Patents by Inventor Benjamin D. Briggs

Benjamin D. Briggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11488863
    Abstract: A method for manufacturing a semiconductor device includes forming a plurality of memory elements on a first interconnect level, and forming an etch stop layer on the plurality of memory elements. A dielectric layer is formed on the etch stop layer, and a portion of the dielectric over the plurality of memory elements is removed to expose a portion of the etch stop layer. The method further includes removing the exposed portion of the etch stop layer. The removing of the portion of the dielectric layer and of the exposed portion of the etch stop layer forms a trench. A metallization layer is formed in the trench on the plurality of memory elements, wherein the metallization layer is part of a second interconnect level.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: November 1, 2022
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo
  • Publication number: 20220223402
    Abstract: Processing methods may be performed to form a filled contact hole in a mirror layer of a semiconductor substrate. The method may include forming a contact hole through a mirror layer of the semiconductor substrate by an etch process. The method may include filling the contact hole with a fill material. A portion of the fill material may overlie the mirror layer. The method may also include removing a portion of the fill material external to the contact hole by chemical mechanical polishing landing on the mirror layer.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 14, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan, Joseph Salfelder
  • Publication number: 20220181205
    Abstract: A method of forming a semiconductor device having a vertical metal line interconnect (via) fully aligned to a first direction of a first interconnect layer and a second direction of a second interconnect layer in a selective recess region by forming a plurality of metal lines in a first dielectric layer; and recessing in a recess region first portions of the plurality of metal lines such that top surfaces of the first portions of the plurality of metal lines are below a top surface of the first dielectric layer; wherein a non-recess region includes second portions of the plurality of metal lines that are outside the recess region.
    Type: Application
    Filed: January 10, 2022
    Publication date: June 9, 2022
    Inventors: Benjamin D. Briggs, Jessica Dechene, Elbert Huang, Joe Lee, Theodorus E. Standaert
  • Patent number: 11348872
    Abstract: A semiconductor device is provided and includes first and second dielectrics, first and second conductive elements, a self-formed-barrier (SFB) and a liner. The first and second dielectrics are disposed with one of first-over-second dielectric layering and second-over-first dielectric layering. The first and second conductive elements are respectively suspended at least partially within a lower one of the first and second dielectrics and at least partially within the other one of the first and second dielectrics. The self-formed-barrier (SFB) is formed about a portion of one of the first and second conductive elements which is suspended in the second dielectric. The liner is deposited about a portion of the other one of the first and second conductive elements which is partially suspended in the first dielectric.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: May 31, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas A. Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo
  • Patent number: 11348060
    Abstract: Aspects include a system, method and computer program product for delivering a package via an unmanned aerial vehicle (UAV). A delivery parameter for delivering the package via the UAV is obtained. A weather parameter related to the delivery parameter is obtained. A flight configured for the UAV is selected, wherein the selected flight configuration reduces a delivery cost of the package via the UAV based on the weather parameter and the delivery parameter. The package is delivered using the selected flight configuration of the UAV.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 31, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Leigh Anne H. Clevenger, Aldis Sipolins, Michael Rizzolo, Lawrence A. Clevenger, Christopher J. Penny
  • Publication number: 20220163707
    Abstract: Processing methods may be performed to form a grounded mirror structure on a semiconductor substrate. The methods may include revealing a metal layer. The metal layer may underlie a spacer layer. The metal layer may be revealed by a dry etch process. The method may include forming a mirror layer overlying the spacer layer and the metal layer. The mirror layer may contact the metal layer. The method may also include forming an oxide inclusion overlying a portion of the mirror layer. The portion of the mirror layer may be external to the spacer layer.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan
  • Publication number: 20220165912
