Patents by Inventor Benjamin D. Briggs

Benjamin D. Briggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190155236
    Abstract: A computer-mediated physical damping feedback system includes a motion damping device, a voltage conversion controller, and a voltage generator controller. The motion damping device is worn by a participant present in a real-world environment, and is configured to vary a moveable flexibility of the participant in response to receiving an electrical voltage. The voltage conversion controller is in signal communication with a computer-mediated environment engine (CMEE) controller, and is configured to determine a voltage level of the electrical voltage based at least in part on the interaction between the participant and a computer-mediated environment. The voltage generator controller is in signal communication with the motion damping device and the voltage conversion controller. The voltage generator controller is configured to generate the electrical voltage at the voltage level that induces the stress applied by the motion damping device.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 23, 2019
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins
  • Publication number: 20190157146
    Abstract: An etch back air gap (EBAG) process is provided. The EBAG process includes forming an initial structure that includes a dielectric layer disposed on a substrate and a liner disposed to line a trench defined in the dielectric layer. The process further includes impregnating a metallic interconnect material with dopant materials, filling a remainder of the trench with the impregnated metallic interconnect materials to form an intermediate structure and drive-out annealing of the intermediate structure. The drive-out annealing of the intermediate structure serves to drive the dopant materials out of the impregnated metallic interconnect materials and thereby forms a chemical- and plasma-attack immune material.
    Type: Application
    Filed: January 17, 2019
    Publication date: May 23, 2019
    Inventors: Benjamin D. Briggs, Elbert Huang, Takeshi Nogami, Christopher J. Penny
  • Patent number: 10297750
    Abstract: A method is presented for forming a semiconductor device. The method includes depositing an insulating layer over a semiconductor substrate, etching the insulating layer to form a plurality of trenches for receiving a first conducting material, forming a resistive switching memory element over at least one trench of the plurality of trenches, the resistive switching memory element having a conducting cap formed thereon, and depositing a dielectric cap over the trenches. The method further includes etching portions of the insulating layer to expose a section of the dielectric cap formed over the resistive switching memory element, etching the exposed section of the dielectric cap to expose the conducting cap of the resistive switching memory element, and forming a barrier layer in direct contact with the exposed section of the conducting cap.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: May 21, 2019
    Assignee: International Business Machines Corporation
    Inventors: Takashi Ando, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang
  • Publication number: 20190148303
    Abstract: Low-temperature techniques for doping of Cu interconnects based on interfacially-assisted thermal diffusion are provided. In one aspect, a method of forming doped copper interconnects includes the steps of: patterning at least one trench in a dielectric material; forming a barrier layer lining the trench; forming a metal liner on the barrier layer; depositing a seed layer on the metal liner; plating a Cu fill into the trench to form Cu interconnects; removing a portion of a Cu overburden to access an interface between the metal liner and the Cu fill; depositing a dopant layer; and diffusing a dopant(s) from the dopant layer along the interface to form a Cu interconnect doping layer between the metal liner and the Cu fill. Alternatively, the overburden and the barrier layer/metal liner can be completely removed, and the dopant layer deposited selectively on the Cu fill. An interconnect structure is also provided.
    Type: Application
    Filed: December 18, 2018
    Publication date: May 16, 2019
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo
  • Publication number: 20190148296
    Abstract: A low aspect ratio interconnect is provided and includes a metallization layer, a liner and a metallic interconnect. The metallization layer includes bottommost and uppermost surfaces. The uppermost surface has a maximum post-deposition height from the bottommost surface at first metallization layer portions. The metallization layer defines a trench at second metallization layer portions. The liner includes is disposed to line the trench and includes liner sidewalls that have terminal edges that extend to the maximum post-deposition height and lie coplanar with the uppermost surface at the first metallization layer portions. The metallic interconnect is disposed on the liner to fill a trench remainder and has an uppermost interconnect surface that extends to the maximum post-deposition height and lies coplanar with the uppermost surface at the first metallization layer portions.
    Type: Application
    Filed: January 17, 2019
    Publication date: May 16, 2019
    Inventors: Benjamin D. Briggs, Elbert E. Huang, RAGHUVEER R. PATLOLLA, CORNELIUS BROWN PEETHALA, DAVID L. RATH, CHIH-CHAO YANG
  • Publication number: 20190148637
    Abstract: A method is presented for forming a semiconductor device. The method includes depositing an insulating layer over a semiconductor substrate, etching the insulating layer to form a plurality of trenches for receiving a first conducting material, forming a resistive switching memory element over at least one trench of the plurality of trenches, the resistive switching memory element having a conducting cap formed thereon, and depositing a dielectric cap over the trenches. The method further includes etching portions of the insulating layer to expose a section of the dielectric cap formed over the resistive switching memory element, etching the exposed section of the dielectric cap to expose the conducting cap of the resistive switching memory element, and forming a barrier layer in direct contact with the exposed section of the conducting cap.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 16, 2019
    Inventors: Takashi Ando, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang
  • Patent number: 10290541
    Abstract: A semiconductor structure includes a dielectric layer having a trench formed therein and a barrier layer formed on a bottom and sidewalls of the trench, and on a top surface of the dielectric layer. The trench comprises a flared top gap opening and additional area at the bottom such that the top and bottom of the trench are wider than sidewalls of the trench. A thickness of the barrier layer on the bottom of the trench and on the top surface of the dielectric layer is controlled using one or more cycles comprising forming an oxidized layer using a neutral beam oxidation and removing the oxidized layer using an etching process, such that the thickness of the barrier layer on the bottom of the trench and on the top surface of the dielectric layer is substantially the same as the thickness of the barrier layer on sidewalls of the trench.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: May 14, 2019
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo, Chih-Chao Yang
  • Patent number: 10276436
    Abstract: A method of forming a semiconductor device having a vertical metal line interconnect (via) fully aligned to a first direction of a first interconnect layer and a second direction of a second interconnect layer in a selective recess region by forming a plurality of metal lines in a first dielectric layer; and recessing in a recess region first portions of the plurality of metal lines such that top surfaces of the first portions of the plurality of metal lines are below a top surface of the first dielectric layer; wherein a non-recess region includes second portions of the plurality of metal lines that are outside the recess region.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: April 30, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert
  • Patent number: 10276190
    Abstract: Monitoring and analysis of a user's speech to detect symptoms of a mental health disorder by continuously monitoring a user's speech in real-time to generate audio data based, transcribing the audio data to text and analyzing the text of the audio data to determine a sentiment of the audio data is disclosed. A trained machine learning model may be applied to correlate the text and the determined sentiment to clinical information associated with symptoms of a mental health disorder to determine whether the symptoms are a symptom event. The initial determination may be transmitted to a second device to determine (and/or verify) whether or not the symptom event was falsely recognized. The trained machine learning model may be updated based on a response from the second device.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: April 30, 2019
    Assignee: International Business Machines Corporation
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger
  • Patent number: 10276053
    Abstract: Techniques for motivating a user during a workout using different coaching styles are provided. In one aspect, a method for motivational coaching of a user during workout sessions includes the steps of: selecting a coaching style for the user based on input from the user and from coaching styles used for at least one other user; determining, during a workout session, whether the coaching style should be changed to enhance performance of the user based on data obtained from the user via a mobile device worn by the user; changing the coaching style if it is determined that the coaching style should be changed to enhance performance of the user; continuing with a current coaching style if it is determined that the coaching style should not be changed; and providing feedback to the user during the workout session based on the coaching style.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: April 30, 2019
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo
  • Publication number: 20190122177
    Abstract: A delivery system is provided. In the delivery system, drones deliver items in a serviced area and charging stations are distributed throughout the serviced area. Each charging station is configured to charge one or more of the drones. The delivery system further includes a processor that is communicative with at least the charging stations. The processor is configured to dynamically route delivery operations of each of the drones in accordance with one or more parameters. The processor is further configured to communicate with individuals involved with the delivery operations in accordance with any of the charging stations being associated with the delivery operations.
    Type: Application
    Filed: October 19, 2017
    Publication date: April 25, 2019
    Inventors: BENJAMIN D. BRIGGS, LAWRENCE A. CLEVENGER, LEIGH A. CLEVENGER, CHRISTOPHER J. PENNY, MICHAEL RIZZOLO, ALDIS G. SIPOLINS
  • Publication number: 20190122911
    Abstract: One or more processors determine a predicted sorting bin of a semiconductor device, based on measurement and test data performed on the semiconductor device subsequent to a current metallization layer. A current predicted sorting bin and a target soring bin are determined by a machine learning model for the semiconductor device; the target bin include higher performance semiconductor devices than the predicted sorting bin. The model determines a performance level improvement attainable by adjustments made to process parameters of subsequent metallization layers of the semiconductor device. Adjustments to process parameters are generated, based on measurement and test data of the current metallization layer of semiconductor device, and the adjustment outputs for the process parameters of the subsequent metallization layers of the semiconductor device are made available to the one or more subsequent metallization layer processes by a feed-forward mechanism.
