Abstract: Termini assemblies of electrical cable connector assemblies and methods of formation include a termini housing configured to receive an electrical cable and a dynamic seal assembly disposed in the termini housing and including a first portion having an O-ring seal configuration and configured to seal the termini assembly up to a pressure threshold and a second portion having a cup seal configuration and configured to seal the termini assembly at pressures greater than the pressure threshold. Methods of installing the electrical cable connector assemblies include installing the electrical cable connector assembly in a low or high pressure application, wherein installation in the low pressure application results in at least one of the first and second portions of the dynamic seal assembly sealing the termini assembly, and wherein installation in the high pressure application results in the second portion of the dynamic seal assembly sealing the termini assembly.

Abstract: Devices, systems, and methods for continually degassing/venting a feedstream within a filtration system. The filtration system may include a filter device utilizing hollow fiber filters to filter the feedstream. Additional venting hollow fiber filters vent gas from the filtration system to outside the filtration system. The venting hollow fiber filters may have ends which expose the interior lumens thereof to outside the filter unit to vent gases which pass through the walls of the hollow fiber filters. Degassed permeate thus flows through the filtering hollow fiber filters.

Abstract: Termini assemblies of electrical cable connector assemblies and methods of formation include a termini housing configured to receive an electrical cable and a dynamic seal assembly disposed in the termini housing and including a first portion having an O-ring seal configuration and configured to seal the termini assembly up to a pressure threshold and a second portion having a cup seal configuration and configured to seal the termini assembly at pressures greater than the pressure threshold. Methods of installing the electrical cable connector assemblies include installing the electrical cable connector assembly in a low or high pressure application, wherein installation in the low pressure application results in at least one of the first and second portions of the dynamic seal assembly sealing the termini assembly, and wherein installation in the high pressure application results in the second portion of the dynamic seal assembly sealing the termini assembly.

Abstract: The present disclosure is related to bioprocessing devices, systems, and methods, and particularly to sanitary connections for bioprocessing. The devices, systems, and methods described herein can relate to the sanitary connection of flow fittings, such as reducers, with considerations for ease of assembly and sealing.

Abstract: A method and apparatus to provide a multi-criteria rating and search system is described. Users can provide ratings along multiple axes, which can then be used for searching.

Abstract: A biofuel cell device for generating electrical current, comprising a fuel manifold, an anode assembly, a cathode assembly, a housing, and a controller is described. The anode assembly comprises at least one catalyst positioned for contact with fuel fluid in said fuel reservoir. The cathode assembly comprises at least one biocathode positioned for flow of an oxidant to the biocathode enzyme. The housing houses the manifold, anode assembly and cathode assembly. The controller controls the output of electrical current from the biofuel cell device.

Abstract: A biofuel cell device for generating electrical current. The device includes a fuel manifold having a face, and at least one cavity in the face defining a fuel reservoir, an inlet in fluid communication with the reservoir for flow of fuel fluid into the manifold to fill the reservoir and an outlet in fluid communication with the reservoir for flow of fuel fluid out of the manifold. The device has an anode assembly including at least one bioanode positioned for contact with fuel fluid in the fuel reservoir, and a cathode assembly including at least one cathode positioned for flow of fuel fluid through the bioanode to the cathode. The device includes a controller operatively connected to the anode assembly and the cathode assembly for controlling the output of electrical current from the biofuel cell device.

Abstract: A method and apparatus to provide a multi-criteria rating and search system is described. Users can provide ratings along multiple axes, which can then be used for searching.

Abstract: A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second matieral is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated through the cladded substrate. A copper core is deposited within the vias to thereby connect the two claddings. A photoresist is applied to both claddings, a photomask having a predetermined exposure pattern is placed over the claddings, the photoresist is exposed to ultraviolet (UV) light to thereby polymerize in the exposed areas thereof, and the resulting photoresist image is developed by use of a developer solution to wash away of the unpolymerized areas of the photoresist. Now, the photoresist image provides a retainer wall spaced from, and circumferentially around, the vias. Next, a lead-tin solder alloy is electroplated, such as by a lead-tin fluoroborate bath, at the vias into the volumes defined by the retainer wall at each end of the vias.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Abstract: A circuit card guide comprising a base defining at least one base slot for placement in alignment over a corresponding expansion slot on a computer system motherboard, incorporates one or more insert guides positioned in cooperation with the base slot such that when a user attempts to insert a circuit card by feel, due to partial or complete visual obstruction of the expansion slot by other computer system components, a connector edge of the circuit card can be received by the circuit card guide within a greater range of tolerance than the width of the expansion slot alone, and the connector edge can be guided by the one or more insert guides through the base slot and into the desired expansion slot.

Abstract: A process using a shim stock or foil to make flexible circuits having raised pressure contact features protruding outwardly from two surfaces. A first set of raised electrical pressure contact features are made by placing a shim stock or foil of stainless-steel on a piece of soft metal or other suitable substrate and forcing a tool into the foil to form dimples in one face. Thereafter, the foil is turned over and the process repeated on the other face of the foil. The resultant foil includes a first face having a first dimple and a first bump extending outwardly from the first face. A flash coating is formed on the foil and electrical traces are deposited on the first face of the foil including into the first dimple and over the first bump. A dielectric substrate is selectively deposited over the electrical traces and the complete subassembly is removed from the foil. A flash coating is etched away and optionally a second dielectric substrate is selectively deposited over the electrical traces.

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.

Abstract: A variable rate pressure sensitive electrical device or switch. The switch includes a first substrate and a plurality of electrical circuit traces thereon. A first electrical trace is provided having a first set of raised contact features or bumps projecting from a prevalent planar portion of first electrical trace. At least a second electrical trace is provided having a second set of raised contact features or bumps extending above a planar portion of second electrical trace. The first and second electrical traces and associated raised contact features are constructed and arranged so that the height of the first set of raised contact features is greater than the height of the second set of raised contact features. A second substrate is provided with an electrically conductive element.

Abstract: The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip.

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.

Abstract: The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.