Abstract: Provided is a novel catalyst comprised of an alumina, silica-alumina, and a zeolite containing base impregnated with Ni, Mo, and W. In one embodiment, the trimetallic catalyst is layered with a conventional hydrocracking pretreat catalyst to provide a catalyst combination useful in hydrotreating a feed to a hydrocracking stage.

Abstract: Vessel configured to facilitate concentration of a product in a solution. The vessel may include outlet ports to deliver the solution to a processing system (such as a filtration system), and inlet ports. The inlet ports may be at progressively lower levels for return of fluid thereto reduced in volume as a result of filtration thereof. A smaller volume sump may be provided below a main tank of the vessel to facilitate concentration of the solution. The sump may include ridges facilitating collection of the product of interest from the solution, and/or reinforcing the sump walls, and optionally forming a vortex breaker. A spray ball may be provided to spray materials, such as buffer solution, into the vessel. The spray ball may direct materials to facilitate retrieval of product from the vessel. One or more components of the vessel may be advantageously formed of disposable material for single use thereof.

Abstract: The present disclosure is related to bioprocessing devices, systems, and methods, and particularly to sanitary connections for bioprocessing. The devices, systems, and methods described herein can relate to the sanitary connection of flow fittings, such as reducers, with considerations for ease of assembly and sealing. In some embodiments, the system may include a flow reducer, a ferrule and a gasket. The flow reducer may include a gasket channel, an overmold channel within the gasket channel, and one or more cavities within the overmold channel. The gasket may be overmolded within the gasket channel and extending within the one or more cavities.

Abstract: Embodiments of the present disclosure relate generally to systems and methods for perfusion cell culture involving alternating fluid flows between first and second flexible vessels. For example, a hollow fiber filter module may be attached to first and second culture vessels which each include inner and outer vessels. A pressure source may cause a pressure differential between the outer vessels, which may cause a responsive fluid flow between the inner vessels across a hollow fiber filtration unit.

Abstract: The present disclosure is related to bioprocessing devices, systems, and methods, and particularly to sanitary connections for bioprocessing. The devices, systems, and methods described herein can relate to the sanitary connection of flow fittings, such as reducers, with considerations for ease of assembly and sealing. In some embodiments, the system may include a flow reducer, a ferrule and a gasket. The flow reducer may include a gasket channel, an overmold channel within the gasket channel, and one or more cavities within the overmold channel. The gasket may be overmolded within the gasket channel and extending within the one or more cavities.

Abstract: Termini assemblies of electrical cable connector assemblies and methods of formation include a termini housing configured to receive an electrical cable and a dynamic seal assembly disposed in the termini housing and including a first portion having an O-ring seal configuration and configured to seal the termini assembly up to a pressure threshold and a second portion having a cup seal configuration and configured to seal the termini assembly at pressures greater than the pressure threshold. Methods of installing the electrical cable connector assemblies include installing the electrical cable connector assembly in a low or high pressure application, wherein installation in the low pressure application results in at least one of the first and second portions of the dynamic seal assembly sealing the termini assembly, and wherein installation in the high pressure application results in the second portion of the dynamic seal assembly sealing the termini assembly.

Abstract: Devices, systems, and methods for continually degassing/venting a feedstream within a filtration system. The filtration system may include a filter device utilizing hollow fiber filters to filter the feedstream. Additional venting hollow fiber filters vent gas from the filtration system to outside the filtration system. The venting hollow fiber filters may have ends which expose the interior lumens thereof to outside the filter unit to vent gases which pass through the walls of the hollow fiber filters. Degassed permeate thus flows through the filtering hollow fiber filters.

Abstract: Termini assemblies of electrical cable connector assemblies and methods of formation include a termini housing configured to receive an electrical cable and a dynamic seal assembly disposed in the termini housing and including a first portion having an O-ring seal configuration and configured to seal the termini assembly up to a pressure threshold and a second portion having a cup seal configuration and configured to seal the termini assembly at pressures greater than the pressure threshold. Methods of installing the electrical cable connector assemblies include installing the electrical cable connector assembly in a low or high pressure application, wherein installation in the low pressure application results in at least one of the first and second portions of the dynamic seal assembly sealing the termini assembly, and wherein installation in the high pressure application results in the second portion of the dynamic seal assembly sealing the termini assembly.

Abstract: The present disclosure is related to bioprocessing devices, systems, and methods, and particularly to sanitary connections for bioprocessing. The devices, systems, and methods described herein can relate to the sanitary connection of flow fittings, such as reducers, with considerations for ease of assembly and sealing.

Abstract: A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second matieral is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated through the cladded substrate. A copper core is deposited within the vias to thereby connect the two claddings. A photoresist is applied to both claddings, a photomask having a predetermined exposure pattern is placed over the claddings, the photoresist is exposed to ultraviolet (UV) light to thereby polymerize in the exposed areas thereof, and the resulting photoresist image is developed by use of a developer solution to wash away of the unpolymerized areas of the photoresist. Now, the photoresist image provides a retainer wall spaced from, and circumferentially around, the vias. Next, a lead-tin solder alloy is electroplated, such as by a lead-tin fluoroborate bath, at the vias into the volumes defined by the retainer wall at each end of the vias.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A circuit card guide comprising a base defining at least one base slot for placement in alignment over a corresponding expansion slot on a computer system motherboard, incorporates one or more insert guides positioned in cooperation with the base slot such that when a user attempts to insert a circuit card by feel, due to partial or complete visual obstruction of the expansion slot by other computer system components, a connector edge of the circuit card can be received by the circuit card guide within a greater range of tolerance than the width of the expansion slot alone, and the connector edge can be guided by the one or more insert guides through the base slot and into the desired expansion slot.

Abstract: A process using a shim stock or foil to make flexible circuits having raised pressure contact features protruding outwardly from two surfaces. A first set of raised electrical pressure contact features are made by placing a shim stock or foil of stainless-steel on a piece of soft metal or other suitable substrate and forcing a tool into the foil to form dimples in one face. Thereafter, the foil is turned over and the process repeated on the other face of the foil. The resultant foil includes a first face having a first dimple and a first bump extending outwardly from the first face. A flash coating is formed on the foil and electrical traces are deposited on the first face of the foil including into the first dimple and over the first bump. A dielectric substrate is selectively deposited over the electrical traces and the complete subassembly is removed from the foil. A flash coating is etched away and optionally a second dielectric substrate is selectively deposited over the electrical traces.

Abstract: A variable rate pressure sensitive electrical device or switch. The switch includes a first substrate and a plurality of electrical circuit traces thereon. A first electrical trace is provided having a first set of raised contact features or bumps projecting from a prevalent planar portion of first electrical trace. At least a second electrical trace is provided having a second set of raised contact features or bumps extending above a planar portion of second electrical trace. The first and second electrical traces and associated raised contact features are constructed and arranged so that the height of the first set of raised contact features is greater than the height of the second set of raised contact features. A second substrate is provided with an electrically conductive element.

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.

Abstract: The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip.

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.