    Type: Application
    Filed: October 24, 2017
    Publication date: April 25, 2019
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas A. Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James Stathis
  • Publication number: 20190114671
    Abstract: Three-dimensional positional spatial olfaction for virtual marketing associates a product with a product location within a virtual reality environment and identifies a product aroma associated with the product. A distance and a direction from the product location to a positional presence of a participant within the virtual reality environment is determined, and the product aroma is delivered to the participant in accordance with the distance and the direction. Delivery of the product aroma to the participant in accordance with the distance and the direction is used to lead the participant through the virtual reality environment to the product location where an interface for obtaining a physical copy of the product is displayed to the participant.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 18, 2019
    Inventors: Benjamin D. BRIGGS, Lawrence A. CLEVENGER, Leigh Anne H. CLEVENGER, Christoper J. PENNY, Michael RIZZOLO, Aldis SIPOLINS
  • Patent number: 10256191
    Abstract: A semiconductor device is provided and includes first and second dielectrics, first and second conductive elements, a self-formed-barrier (SFB) and a liner. The first and second dielectrics are disposed with one of first-over-second dielectric layering and second-over-first dielectric layering. The first and second conductive elements are respectively suspended at least partially within a lower one of the first and second dielectrics and at least partially within the other one of the first and second dielectrics. The self-formed-barrier (SFB) is formed about a portion of one of the first and second conductive elements which is suspended in the second dielectric. The liner is deposited about a portion of the other one of the first and second conductive elements which is partially suspended in the first dielectric.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: April 9, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas A. Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo
  • Patent number: 10242909
    Abstract: A method for forming a conductive structure for a semiconductor device includes depositing a barrier layer in a trench formed in a dielectric material and forming an interface layer over the barrier layer. A main conductor is formed over the interface layer, and the main conductor is recessed selectively to the interface layer and the barrier layer to a position below a top surface of the dielectric layer. The interface layer is selectively wet etched to the main conductor and the barrier layer using a chemical composition having an oxidizer, wherein the chemical composition is buffered to include a pH above 7. The barrier layer is selectively etching to the main conductor and the interface layer.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: March 26, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Cornelius B. Peethala, David L. Rath
  • Patent number: 10229851
    Abstract: An etch back air gap (EBAG) process is provided. The EBAG process includes forming an initial structure that includes a dielectric layer disposed on a substrate and a liner disposed to line a trench defined in the dielectric layer. The process further includes impregnating a metallic interconnect material with dopant materials, filling a remainder of the trench with the impregnated metallic interconnect materials to form an intermediate structure and drive-out annealing of the intermediate structure. The drive-out annealing of the intermediate structure serves to drive the dopant materials out of the impregnated metallic interconnect materials and thereby forms a chemical- and plasma-attack immune material.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: March 12, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Elbert Huang, Takeshi Nogami, Christopher J. Penny
  • Patent number: 10229967
    Abstract: Capacitors and methods of forming the same include forming a gap in a dielectric layer underneath one or more conducting lines, such that the one or more conducting lines are suspended over the gap. A capacitor stack is deposited in the gap and on the conducting lines. Respective contacts are deposited on the conducting lines and on the capacitor stack.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20190067087
    Abstract: A method of forming a semiconductor device includes forming a dielectric spacer along sidewalls of a plurality of interconnect openings extending through a sacrificial dielectric layer and a first dielectric layer until a top portion of a first conductive material, the dielectric spacer includes a dielectric material having a dielectric constant higher than a dielectric constant of the sacrificial dielectric layer and higher than a dielectric constant of the first dielectric layer, conformally depositing a barrier liner within the plurality of interconnect openings above and in direct contact with the dielectric spacer, filling the interconnect openings with a second conductive material, removing the sacrificial dielectric layer to expose portions of the dielectric spacer above the first dielectric layer, and reducing a thickness of exposed portions of the dielectric spacer.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 28, 2019
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha
  • Patent number: 10211151
    Abstract: A method of forming a self-aligned pattern of vias in a semiconductor device comprises etching a pattern of lines that contain notches that are narrower than other parts of the line. Thereafter, vias are created where the notches are located. The locations of the vias are such that the effect of blown-out areas is minimized. Thereafter, the lines are etched and the vias and line areas are filled. The layers are planarized such that the metal fill is level with a surrounding ultra-low-k dielectric. Additional metal layers, lines, and vias can be created. Other embodiments are also described herein.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: February 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Michael Rizzolo, Nicole A. Saulnier
  • Patent number: 10211153
    Abstract: A low aspect ratio interconnect is provided and includes a metallization layer, a liner and a metallic interconnect. The metallization layer includes bottommost and uppermost surfaces. The uppermost surface has a maximum post-deposition height from the bottommost surface at first metallization layer portions. The metallization layer defines a trench at second metallization layer portions. The liner includes is disposed to line the trench and includes liner sidewalls that have terminal edges that extend to the maximum post-deposition height and lie coplanar with the uppermost surface at the first metallization layer portions. The metallic interconnect is disposed on the liner to fill a trench remainder and has an uppermost interconnect surface that extends to the maximum post-deposition height and lies coplanar with the uppermost surface at the first metallization layer portions.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: February 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang