Patents by Inventor Barbara Foley

Barbara Foley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030020078
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Optical processing layers can be placed on monocrystalline layers to process photons produced in the monocrystalline layers.
    Type: Application
    Filed: July 25, 2001
    Publication date: January 30, 2003
    Applicant: MOTOROLA, INC.
    Inventors: Tomasz Klosowiak, Kevin Jelley, George Valliath, Barbara Foley Barenburg, Daniel Gamota
  • Publication number: 20030021014
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. The compliant substrate includes an optical laser array configured as a linear optical amplifier.
    Type: Application
    Filed: July 25, 2001
    Publication date: January 30, 2003
    Applicant: MOTOROLA, INC.
    Inventors: Barbara Foley Barenburg, Fred V. Richard
  • Publication number: 20030017640
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.
    Type: Application
    Filed: July 23, 2001
    Publication date: January 23, 2003
    Applicant: MOTOROLA, INC.
    Inventors: Barbara Foley Barenburg, Joyce Yamamoto
  • Publication number: 20030008527
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing laser irradiation in conjunction with molecular beam epitaxy growth techniques.
    Type: Application
    Filed: July 3, 2001
    Publication date: January 9, 2003
    Applicant: MOTOROLA, INC.
    Inventors: Barbara Foley Barenburg, Lyndee L. Hilt
  • Publication number: 20020181825
    Abstract: An integrated circuit that distributes its clock signals optically is provided. The integrated circuit may preferably include a plurality of digital CMOS circuits that communicate optically. The optical devices are preferably formed from compound semiconductor structures.
    Type: Application
    Filed: June 1, 2001
    Publication date: December 5, 2002
    Applicant: MOTOROLA, INC.
    Inventors: Timothy Joe Johnson, Kevin B. Traylor, Duane C. Rabe, Barbara Foley Barenburg
  • Publication number: 20020179930
    Abstract: A composite semiconductor structure includes islands of noncompound semiconductor materials formed on a noncompound substrate, and an optical testing structure. In one embodiment, a scan chain runs through the noncompound substrate (and possibly also through the islands) and terminates in the islands at optical interface elements, one of which is an optical emitter and the other of which is an optical detector. A test device inputs test signals to, and reads test signals from, the scan chain by interfacing optically with the optical interface elements. In another embodiment, an optical detector is formed in the silicon substrate and an optical emitter is formed in the compound semiconductor material. A leaky waveguide communicating with the emitter overlies the detector, and detection by the detector of light emitted by the emitter is an indication of the absence of an intended circuit element between the detector and the leaky side of the waveguide.
    Type: Application
    Filed: June 1, 2001
    Publication date: December 5, 2002
    Applicant: MOTOROLA, INC.
    Inventors: James S. Irwin, Clinton C. Powell, Timothy J. Johnson, Kevin B. Traylor, Duane C. Rabe, Barbara Foley Barenburg
  • Publication number: 20020181828
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. A substrate so formed can be used to implement an optically switched device, such as a mixer, that utilizes optical source and optical detector components.
    Type: Application
    Filed: June 1, 2001
    Publication date: December 5, 2002
    Applicant: MOTOROLA, INC.
    Inventors: James S. Irwin, Timothy J. Johnson, Barbara Foley Barenburg
  • Publication number: 20020144725
    Abstract: Solar cell structures (100) including high quality epitaxial layers of monocrystalline semiconductor materials that are grown overlying monocrystalline substrates (102) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers are disclosed. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer (104) on a silicon wafer. The accommodating buffer (104) layer is a layer of monocrystalline material spaced apart from the silicon wafer by an amorphous interface layer (112) of silicon oxide. The amorphous interface layer (112) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The solar cell structures also include a dye (110) to increase an efficiency of the solar cell.
    Type: Application
    Filed: April 10, 2001
    Publication date: October 10, 2002
    Applicant: Motorola, Inc.
    Inventors: Dirk C. Jordan, Barbara Foley Barenburg, Ravindranath Droopad
  • Publication number: 20020115201
    Abstract: A microwave device has a monolithic microwave integrated circuit (MMIC) disposed therein for applying microwave radiation to a microfluidic structure, such as a chamber, defined in the device. The microwave radiation from the MMIC is useful for heating samples introduced into the microfluidic structure and for effecting lysis of cells in the samples. Microfabrication techniques allow the fabrication of MMICs that perform heating and cell lysing of samples having volumes in the microliter to picoliter range.
    Type: Application
    Filed: March 22, 2001
    Publication date: August 22, 2002
    Inventors: Barbara Foley Barenburg, Jeremy Burdon, Yuk-Tong Chan, Xunhu Dai, Sean Gallagher, Piotr Grodzinski, Robert Marrero, Vijay Nair, David Rhine, Thomas Smekal
  • Publication number: 20020094584
    Abstract: The invention relates to a microfluidic device with microchannels that have separated regions which have a member of a specific binding pair member such as DNA or RNA bound to porous polymer, beads or structures fabricated into the microchannel. The microchannels of the invention are fabricated from plastic and are operatively associated with a fluid propelling component and detector.
    Type: Application
    Filed: December 19, 2001
    Publication date: July 18, 2002
    Applicant: MOTOROLA, INC.
    Inventors: Chan-Long Shieh, Barbara Foley, Huinan Yu, Vi-En Choong
  • Patent number: 6361958
    Abstract: The invention relates to a microfluidic device with microchannels that have separated regions which have a member of a specific binding pair member such as DNA or RNA bound to porous polymer, beads or structures fabricated into the microchannel. The microchannels of the invention are fabricated from plastic and are operatively associated with a fluid propelling component and detector.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: March 26, 2002
    Assignee: Motorola, Inc.
    Inventors: Chan-Long Shieh, Barbara Foley, Huinan Yu, Vi-En Choong
  • Patent number: 6096172
    Abstract: A method of bonding bio-molecules to a test site including providing a substrate having a test site defined on a surface thereof, providing a solution containing a plurality of probe molecules and bonding material, directing light from a light source onto the test site so as to cause the bonding material to bond the probe molecules to the test site.
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: August 1, 2000
    Assignee: Motorola, Inc.
    Inventors: Barbara Foley, Natalia Briones
  • Patent number: 6048699
    Abstract: A method of fabricating one or more arrays of bio-molecule test sites including providing a solution containing bio-molecule probes in contact with the surface of a substrate, using orthogonal acoustic waves to concentrate the bio-molecule probes at a node intersection, bonding the bio-molecule probes on the substrate at the node intersection to form a test site, and removing the solution leaving the bio-molecule probes attached to the surface at the test site. The steps are repeated as often as desired, using different bio-molecule probes, to produce one or more arrays of test sites.
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: April 11, 2000
    Assignee: Motorola, Inc.
    Inventors: Barbara Foley, Fred V. Richard, George N. Maracas, Huinan Yu, Fred Hickernell
  • Patent number: 5243671
    Abstract: An apparatus for coupling light from a laser chip into an unetched and uncoated optical fiber includes a substrate carrier having a V-groove extending axially through the substrate carrier. The fiber has a beveled end with an inner and outer face and is positionable in the plane of the laser chip within the V-groove such that light emitted by the laser chip strikes the inner face of the beveled end and is totally internally reflected into the fiber core.
    Type: Grant
    Filed: December 31, 1991
    Date of Patent: September 7, 1993
    Assignee: GTE Laboratories Incorporated
    Inventors: Emil S. Koteles, Paul Melman, Barbara Foley