Abstract: A transmission control method in a satellite communication system and a related apparatus are provided. A terminal may determine, through satellite selection, a target satellite with a strongest signal from at least one satellite in geosynchronous orbit. The terminal may determine a satellite transmission link direction based on location information of the terminal and location information of the target satellite and may further determine a radiation direction of a satellite antenna in the terminal based on geomagnetic data and attitude data of the terminal. The terminal may enable, by using the satellite transmission link direction and the radiation direction of the satellite antenna, the radiation direction of the satellite antenna in the terminal to be aligned with the target satellite. After aligning with the target satellite, the terminal may send a first data packet to the target satellite along the radiation direction of the satellite antenna.

Abstract: A wide-band-gap diode and manufacturing method thereof are provided. The method of manufacturing a wide-band-gap diode involves growing an N-type doped epitaxial layer on an N-doped substrate. P-type ions are implanted into the epitaxial layer to form an active area, a junction termination extension region, and an edge region. The active area exhibits an axially symmetric graticule pattern, with higher doping area density towards the center of the active area. The junction termination extension region surrounds the active area, and the edge region encircles both of the active area and the junction termination extension region to enhance the wide-band-gap diode's capability to withstand surge currents.

Abstract: A monolithic Opto-MOSFET relay and manufacturing method thereof are provided. The manufacturing method of the monolithic Opto-MOSFET relay involves using a low ion doping concentration substrate. In this method, a first P-N junction structure, a second P-N junction structure, and an N-P-N junction structure are formed within an epitaxial layer. Dry etching is employed to divide the epitaxial layer into a high-voltage region and a low-voltage region, which are electrically isolated from the each other. Subsequently, an isolation layer is deposited on the epitaxial layer, and photomask etching is performed to generate multiple patterns. A metal layer is then deposited to form a light emitting diode (LED) based on the pattern within the first P-N junction structure, a photodiode within the second P-N junction structure, and at least one MOSFET within the N-P-N junction structure.

Abstract: The invention provides a silicide capacitive micro electromechanical structure and fabrication method thereof, comprising a substrate, a passivation layer, a silicon layer, a first metal layer, and a dielectric layer. The passivation layer is formed on the substrate; the silicon layer and the first metal layer are formed on the passivation layer. The first metal layer includes a contact part and a conductive part. The contact parts contact at least a part of the silicon layer, and the conductive portion extends away from the silicon layer to electrically connect an external circuit. The dielectric layer is formed on the passivation layer, and at least the silicon layer and the first metal layer are covered by the dielectric layer. After an annealing process is performed, the conductive portion remains in contact with the silicon layer after the silicidation reaction to maintain an electrical connection with the external circuit.

Abstract: A letter download query method may include a terminal sending a letter download query request packet to a satellite network device, where the letter download query request packet includes a service type field and a message ID field, the service type field indicates a service type of the letter download query request packet, and the message ID field indicates an ID of a letter successfully received by the terminal last time. The terminal receives a letter download query result packet from the satellite network device, where the letter download query result packet includes an original letter sending time field and a letter content field, the original letter sending time field indicates original sending time of letter content in the letter content field, and the letter content field indicates letter content from one or more target terminals to the terminal.

Abstract: Embodiments of the present application provide a rotor and a motor. The rotor has a plurality of through-hole groups. Each through-hole group has a plurality of through-holes distributed in a radial direction. The rotor also has auxiliary holes. Each auxiliary hole is located between every two radially adjacent through-holes. A sectional area of each auxiliary hole is less than a sectional area of each through-hole. When a first angle, a second angle and a third angle are defined between three portions of each auxiliary hole and the q-axis respectively, the third angle is greater than or equal to the first angle, and the third angle is less than or equal to the second angle.

