Abstract: A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to individual fuses on a semiconductor device subsequent to testing the semiconductor device is disclosed. A method and system for sealing exposed fuses on a semiconductor device is disclosed which allows the sealing step to be performed either prior to or following singulation of the semiconductor device into individual dice.

Abstract: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

Abstract: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element.

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract: An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.

Abstract: A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract: A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.

Abstract: A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided.

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate.