Patents by Inventor Baris Dogruoz

Baris Dogruoz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160128230
    Abstract: A faceplate of a line card is provided, and in one example embodiment, includes a top panel including a portion angled downward towards a front side of the faceplate, the angled portion having a plurality of holes, and a front panel disposed on the front side of the faceplate, attached to the angled portion of the top panel on its top side and having a beveled edge at its bottom side, the angled portion of the top panel and the beveled edge of the front panel facilitating an intake area for air flow between the line card and other parallel line cards assembled on a chassis. In specific embodiments, the plurality of holes are arranged in a honeycomb pattern with each hole comprising a Reuleaux hexagon having rounded corners.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 5, 2016
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Hong Tran Huynh, Vic Hong Chia, M. Baris Dogruoz
  • Publication number: 20160081220
    Abstract: An apparatus includes a frame and one or more heat generating elements supported by the frame. A plurality of ports are located at the front portion of the frame, and are electrically coupled to the heat generating elements. A faceplate is coupled to the front portion of the frame and includes one or more port openings to allow access to the ports and a plurality of airflow openings. Each of the airflow openings has a bottom edge aligned with the front portion of the frame and a top edge aligned with the top portion of the frame. The top edges of the airflow openings are set back a predetermined distance from the front portion of the frame.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 17, 2016
    Inventors: Vic Hong Chia, Hong Tran Huynh, M. Baris Dogruoz
  • Publication number: 20150062820
    Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 5, 2015
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Hong Tran Huynh, M. Baris Dogruoz