Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.

Abstract: A sensor apparatus for an inkjet printing device is provided. The sensor apparatus may include 1) at least one print head adapted to deposit ink on a top surface of a substrate, wherein the substrate is in motion relative to the print head, 2) at least one sensor adapted to detect the distance of the at least one sensor from the top surface of the substrate, and 3) a controller adapted to determine the substrate to nozzle distance based on the distance of the sensor to the top surface of the substrate, and adjust the trajectory of the ink being deposited on the substrate based on the substrate to nozzle distance. Numerous other aspects are provided.

Abstract: A method and apparatus for testing a plurality of electronic devices on a large area substrate is described. The apparatus includes a prober positioning assembly coupled to a substrate support within a testing chamber. The substrate support is a testing table capable of movement in X, Y and Z axes and the prober positioning assembly is capable of movement relative to the testing table. A prober exchanger is positioned adjacent the testing chamber and facilitates prober transfer through cooperative and relative movement with the prober positioning assembly. A load lock chamber having a single transfer door actuator, an atmospheric substrate lift, and a plurality of substrate alignment members is also described.

Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.

Abstract: A method and integrated system for electron beam testing a substrate is provided. In one aspect, the integrated system includes an electron beam testing chamber having a substrate table disposed therein. The substrate table is capable of moving a substrate within the testing chamber in both horizontal and vertical directions. The system also includes a load lock chamber disposed adjacent a first side of the testing chamber, and a prober storage assembly disposed beneath the testing chamber. A prober transfer assembly is disposed adjacent a second side of the testing chamber and arranged to transfer one or more probers between the prober storage assembly and the testing chamber. Further, one or more electron beam testing devices are disposed on an upper surface of the testing chamber.

Abstract: A substrate table and method for supporting and transferring a substrate are provided. The substrate table includes a segmented stage having an upper surface for supporting a substrate, and an end effector. The end effector includes two or more spaced apart fingers and an upper surface for supporting a substrate. The end effector is at least partially disposed and moveable within the segmented stage such that the fingers of the end effector and the segmented stage interdigitate to occupy the same horizontal plane. The segmented stage is adapted to raise and lower about the end effector.

Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.

Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.

Abstract: A method and integrated system for electron beam testing a substrate is provided. In one aspect, the integrated system includes a transfer chamber having a substrate table disposed therein. The substrate table is capable of moving a substrate within the testing chamber in both horizontal and vertical directions. The substrate table includes a first stage moveable in a first dimension, a second stage moveable in a second dimension, and a third stage moveable in a third dimension. Each stage moves independently in its respective dimension. The system also includes a load lock chamber disposed adjacent a first side of the testing chamber, and a prober storage assembly disposed beneath the testing chamber. A prober stack assembly is disposed adjacent a second side of the testing chamber and arranged to transfer one or more probers between the prober storage assembly and the testing chamber. Further, one or more electron beam testing devices are disposed on an upper surface of the testing chamber.

Abstract: An integrated injection logic circuit having improved operating characteristics is provided, comprising an inverted, multiple-collector transistor having base regions characterized by a central active portion surrounded by a heavily-doped extrinsic base region to which the base contact is made. Using ion implantation, each active portion of the base region is provided with a dopant concentration which increases with distance from the collector junction, thereby increasing transistor speed and gain. The extrinsic portion of the base reduces series resistance for multicollector transistors, provides heavy doping at the surface for good ohmic base contacts; and most importantly, defines the active emitter-base regions. The effective or "active" collector-to-emitter area ratio of the device is improved by more than 50:1 compared with prior devices.

Abstract: Disclosed is a method of fabricating dielectrically isolated semiconductor components of an integrated circuit, and the semiconductor component formed by this method, each component having a plurality of high conductivity regions extending from the interior of said component to the surface thereof to provide high conductivity paths to selected semiconductor regions of the component.

Abstract: A self-aligning process for fabrication of integrated circuits utilizing ion implantation to effect doping. A composed masking technique is used to define self-aligned areas in a silicon oxide layer for definition of isolation, base, resistor and collector contact regions. Only two oxide removal steps are required for isolation through emitter process steps, and the process uses the silicon oxide layer and photoresist material for implantation masking. Formation of the emitter region by ion implantation and by diffusion are described.