Patents by Inventor Baris Dogruoz
Baris Dogruoz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11184994Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.Type: GrantFiled: May 18, 2018Date of Patent: November 23, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Mandy Hin Lam, Vic Hong Chia, M. Baris Dogruoz
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Patent number: 11122705Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.Type: GrantFiled: January 14, 2019Date of Patent: September 14, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mandy Hin Lam, Pirooz Tooyserkani
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Publication number: 20210282301Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.Type: ApplicationFiled: July 14, 2020Publication date: September 9, 2021Inventors: M. Baris Dogruoz, Mandy Hin Lam, Mark Nowell, Rakesh Chopra
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Publication number: 20210235597Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.Type: ApplicationFiled: July 7, 2020Publication date: July 29, 2021Inventors: Rakesh Chopra, M. Baris Dogruoz, Mark Nowell, Mandy Hin Lam
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Publication number: 20210231890Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.Type: ApplicationFiled: July 7, 2020Publication date: July 29, 2021Inventors: Rakesh Chopra, M. Baris Dogruoz, Mark Nowell, Mandy Hin Lam
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Publication number: 20210219415Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.Type: ApplicationFiled: January 15, 2020Publication date: July 15, 2021Applicant: CISCO TECHNOLOGY, INC.Inventors: Joel Richard Goergen, Jessica Kiefer, Ashley Julia Maker Erickson, Yi Tang, M. Baris Dogruoz, Elizabeth Ann Kochuparambil, Shobhana Punjabi
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Publication number: 20210112686Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.Type: ApplicationFiled: November 27, 2019Publication date: April 15, 2021Inventors: M. Baris Dogruoz, Joel Goergen
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Patent number: 10912218Abstract: In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.Type: GrantFiled: September 16, 2019Date of Patent: February 2, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Mehmet Onder Cap, Marc Henry Mantelli, Giridharan Rajagopalan, M. Baris Dogruoz, Robert Gregory Twiss, Joel Richard Goergen
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Publication number: 20200229321Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.Type: ApplicationFiled: January 14, 2019Publication date: July 16, 2020Inventors: M. Baris Dogruoz, Mandy Hin Lam, Pirooz Tooyserkani
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Publication number: 20200163251Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.Type: ApplicationFiled: January 22, 2020Publication date: May 21, 2020Applicant: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, Mandy Hin Lam, M. Baris Dogruoz, Joel Richard Goergen
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Publication number: 20200093031Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.Type: ApplicationFiled: September 14, 2018Publication date: March 19, 2020Applicant: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, Mandy Hin Lam, M. Baris Dogruoz
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Patent number: 10582639Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.Type: GrantFiled: September 14, 2018Date of Patent: March 3, 2020Assignee: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, Mandy Hin Lam, M. Baris Dogruoz
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Publication number: 20190357383Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.Type: ApplicationFiled: May 18, 2018Publication date: November 21, 2019Applicant: Cisco Technology, Inc.Inventors: Mandy Hin Lam, Vic Hong Chia, M. Baris Dogruoz
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Patent number: 10404097Abstract: A power supply system may comprise a plurality of input buses and an output bus. A plurality of multi-input power supplies may be disposed between the plurality of input buses and the output bus. The plurality of multi-input power supplies may be configured to supply a predetermined amount of power to the output bus before and after a failure event. The failure event may comprise at least one of the following: a failure of a one of the plurality of multi-input power supplies and loss of power on one of the plurality of input buses. Each input to the power supply may include an independent power section to support near or full output power in the event of another input power loss. Any input line loss from an independent power bus/grid may provide line redundancy to the power supply and to the power system as an Uninterruptable Power Supply.Type: GrantFiled: January 6, 2017Date of Patent: September 3, 2019Assignee: Cisco Technology, Inc.Inventors: Douglas P. Arduini, Sung Kee Baek, Richard Anthony O'Brien, John Beecroft, M. Baris Dogruoz
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Patent number: 10153261Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.Type: GrantFiled: April 3, 2017Date of Patent: December 11, 2018Assignee: CISCO TECHNOLOGY, INC.Inventors: Baris Dogruoz, Vic Chia, M. Onder Cap
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Publication number: 20180286844Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.Type: ApplicationFiled: April 3, 2017Publication date: October 4, 2018Inventors: Baris Dogruoz, Vic Chia, M. Onder Cap
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Patent number: 9949408Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.Type: GrantFiled: May 27, 2016Date of Patent: April 17, 2018Assignee: Cisco Technology, Inc.Inventors: Vic Chia, M. Baris Dogruoz
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Publication number: 20170347495Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventors: Vic Chia, M. Baris Dogruoz
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Publication number: 20170201122Abstract: A power supply system may comprise a plurality of input buses and an output bus. A plurality of multi-input power supplies may be disposed between the plurality of input buses and the output bus. The plurality of multi-input power supplies may be configured to supply a predetermined amount of power to the output bus before and after a failure event. The failure event may comprise at least one of the following: a failure of a one of the plurality of multi-input power supplies and loss of power on one of the plurality of input buses. Each input to the power supply may include an independent power section to support near or full output power in the event of another input power loss. Any input line loss from an independent power bus/grid may provide line redundancy to the power supply and to the power system as an Uninterruptable Power Supply.Type: ApplicationFiled: January 6, 2017Publication date: July 13, 2017Applicant: Cisco Technology, Inc.Inventors: Douglas P. Arduini, Sung Kee Baek, Richard Anthony O'Brien, John Beecroft, M. Baris Dogruoz
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Patent number: 9379039Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.Type: GrantFiled: September 4, 2013Date of Patent: June 28, 2016Assignee: CISCO TECHNOLOGY, INC.Inventors: Mandy Hin Lam, Hong Tran Huynh, M. Baris Dogruoz