Abstract: Electrical connectors coated with one or more coatings formed of carbon nanotube arrays or sheets, as well as methods of making and using thereof are described herein.

Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.

Abstract: Metal-carbon nanotube composites having nanotubes which are uniformly dispersed within the metal matrix of the composite, and which are unbundled or substantially unbundled, have high lengths, and which can be controllably aligned are disclosed herein. Such metal-carbon nanotube composites can show improved electrical, thermal, and mechanical properties, as compared to a pristine metal or metal alloy which does not contain nanotubes dispersed therein. Facile and scalable methods of fabricating such metal-nanocarbon composites are also disclosed.

Abstract: Arrays containing carbon nanostructure-oxide-metal diodes, such as carbon nanotube (CNT)-oxide-metal diodes and methods of making and using thereof are described herein. In some embodiments, the arrays contain vertically aligned carbon nanostructures, such as multiwall carbon nanotubes (MWCNTs) coated with a conformal coating of a dielectric layer, such as a metal oxide. The tips of the carbon nano-structures are coated with a low work function metal, such as a calcium or aluminum to form a nanostructure-oxide-metal interface at the tips. The arrays can be used as rectenna at frequencies up to about 40 petahertz because of their intrinsically low capacitance. The arrays described herein produce high asymmetry and non-linearity at low turn on voltages down to 0.3 V and large current densities up to about 7,800 mA/cm2 and a rectification ratio of at least about 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, or 60.

Abstract: Heat sinks containing polymeric protrusions and single-layered or multilayered or multitiered CNT-based structures, and methods of making and using thereof are described herein.

Abstract: Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9±0.3 mm2?K/W were achieved for the entire polymer-coated CNT interface structure.

Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.

Abstract: Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.

Abstract: Nano structured surfaces and bulk composite materials which exhibit tunable surface morphology, wettability, thermal conductivity, and total thermal resistance properties, and methods of fabrication and uses thereof are described herein. Arrays of vertically-aligned nanostructures produced via a template assisted fabrication approach using nanoporous templates, or alternatively, via an electropolymerization process are described. As a result, control over the surface morphology and wettability can be achieved using the selective template etching process. The composite materials also demonstrate tunable thermal and electrical properties based on the methods of their fabrication. The arrays of polymeric nanostructures are chemically, mechanically, and thermally robust and can serve as soft substrates with heat dissipation capability for use in the fabrication of thermal management materials, tunable wetting for microfluidic applications, and for use in heterojunction organic photovoltaic cells.

Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.

Abstract: Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

Abstract: Phase change material-carbon nanotube-metal substrate composites and methods of making and using thereof are described herein. Such composites allow for thermal storage and passive or combined active/passive thermal control of heat generating sources, such as in electronic devices.

Abstract: Metal-carbon nanotube composites having nanotubes which are uniformly dispersed within the metal matrix of the composite, and which are unbundled or substantially unbundled, have high lengths, and which can be controllably aligned are disclosed herein. Such metal-carbon nanotube composites can show improved electrical, thermal, and mechanical properties, as compared to a pristine metal or metal alloy which does not contain nanotubes dispersed therein. Facile and scalable methods of fabricating such metal-nanocarbon composites are also disclosed.

Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.

Abstract: Arrays containing carbon nanostructure-oxide-metal diodes, such as carbon nanotube (CNT)-oxide-metal diodes and methods of making and using thereof are described herein. In some embodiments, the arrays contain vertically aligned carbon nanostructures, such as multiwall carbon nanotubes (MWCNTs) coated with a conformal coating of a dielectric layer, such as a metal oxide. The tips of the carbon nano-structures are coated with a low work function metal, such as a calcium or aluminum to form a nanostructure-oxide-metal interface at the tips. The arrays can be used as rectenna at frequencies up to about 40 petahertz because of their intrinsically low capacitance. The arrays described herein produce high asymmetry and non-linearity at low turn on voltages down to 0.3 V and large current densities up to about 7,800 mA/cm2 and a rectification ratio of at least about 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, or 60.

Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.

Abstract: Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of various types of foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of foil, including substrates fabricated from carbon (CNT woven arrays, exfoliated graphite sheets, bucky paper, and the like) is disclosed.

Abstract: Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more coatings were measured to produce thermal resistances that are on par with conventional metallic solders. These results were achieved by reducing the high contact resistance at CNT tips and/or sidewalls, which has encumbered the development of high-performance thermal interface materials based on CNTs. Resistances as low as 4.9±0.3 mm2-K/W were achieved for the entire polymer-coated CNT interface structure.

Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.

Abstract: Carbon nanotube (CNT) arrays are attractive thermal interface materials with high compliance and conductance that can remain effective over a wide temperature range. Disclosed herein are CNT interface structures in which free CNT ends are bonded using palladium hexadecanethiolate Pd(SC16H35)2 to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is mechanically stable at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250° C., one-sided and two-sided palladium bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.