control the drivers.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 1, 2015
    Assignees: Samsung Electronics Co., Ltd., Industry-University Cooperation Foundation Hanyang University
    Inventors: Jong-keun Song, Oh-kyong Kwon, Kyung-il Cho, Dong-wook Kim, Bae-hyung Kim
  • Patent number: 9136139
    Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: September 15, 2015
    Assignees: SAMSUNG ELECTRONICS CO., LTD., Kyungpook National University Industry-Academic Cooperation Foundation
    Inventors: Young Il Kim, Bae Hyung Kim, Jong Keun Song, Seung Heun Lee, Kyung Il Cho, Yong Rae Roh, Won Seok Lee
  • Patent number: 9071893
    Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: June 30, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Il Kim, Dong Wook Kim, Bae Hyung Kim, Jong Keun Song, Seung Heun Lee, Kyung Il Cho
  • Publication number: 20150140824
    Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Applicants: SAMSUNG ELECTRONICS CO., LTD., Kyungpook National University Industry-Academic Cooperation Foundation
    Inventors: Young Il KIM, Bae Hyung KIM, Jong Keun SONG, Seung Heun LEE, Kyung Il CHO, Yong Rae ROH, Won Seok LEE
  • Publication number: 20150099977
    Abstract: Disclosed herein is a beamforming apparatus for beamforming signals which are transmitted or received by a probe which includes a plurality of transducer blocks, each of which includes a plurality of transducers. The apparatus includes a controller configured to control components to delay signals to be transmitted by the plurality of transducers included in each transducer block or signals received by the plurality of transducers included in each transducer block, and an analog beamformer which includes a plurality of beamforming units which correspond to the respective transducer blocks. The plurality of beamforming units is configured to perform analog beamforming on signals transmitted or received by the plurality of transducers included in each transducer block based on a control signal which is received from the controller, to reduce a dynamic delay range, thereby reducing a size of a delay line.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 9, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae Hyung KIM, Young Il KIM, Jong Keun SONG, Seung Heun LEE, Kyung Il CHO
  • Patent number: 8974393
    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: March 10, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung Il Cho, Seung Heun Lee, Bae Hyung Kim, Young Il Kim, Jong Keun Song
  • Patent number: 8975096
    Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: March 10, 2015
    Assignees: Samsung Electronics Co., Ltd., Kyungpook National University Industry-Academic Cooperation Foundation
    Inventors: Young Il Kim, Bae Hyung Kim, Jong Keun Song, Seung Heun Lee, Kyung Il Cho, Yong Rae Roh, Won Seok Lee