Patents by Inventor Bawa Singh

Bawa Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINTERING POWDER
    Publication number: 20150353804
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 10, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20150266137
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.
    Type: Application
    Filed: October 9, 2013
    Publication date: September 24, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20150224604
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
    Type: Application
    Filed: April 28, 2015
    Publication date: August 13, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • HIGH IMPACT TOUGHNESS SOLDER ALLOY
    Publication number: 20140219711
    Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 7, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • SOLDER COMPOSITIONS
    Publication number: 20140199115
    Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 17, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
  • SOLVENT SYSTEMS FOR METALS AND INKS
    Publication number: 20140186524
    Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
    Type: Application
    Filed: December 3, 2013
    Publication date: July 3, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Oscar Khaselev, Michael T. Marczi, Bawa Singh, Nitin Desai
  • METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
    Publication number: 20140153203
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: September 16, 2013
    Publication date: June 5, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • FLUX FORMULATIONS
    Publication number: 20140060703
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 6, 2014
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • Solder alloy
    Patent number: 8641964
    Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: February 4, 2014
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
  • Solvent systems for metals and inks
    Patent number: 8597548
    Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: December 3, 2013
    Assignee: Alpha Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • Methods of attaching a die to a substrate
    Patent number: 8555491
    Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: October 15, 2013
    Assignee: Alpha Metals, Inc.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Methods for producing electrical conductors
    Patent number: 8312623
    Abstract: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: November 20, 2012
    Assignee: Fry's Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • Electrical conductors and methods of making and using them
    Patent number: 8304062
    Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 6, 2012
    Assignee: Fry's Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Supriya Deverajen, Michael T. Marczi, Bawa Singh
  • Reducing joint embrittlement in lead-free soldering processes
    Patent number: 8191757
    Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: June 5, 2012
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
  • SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME
    Publication number: 20120114927
    Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Application
    Filed: November 2, 2011
    Publication date: May 10, 2012
    Inventors: Oscar Khaselev, Bawa Singh, Bin Mo, Michael T. Marczi, Monnir Boureghda
  • PARTICLES AND INKS AND FILMS USING THEM
    Publication number: 20110318478
    Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
  • Particles and inks and films using them
    Patent number: 7968008
    Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 28, 2011
    Assignee: Fry's Metals, Inc.
    Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
  • FLUX FORMULATIONS
    Publication number: 20100139952
    Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
    Type: Application
    Filed: July 2, 2009
    Publication date: June 10, 2010
    Inventors: Sanyogita Arora, Martinus N. Finke, Bawa Singh, Brian Lewis, Michael T. Marczi, Mitchell Holtzer
  • Mask and method for electrokinetic deposition and patterning process on substrates
    Patent number: 7678255
    Abstract: A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: March 16, 2010
    Assignee: Fry's Metals, Inc.
    Inventors: Oscar Khaselev, Brian G. Lewis, Michael Marczi, Bawa Singh
  • Thermal interface material and solder preforms
    Patent number: 7663242
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: February 16, 2010
    Inventors: Brian G. Lewis, Bawa Singh, John P. Laughlin, David V. Kyaw, Anthony E. Ingham, Attiganal N. Sreeram, Leszek Hozer, Michael J. Liberatore, Gerard R. Minogue