Abstract: Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

Abstract: A color filter substrate enhances image quality and reduces light leakage. The method of manufacturing the same is also disclosed. The color filter substrate includes a substrate, a color filter, a light-blocking member and a plurality of granular light-blocking spacers. The substrate includes a light blocking area. The color filter is disposed on the substrate. The light-blocking member is disposed in the light blocking area on the substrate. The granular light-blocking spacers are disposed in the light blocking area, thereby reducing the light leakage, enhancing the image quality, and simplifying manufacturing process.

Abstract: A liquid crystal display apparatus includes first and second substrates, a fence, a liquid crystal layer and a plurality of spacers. The first substrate includes a display region for displaying an image. The second substrate faces the first substrate. The fence is disposed between the first substrate and the second substrate. The fence surrounds the display. The spacers maintain the distance between the first and second substrates. The spacers have a gradually increasing compression ratio in a direction from a center of the display region to an edge of the display region. The liquid crystal display apparatus maintains a uniform cell gap, even though a compressive stress of a center portion of the liquid crystal display apparatus is different with a compressive stress of an edge portion of the liquid crystal display apparatus. Therefore, display quality is enhanced.

Abstract: An apparatus for forming an organic layer on a substrate includes a spraying device, the spraying device including a plurality of head units each formed in a corresponding row. Each head unit is shifted a horizontal distance from a previous head unit.

Abstract: A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

Abstract: A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

Abstract: A method and apparatus for cutting a nonmetallic substrate capable of reducing steps and time for cutting a nonmetallic substrate and contaminants of the substrate. An initial crack is previously formed on a nonmetallic substrate by applying laser beams and coolant on the nonmetallic substrate and a scribe crack is formed on the nonmetallic substrate by applying the laser beams to the initial crack. The nonmetallic substrate is cut along the scribe crack by rapidly heating and cooling the portion of the scribe crack using the laser beams and coolant.

Abstract: Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.

Abstract: A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on the non-metallic substrate to form a scribe line having a crack in desired depth. Then, a second laser beam is scanned along a scanning path of the first laser beam to propagate the crack in a depth direction of the substrate and to completely separate the non-metallic substrate. Since the cutting speed can be controlled by the speed of the first laser beam, the cutting speed can be increased and the cutting speed can be easily controlled as compared with the conventional cutting method using the temperature difference due to the heating operation and the cooling operation.

Abstract: A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on the non-metallic substrate to form a scribe line having a crack in desired depth. Then, a second laser beam is scanned along a scanning path of the first laser beam to propagate the crack in a depth direction of the substrate and to completely separate the non-metallic substrate. Since the cutting speed can be controlled by the speed of the first laser beam, the cutting speed can be increased and the cutting speed can be easily controlled as compared with the conventional cutting method using the temperature difference due to the heating operation and the cooling operation.

Abstract: A method and apparatus for cutting a nonmetallic substrate capable of reducing steps and time for cutting a nonmetallic substrate and contaminants of the substrate. An initial crack is previously formed on a nonmetallic substrate by applying laser beams and coolant on the nonmetallic substrate and a scribe crack is formed on the nonmetallic substrate by applying the laser beams to the initial crack. The nonmetallic substrate is cut along the scribe crack by rapidly heating and cooling the portion of the scribe crack using the laser beams and coolant.

Abstract: Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.

Abstract: Disclosed are an apparatus and a method for cutting a non-metal substrate. A laser device generates a first laser beam onto a cutting route formed in the non-metal substrate for heating the cutting route such that a scribe line is formed on the cutting route. The laser device also generates a second laser beam, which is spaced by a predetermined distance from the first laser beam, such that a beam pattern is formed along a radiating route of the first laser beam. A cooling device forms a crack by applying a cooling fluid beam onto the cutting route formed between the first laser beam and the second laser beam. After applying the cooling fluid beam, the non-metal substrate is cut by using one beam pattern, to simplify an optical system. A great tensile force is generated in the scribe line, so the thick non-metal substrate can be completely cut at once.

Abstract: Disclosed is a coolant for cooling a selectively heated portion of a liquid crystal display substrate to cut the selected portion using thermal stress and a method of cutting the substrate using the same. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

Abstract: A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

Abstract: A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on the non-metallic substrate to form a scribe line having a crack in desired depth. Then, a second laser beam is scanned along a scanning path of the first laser beam to propagate the crack in a depth direction of the substrate and to completely separate the non-metallic substrate. Since the cutting speed can be controlled by the speed of the first laser beam, the cutting speed can be increased and the cutting speed can be easily controlled as compared with the conventional cutting method using the temperature difference due to the heating operation and the cooling operation.

Abstract: Disclosed are an apparatus and a method for cutting a non-metal substrate. A laser device generates a first laser beam onto a cutting route formed in the non-metal substrate for heating the cutting route such that a scribe line is formed on the cutting route. The laser device also generates a second laser beam, which is spaced by a predetermined distance from the first laser beam, such that a beam pattern is formed along a radiating route of the first laser beam. A cooling device forms a crack by applying a cooling fluid beam onto the cutting route formed between the first laser beam and the second laser beam. After applying the cooling fluid beam, the non-metal substrate is cut by using one beam pattern, to simplify an optical system. A great tensile force is generated in the scribe line, so the thick non-metal substrate can be completely cut at once.