Patents by Inventor Benjamin B. Riordon

Benjamin B. Riordon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220212223
    Abstract: An optical device coating assembly is provided. The optical device coating assembly includes a substrate support operable to retain an optical device substrate. The coating assembly further includes a first actuator connected to the substrate support. The first actuator is configured to rotate the substrate support. The coating assembly includes a holder configured to hold a coating applicator against an edge of the optical device substrate when the optical device substrate is rotated on the substrate support and a second actuator operable to apply a force on the holder in a direction towards the substrate support. The second actuator is a constant force actuator.
    Type: Application
    Filed: November 24, 2021
    Publication date: July 7, 2022
    Inventors: Kangkang WANG, Yaseer Arafath AHAMED, Yige GAO, Benjamin B. RIORDON, Rami HOURANI, James D. STRASSNER, Ludovic GODET, Thinh NGUYEN
  • Publication number: 20220189815
    Abstract: Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 16, 2022
    Inventors: Benjamin B. RIORDON, James D. STRASSNER
  • Publication number: 20220161396
    Abstract: Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.
    Type: Application
    Filed: April 22, 2021
    Publication date: May 26, 2022
    Inventors: Yaseer Arafath AHAMED, Kangkang WANG, Benjamin B. RIORDON, James D. STRASSNER, Ludovic GODET
  • Publication number: 20220163792
    Abstract: Embodiments of the present disclosure relate to a carrier mechanism for retaining optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that a plurality of optical device lenses are retained therebetween. The carrier mechanism retains the plurality of optical device lenses without damaging the plurality of optical device lenses by contacting corners of the optical device lenses. The plurality of optical device lenses are retained with a plurality of support pins and a plurality of capture pins disposed in the tray assemblies. Each tray includes a plurality of openings corresponding to the plurality of optical device lenses such that fluids may contact the plurality of optical device lenses. The carrier mechanism may be utilized in multiple processing methods of the plurality of optical device lenses.
    Type: Application
    Filed: May 4, 2021
    Publication date: May 26, 2022
    Inventors: Benjamin B. Riordon, Kangkang Wang
  • Patent number: 11315806
    Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: April 26, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David Blahnik, William T. Weaver
  • Patent number: 11306824
    Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: April 19, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Benjamin B. Riordon, Charles T. Carlson, Aaron Webb, Gary Wyka
  • Patent number: 11264258
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: March 1, 2022
    Assignee: Applied Materials, Inc.
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Patent number: 10969029
    Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: April 6, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Charles T. Carlson, Tammy Jo Pride, Benjamin B. Riordon, Aaron Webb
  • Publication number: 20200279763
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Applicant: Applied Materials, Inc.
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Publication number: 20200217423
    Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 9, 2020
    Inventors: Benjamin B. RIORDON, Charles T. CARLSON, Aaron WEBB, Gary WYKA
  • Patent number: 10699930
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Applied Materials, Inc.
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Publication number: 20190293199
    Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.
    Type: Application
    Filed: December 1, 2017
    Publication date: September 26, 2019
    Inventors: Charles T. CARLSON, Tammy Jo PRIDE, Benjamin B. RIORDON, Aaron WEBB
  • Publication number: 20190259638
    Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.
    Type: Application
    Filed: May 1, 2019
    Publication date: August 22, 2019
    Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David Blahnik, William T. Weaver
  • Patent number: 10283379
    Abstract: Apparatus and methods for heating and cooling a plurality of substrate wafers are provided. LED lamps are positioned against the back sides of a plurality of cold plates. In some embodiments, wafers are supported on a wafer lift which can move all wafers together. In some embodiments, wafers are supported on independent lift pins which can move individual wafers for heating and cooling. Some embodiments of the disclosure provide for decreased time between wafer switching in a processing chamber.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: May 7, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David T. Blahnik, William T. Weaver
  • Publication number: 20190019708
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Application
    Filed: September 11, 2018
    Publication date: January 17, 2019
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Patent number: 10157763
    Abstract: Systems and methods for facilitating expeditious handling and processing of semiconductor substrates with a minimal number of handling devices. Such a system may include an entry load-lock configured to transfer substrates from an atmospheric environment to a vacuum chamber, an alignment station disposed in the vacuum chamber and configured to adjust orientations of substrates, a first vacuum robot configured to move substrates from the entry load-lock to the alignment station, a process station disposed in the vacuum chamber and configured to perform a designated process on substrates, first and second exit load-locks configured to transfer substrates from the vacuum chamber to the atmospheric environment, and a second vacuum robot configured to move substrates from the alignment station to the process station and further configured to move substrates from the process station to the first exit load-lock and to the second exit load-lock in an alternating fashion.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: December 18, 2018
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Robert J. Mitchell, Eric Hermanson, Benjamin B. Riordon
  • Patent number: 10103046
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: October 16, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Patent number: 9863032
    Abstract: Herein, an improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be achieved using a mask for processing the substrate. The mask may be incorporated into a substrate processing system such as, for example, an ion implantation system. The mask may comprise one or more first apertures disposed in a first row; and one or more second apertures disposed in a second row, each row extending along a width direction of the mask, wherein the one or more first apertures and the one or more second apertures are non-uniform.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: January 9, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Kevin M. Daniels, Russell J. Low, Nicholas P. T. Bateman, Benjamin B. Riordon
  • Publication number: 20160307782
    Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
  • Publication number: 20160218028
    Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 28, 2016
    Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David T. Blahnik, William T. Weaver