Abstract: The present invention provides an integrating method for optoelectronic elements and circuits, including: providing a silicon wafer including a plurality of circuit structures; providing a plurality of optoelectronic element dies, and each optoelectronic element die including a substrate and an optoelectronic element structure; performing a die-to-wafer bonding process so that one optoelectronic element die is correspondingly bonded to one circuit structure of the silicon wafer through the optoelectronic element structure; performing a compression over-molding process to encapsulate the optoelectronic element dies and a surface of the silicon wafer by a molding material; performing a grinding and polishing process to remove an unnecessary portion of the molding material and an unnecessary portion of the substrate of each optoelectronic element die; and performing a dicing process to form a plurality of integrated structures with the optoelectronic elements and the circuits.

Abstract: A clamping instrument (10), mainly comprising: a clamping base (20), a driving base (30), a clamping structure (40), which forms different clamping angles according to the distance between the clamping base (20) and the driving base (30); and a fine adjustment member (50), wherein the fine adjustment member (50) and the driving base (30) can be separated from each other or connected to each other, such that the driving base (30) can move rapidly or step by step relative to the clamping base (20), thereby achieving the aim of rapidly adjusting or finely adjusting the clamping angle of the clamping structure.

Abstract: The present invention provides an ultrasonic array transceiver method and module thereof. The method includes the step (a) providing an ultrasonic pixel array composed of N×M ultrasonic pixels; step (b), determining the number of a plurality of ultrasonic pixel groups in the ultrasonic pixel array; step (c), generate the first sound wave; step (d), transmit the first sound wave to obtain a plurality of second sound waves; step (e), receive the second sound waves, wherein the ultrasonic pixel received the second sound wave is located at the middle position or adjacent to the middle position of the ultrasonic pixel group; step (f), calculating the second sound waves to generate a pixel signal; step (g), repeating steps (c) to (f); and in step (h), determine an image based on pixel signals.

Abstract: A clamping instrument (10), mainly comprising: a clamping base (20), a driving base (30), a clamping structure (40), which forms different clamping angles according to the distance between the clamping base (20) and the driving base (30); and a fine adjustment member (50), wherein the fine adjustment member (50) and the driving base (30) can be separated from each other or connected to each other, such that the driving base (30) can move rapidly or step by step relative to the clamping base (20), thereby achieving the aim of rapidly adjusting or finely adjusting the clamping angle of the clamping structure.

Abstract: The present invention provides an optocoupler, including a substrate, a gallium nitride light emitter, a gallium nitride light sensing switch, a reflective structure and a transmission medium. The gallium nitride light emitter and the gallium nitride light sensing switch are disposed on the substrate and electrically isolated from each other. The gallium nitride light emitter is used for emitting a light signal according to an input signal. The gallium nitride light sensing switch is used for sensing the light signal and generating an output signal accordingly. The reflective structure is used for reflecting the light signal. The transmission medium is at least between the gallium nitride light emitter, the gallium nitride light sensing switch and the reflective structure. The light signal from the gallium nitride light emitter is transmitted in the transmission medium and transmitted obliquely to the gallium nitride light sensing switch after being reflected by the reflective structure.

Abstract: The present disclosure provides a silicon carbide (SiC) opto-thyristor and a method for manufacturing the same. The SiC opto-thyristor includes a SiC substrate, a SiC light emitter and a SiC light-sensitive thyristor. In the method, a SiC epitaxy is mainly formed on the SiC substrate with the doped P-type and N-type semiconductor materials to define the regions for forming the SiC light emitter and the basic structures of the SiC light-sensitive thyristor. A passivation layer is deposited. Conducting channels for the SiC light emitter and the SiC light-sensitive thyristor are formed by an etching process. After patterning a metal conductor layer, a structure of electrical contacts of the SiC light emitter and the SiC light-sensitive thyristor is formed. Then, terminals of an input voltage and an output voltage of the silicon carbide opto-thyristor are formed after a wire bonding process upon the electrical contacts. Finally, a packaging process is performed.

