Abstract: Thermal interfaces or joints including stepped gaskets and/or shims therein and their methods of making and using are described herein.

Abstract: In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.

Abstract: Solder-carbon nanostructure composites and methods of making and using thereof are described. Such composites can be useful for thermal application and can serve, for example, as thermal interface materials (TIMs).

Abstract: Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9±0.3 mm2-K/W were achieved for the entire polymer-coated CNT interface structure.

Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.

Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

Abstract: Arrays containing carbon nanostructure-oxide-metal diodes, such as carbon nanotube (CNT)-oxide-metal diodes and methods of making and using thereof are described herein. In some embodiments, the arrays contain vertically aligned carbon nanostructures, such as multiwall carbon nanotubes (MWCNTs) coated with a conformal coating of a dielectric layer, such as a metal oxide. The tips of the carbon nanostructures are coated with a low work function metal, such as a calcium or aluminum to form a nanostructure-oxide-metal interface at the tips. The arrays can be used as rectenna at frequencies up to about 40 petahertz because of their intrinsically low capacitance. The arrays described herein produce high asymmetry and non-linearity at low turn on voltages down to 0.3 V and large current densities up to about 7,800 mA/cm2 and a rectification ratio of at least about 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, or 60.

Abstract: Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.

Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

Abstract: Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.

Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

Abstract: Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9±0.3 mm2-K/W were achieved for the entire polymer-coated CNT interface structure.

Abstract: Nano structured surfaces and bulk composite materials which exhibit tunable surface morphology, wettability, thermal conductivity, and total thermal resistance properties, and methods of fabrication and uses thereof are described herein. Arrays of vertically-aligned nanostructures produced via a template assisted fabrication approach using nanoporous templates, or alternatively, via an electropolymerization process are described. As a result, control over the surface morphology and wettability can be achieved using the selective template etching process. The composite materials also demonstrate tunable thermal and electrical properties based on the methods of their fabrication. The arrays of polymeric nanostructures are chemically, mechanically, and thermally robust and can serve as soft substrates with heat dissipation capability for use in the fabrication of thermal management materials, tunable wetting for microfluidic applications, and for use in heterojunction organic photovoltaic cells.

Abstract: Arrays containing carbon nanostructure-oxide-metal diodes, such as carbon nanotube (CNT)-oxide-metal diodes and methods of making and using thereof are described herein. In some embodiments, the arrays contain vertically aligned carbon nanostructures, such as multiwall carbon nanotubes (MWCNTs) coated with a conformal coating of a dielectric layer, such as a metal oxide. The tips of the carbon nanostructures are coated with a low work function metal, such as a calcium or aluminum to form a nanostructure-oxide-metal interface at the tips. The arrays can be used as rectenna at frequencies up to about 40 petahertz because of their intrinsically low capacitance. The arrays described herein produce high asymmetry and non-linearity at low turn on voltages down to 0.3 V and large current densities up to about 7,800 mA/cm2 and a rectification ratio of at least about 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, or 60.

Abstract: Electrical connectors coated with one or more coatings formed of carbon nanotube arrays or sheets, as well as methods of making and using thereof are described herein.

Abstract: In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.

Abstract: Gap pads or gap fillers having independently tunable mechanical and thermal properties and methods of making and using thereof are described herein. The gap pads or gap fillers described can be used, for example, to interface a heat generating source and a heat sink.