    Abstract: Processing methods may be performed to form a pixel material in a semiconductor substrate. The methods may include forming a lithographic mask overlying the semiconductor substrate. The lithographic mask may include a window. The method may include forming a via in the semiconductor substrate by a dry etch process through the window. The method may also include forming the pixel material by depositing a fill material in the via.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan
  • Publication number: 20220163845
    Abstract: Processing methods may be performed to form a pixel material in a semiconductor substrate. The methods may include forming a lithographic mask overlying the semiconductor substrate. The lithographic mask may include a window. The method may include forming a via in the semiconductor substrate by a dry etch process through the window. The method may also include forming the pixel material by depositing a fill material in the via.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan
  • Publication number: 20220163834
    Abstract: Processing methods may be performed to form a pixel isolation structure on a semiconductor substrate. The method may include forming a pixel isolation bilayer on the semiconductor substrate. The pixel isolation bilayer may include a high-k layer overlying a stopping layer. The method may include forming a lithographic mask on a first region of the pixel isolation bilayer. The method may also include etching the pixel isolation bilayer external to the first region. The etching may reveal the semiconductor substrate. The etching may form the pixel isolation structure.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Zihao Yang
  • Publication number: 20220163846
    Abstract: Processing methods may be performed to forming a pixel material in a semiconductor structure. The methods may include forming a sacrificial hardmask overlying an uppermost layer of an optical stack of the semiconductor structure, the uppermost layer having a thickness. The methods may include forming a via through the sacrificial hardmask in the optical stack by a first etch process unselective to a metal layer of the semiconductor structure. The methods may include filling the via with a fill material, wherein a portion of the fill material extends over the sacrificial hardmask and contacts the metal layer. The methods may include removing a portion of the fill material external to the via by a removal process selective to the fill material. The methods may also include removing the sacrificial hardmask by a second etch process selective to the sacrificial hardmask while maintaining the thickness of the uppermost layer.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Lan Yu, Benjamin D. Briggs, Tyler Sherwood, Raghav Sreenivasan
  • Patent number: 11276636
    Abstract: Chamfer-less via interconnects and techniques for fabrication thereof with a protective dielectric arch are provided. In one aspect, a method of forming an interconnect includes: forming metal lines in a first dielectric; depositing an etch stop liner onto the first dielectric; depositing a second dielectric on the etch stop liner; patterning vias and a trench in the second dielectric, wherein the vias are present over at least one of the metal lines, and wherein the patterning forms patterned portions of the second dielectric/etch stop liner over at least another one of the metal lines; forming a protective dielectric arch over the at least another one of the metal lines; and filling the vias/trench with a metal(s) to form the interconnect which, due to the protective dielectric arch, is in a non-contact position with the at least another one of the metal lines. An interconnect structure is also provided.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 15, 2022
    Assignee: International Business Machines Corporation
    Inventors: Lawrence A. Clevenger, Koichi Motoyama, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Benjamin D. Briggs, Michael Rizzolo
  • Patent number: 11263068
    Abstract: Methods and systems for printing accurate three-dimensional structures include printing an original three-dimensional structure according to an original three-dimensional model. The original three-dimensional model is adjusted to reduce measured differences between the printed three-dimensional structure and the original three-dimensional model, by adding material to the original three-dimensional model in proportion to an amount of thermal contraction in a region. An adjusted three-dimensional structure is printed according to the adjusted three-dimensional model.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: March 1, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis G. Sipolins
  • Patent number: 11257717
    Abstract: A method of forming a semiconductor device having a vertical metal line interconnect (via) fully aligned to a first direction of a first interconnect layer and a second direction of a second interconnect layer in a selective recess region by forming a plurality of metal lines in a first dielectric layer; and recessing in a recess region first portions of the plurality of metal lines such that top surfaces of the first portions of the plurality of metal lines are below a top surface of the first dielectric layer; wherein a non-recess region includes second portions of the plurality of metal lines that are outside the recess region.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: February 22, 2022
    Assignee: Tessera, Inc.
