Abstract: In one example, a system includes a first sealed container, a second sealed container, a signal coupler, a container enclosure, and an electromagnetic (EM) reflective coating. The first sealed container encloses a first dipolar gas. The second sealed container encloses a second dipolar gas. The signal coupler is communicatively coupled between the first and second sealed containers. The signal coupler includes a solid material or a hollow sealed tube. The container enclosure encloses the first and second sealed containers and the signal coupler. The EM reflective coating is inside the container enclosure and covers at least part of the first container, at least part of the second container, and at least part of the signal coupler.

Abstract: Ultrasonic audio processing circuitry and a method useful in ultrasonic presence detection. An ultrasonic burst generator produces an ultrasonic burst signal at one or more ultrasonic frequencies, and an equalizer equalizes that ultrasonic burst signal according to frequency response characteristics of the speaker and microphone at those ultrasonic frequencies. Driver circuitry drives a speaker with the ultrasonic burst signal, which may be combined with an audible audio signal. An ultrasonic separation filter separates an ultrasonic portion from a signal received at a microphone, and processing circuitry is provided to determine a delay time of an echo corresponding to the ultrasonic burst signal in that separated ultrasonic portion of the received signal. In another aspect, the equalizer equalizes an ultrasonic portion of the signal received at a microphone, according to frequency response characteristics of the speaker and microphone at the ultrasonic frequencies of the burst.

Abstract: In a described example, a circuit includes a sensor circuit including multiple magnetic field sensors having respective sensor outputs. The magnetic field sensors are configured to provide magnetic field sensor signals at the respective sensor outputs representative of a measure of current flow through a conductive structure. A combiner interface has combiner inputs and a combiner output. The combiner inputs are coupled to the respective sensor outputs. The combiner interface is configured to provide an aggregate sensor measurement at the combiner output responsive to the magnetic field sensor signals, in which the aggregate sensor measurement is decoupled from magnetic fields generated responsive to the current flow through the conductive structure.

Abstract: A driver system includes a non-inverting system input, an inverting system input, a non-inverting system output and an inverting system output. The driver system includes a line driver which includes a non-inverting driver input coupled to the non-inverting system input and includes an inverting driver input coupled to the inverting system input. The line driver includes an inverting driver output and a non-inverting driver output. The driver system includes a first termination resistor coupled between the non-inverting driver output and the non-inverting system output and includes a second termination resistor coupled between the inverting driver output and the inverting system output. The driver system includes a first amplifier stage coupled to the line driver and includes a second amplifier stage coupled to the line driver.

Abstract: An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.

Abstract: In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.

Abstract: A system includes a first differential amplifier and a first transformer with a primary coil coupled to an output of the first differential amplifier and with a secondary coil coupled to a load. The system also includes a second differential amplifier and a second transformer with a primary coil coupled to an output of the second differential amplifier and with a secondary coil coupled in series with the secondary coil of the first transformer. The system also includes a tuning network coupled to a center tap node between the secondary coil of the first transformer and the secondary coil of the second transformer.

Abstract: In some examples, an integrated circuit comprises: a semiconductor die including a semiconductor substrate, a dielectric layer on the semiconductor substrate, and a metallization structure encapsulated in the dielectric layer, in which the semiconductor substrate includes a transistor having a first current terminal, a second current terminal, and a channel region between the first and second current terminals, and the dielectric layer has a sensing side facing away from the semiconductor substrate; an insulation layer on the sensing side; a sensor terminal on the sensing side and over the channel region; and a restriction structure including an opening and a rigid silicon-based fluidic structure, in which the silicon-based fluidic structure is on the sensing side and encapsulates a fluid cavity on the sensing side, the sensor terminal is in the fluid cavity, and the restriction structure is configured to transport a fluid by microfluidic diffusion.

Abstract: An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

Abstract: In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Abstract: A sensor chip includes a sensor pixel. The sensor pixel includes an avalanche photodetector. A circuit is adjacent to the avalanche photodetector. The circuit is coupled to the avalanche photodetector. An isolation structure at least partially encloses the circuit and is between the avalanche photodetector and the circuit.

Abstract: An oscillator circuit includes a first BAW oscillator, a first coupling stage, a second BAW oscillator, and a second coupling stage. The first BAW oscillator is configured to generate a first output signal at a frequency. The first coupling stage is coupled to the first BAW oscillator, and is configured to amplify the first output signal. The second BAW oscillator is coupled to the first coupling stage, and is configured to generate a second output signal at the frequency. The second output signal differs in phase from the first output signal. The second coupling stage is coupled to the first BAW oscillator and the second BAW oscillator, and is configured to amplify the second output signal and drive the first BAW oscillator.

Abstract: An avalanche photo-diode (APD) circuit includes a first APD and a bias circuit. The first APD is configured to detect light. The bias circuit is configured to control a gain of the first APD. The bias circuit includes a second APD, a reference voltage source, a bias voltage generation circuit, and a metal layer configured to shield the second APD from the light. The reference voltage source is configured to bias the second APD. The bias voltage generation circuit is configured to generate a bias voltage for biasing the first APD based on dark current output by the second APD.

Abstract: Ultrasonic audio processing circuitry and a method useful in ultrasonic presence detection. An ultrasonic burst generator produces an ultrasonic burst signal at one or more ultrasonic frequencies, and an equalizer equalizes that ultrasonic burst signal according to frequency response characteristics of the speaker and microphone at those ultrasonic frequencies. Driver circuitry drives a speaker with the ultrasonic burst signal, which may be combined with an audible audio signal. An ultrasonic separation filter separates an ultrasonic portion from a signal received at a microphone, and processing circuitry is provided to determine a delay time of an echo corresponding to the ultrasonic burst signal in that separated ultrasonic portion of the received signal. In another aspect, the equalizer equalizes an ultrasonic portion of the signal received at a microphone, according to frequency response characteristics of the speaker and microphone at the ultrasonic frequencies of the burst.

Abstract: A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

Abstract: A pulsed light source illuminates a scene with a virtual array of points. Light reflected by the scene is detected by a small pixel array, allowing generation of a three-dimensional map of the scene. A processing element processing data output by the small pixel array uses a multipath resolution algorithm to resolve individual objects in the scene.

Abstract: An integrated circuit (IC) includes a semiconductor substrate having a first surface and a second surface opposite the first surface. A through wafer trench (TWT) extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate. Dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region has a conductive transmit patch. An antenna is formed, at least in part, by the dielectric material in the TWT and the transmit patch in the interconnect region. The antenna is configured to transmit or receive electromagnetic radiation between the transmit patch and the second surface of the semiconductor substrate through the dielectric material within the trench.

Abstract: An integrated circuit (IC) includes a substrate having a first surface and a second surface opposite the first surface. The substrate has a first region containing a first circuit and a second region containing a second circuit. The first circuit operates at a first supply voltage. The second circuit operates at a second supply voltage. The second supply voltage is higher than the first supply voltage. The IC includes a through wafer trench (TWT) extending from the first surface of the substrate to the second surface of the semiconductor substrate. The TWT separates the first region from the second region. A dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region is continuous over the first region, the second region, and the TWT. A non-galvanic communication channel is between the first and second circuits.

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.