Abstract: The invention provides a silicide capacitive micro electromechanical structure and fabrication method thereof, comprising a substrate, a passivation layer, a silicon layer, a first metal layer, and a dielectric layer. The passivation layer is formed on the substrate; the silicon layer and the first metal layer are formed on the passivation layer. The first metal layer includes a contact part and a conductive part. The contact parts contact at least a part of the silicon layer, and the conductive portion extends away from the silicon layer to electrically connect an external circuit. The dielectric layer is formed on the passivation layer, and at least the silicon layer and the first metal layer are covered by the dielectric layer. After an annealing process is performed, the conductive portion remains in contact with the silicon layer after the silicidation reaction to maintain an electrical connection with the external circuit.

Abstract: The present invention provides an ultrasonic array transceiver method and module thereof. The method includes the step (a) providing an ultrasonic pixel array composed of N×M ultrasonic pixels; step (b), determining the number of a plurality of ultrasonic pixel groups in the ultrasonic pixel array; step (c), generate the first sound wave; step (d), transmit the first sound wave to obtain a plurality of second sound waves; step (e), receive the second sound waves, wherein the ultrasonic pixel received the second sound wave is located at the middle position or adjacent to the middle position of the ultrasonic pixel group; step (f), calculating the second sound waves to generate a pixel signal; step (g), repeating steps (c) to (f); and in step (h), determine an image based on pixel signals.

Abstract: The invention provides a clamping instrument and a clamping assembly, which mainly comprises a positioning base, a moving base, at least two clamping arms connected with the moving base, at least two linkage arms respectively connected with each of the clamping arms and the positioning base, and an actuating rod respectively penetrating through the positioning base and the moving base, wherein the positioning base is rotated circumferentially and fixed axially relative to the actuating rod, and the moving base is rotated circumferentially and moves axially relative to the actuating rod; when the movable rod is rotated circumferentially, a distance between the moving base and the positioning base can be changed, and then each of the clamping arms is linked to be rotated around the moving base to be in an unfolded position or a clamped position so as to clamp a preset site of a human tissue.

Abstract: An emulsion system includes a plurality of monodisperse particle-drops. Each particle-drop is formed by a single elongated drop-carrier particle disposed in an oil-based continuous phase, wherein the single elongated drop-carrier particle comprises an elongate body with an opening at one end thereof. The single elongated drop-carrier particle has a hydrophilic interior region containing an aqueous droplet and a hydrophobic exterior region. The aqueous droplet and/or a surface of the hydrophilic interior region may contain one or more reagents, analytes, labels, reporter molecules, and/or cells.

Abstract: Presented is a humidifier, comprising: a rotatable wick; a means for rotating the wick; characterized in that: the humidifier further comprises a disinfection unit adapted such that different parts of the wick are disinfected when the wick rotates.

Abstract: A fingerprint sensing apparatus is provided. A driving circuit drives a capacitive micromachined ultrasonic transducer (CMUT) array to emit a planar ultrasonic wave to a finger during a transmission period to generate reflected ultrasonic signals. CMUTs receive the reflected ultrasonic signals during a receiving period to generate sensing current signals. A sensing circuit senses the sensing current signals output by the CMUTs to generate fingerprint sensing signals.

Abstract: Embodiments of the present invention provide a method for improving voice call quality. The method is applied to a terminal, and the terminal includes a buffer module. When the buffer module includes voice data, the method includes: determining that the voice data buffered by the buffer module is in an accumulated state; and cutting off an SID frame in the voice data. To be specific, when the SID frame is detected and the voice data buffered by the buffer module is in the accumulated state, the SID frame in the voice data is cut off. The SID frame does not include semantic data. In this way, an amount of to-be-sent voice data is reduced, a packet loss and a sending delay are reduced, voice call quality is improved, and user experience is improved.

Abstract: An ultrasonic fingerprint sensor and an operation method thereof are provided. The ultrasonic fingerprint sensor is adapted to be disposed under a panel of a terminal device. The ultrasonic fingerprint sensor includes an ultrasonic fingerprint sensing array and a controller. The ultrasonic fingerprint sensing array transmits a test ultrasonic signal toward the panel. The controller is coupled to the ultrasonic fingerprint sensing array. The controller determines whether a protective layer is attached to a top of the panel based on a number of echo signals corresponding to the test ultrasonic signal.