    Inventors: Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert
  • Patent number: 11195993
    Abstract: Encapsulation topography-assisted techniques for forming self-aligned top contacts in MRAM devices are provided. In one aspect, a method for forming an MRAM device includes: forming MTJs on interconnects embedded in a first dielectric; depositing an encapsulation layer over the MTJs; burying the MTJs in a second dielectric; patterning a trench in the second dielectric over the MTJs exposing the encapsulation layer over tops of the MTJs which creates a topography at the trench bottom; forming a metal line in the trench over the topography; recessing the metal line which breaks up the metal line into segments separated by exposed peaks of the encapsulation layer; recessing the exposed peaks of the encapsulation layer to form recesses at the tops of the MTJs; and forming self-aligned contacts in the recesses. An MRAM device is also provided.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: December 7, 2021
    Assignee: International Business Machines Corporation
    Inventors: Michael Rizzolo, Nicholas Anthony Lanzillo, Benjamin D. Briggs, Lawrence A. Clevenger
  • Patent number: 11164377
    Abstract: Methods and systems of navigating within a virtual environment are described. In an example, a processor may generate a portal that includes a set of portal boundaries. The processor may display the portal within a first scene of the virtual environment being displayed on a device. The processor may display a second scene of the virtual environment within the portal boundaries. The processor may receive sensor data indicating a movement of a motion controller. The processor may reposition the portal and the second scene in the first scene based on the sensor data, wherein the first scene remains stationary on the device during the reposition of the portal and the second scene. The processor may translate a location of the portal within the first scene to move the portal towards a user of the device until the second scene replaces the first scene being displayed on the device.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: November 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Aldis Sipolins, Lawrence A. Clevenger, Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Patrick Watson
  • Publication number: 20210335706
    Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.
    Type: Application
    Filed: June 7, 2021
    Publication date: October 28, 2021
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Patent number: 11158584
    Abstract: A semiconductor device and method for forming the semiconductor device are described. The method includes recessing a device pad to below a top surface of an interconnect layer and depositing a cap in the recess over the device pad. A topography assist layer is formed over each of at least one alignment mark using a selective deposition process that deposits material on conductive material of the at least one alignment mark selective to the metal nitride of the device pad such that a top surface of the topography assist feature is higher than a top surface of the cap. Device layers are deposited conformally over the interconnect layer such that the topography assist layer causes a topographical feature in a top surface of the deposited device layers, the topographical feature being vertically aligned with the topography assist layer. The device pad is aligned according to the topographical feature.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Michael Rizzolo, Chih-Chao Yang, Lawrence A. Clevenger, Benjamin D. Briggs
  • Patent number: 11138890
    Abstract: The present invention may receive a plurality of unlock instructions based on determining a location is secured from access by the drone. The present invention may use the plurality of received unlock instructions to access the location with an access device while determining the drone is present at the drop off location. The present invention may use the plurality of received unlock instructions to re-secure the location with the access device when determining successful delivery of a package by the drone, and may monitor a security of the location.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 5, 2021
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins
  • Patent number: 11132712
    Abstract: Three-dimensional positional spatial olfaction for virtual marketing associates a product with a product location within a virtual reality environment and identifies a product aroma associated with the product. A distance and a direction from the product location to a positional presence of a participant within the virtual reality environment is determined, and the product aroma is delivered to the participant in accordance with the distance and the direction. Delivery of the product aroma to the participant in accordance with the distance and the direction is used to lead the participant through the virtual reality environment to the product location where an interface for obtaining a physical copy of the product is displayed to the participant.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 28, 2021
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christoper J. Penny, Michael Rizzolo, Aldis Sipolins
  • Patent number: 11101172
    Abstract: Techniques for dielectric damage-free interconnects are provided. In one aspect, a method for forming a Cu interconnect structure includes: forming a via and trench in a dielectric over a metal line M1; depositing a first barrier layer into the via and trench; removing the first barrier layer from the via and trench bottoms using neutral beam oxidation, and removing oxidized portions of the first barrier layer such that the first barrier layer remains along only sidewalls of the via and trench; depositing Cu into the via in direct contact with the metal line M1 to form a via V1; lining the trench with a second barrier layer; and depositing Cu into the trench to form a metal line M2. The second barrier layer can instead include Mn or optionally CuMn so as to further serve as a seed layer. A Cu interconnect structure is also provided.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: August 24, 2021
    Assignee: International Business Machines Corporation
    Inventors: Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger