Patents by Inventor BENJAMIN STASSEN COOK

BENJAMIN STASSEN COOK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensing using quantum molecular rotational state transitions
    Patent number: 10551265
    Abstract: A pressure transducer includes a cavity, a first dipolar molecule disposed within the cavity, and a second dipolar molecule disposed within the cavity. The first dipolar molecule exhibits a quantum rotational state transition at a fixed frequency with respect to cavity pressure. The second dipolar molecule exhibits a quantum rotation state transition at a frequency that varies with cavity pressure.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: February 4, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Django Trombley, Adam Joseph Fruehling, Juan Alejandro Herbsommer
  • PROGRAMMING REACTIVE COMPONENTS
    Publication number: 20200035550
    Abstract: Electronic device manufacturing and configuration methods include performing an additive deposition process that deposits a conductive, resistive, magnetic, semiconductor and/or thermally conductive material over a surface of a processed wafer metallization structure to set or adjust a circuit of a capacitor, an inductor, a resistor, an antenna and/or a thermal component of the metallization structure.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Applicant: Texas Instruments Incorporated
    Inventors: Paul Merle Emerson, Benjamin Stassen Cook
  • ADDITIVELY MANUFACTURED PROGRAMMABLE RESISTIVE JUMPERS
    Publication number: 20200035599
    Abstract: A first conductive routing structure is electrically connected to a first electronic component. A second conductive routing structure is electrically connected to a second electronic component. An additive deposition process deposits a material over a surface of a processed wafer to form a conductive or resistive structure, which extends from a portion of the first conductive routing structure to a portion of the second conductive routing structure, to configure a circuit including the first and second electronic components.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Applicant: Texas Instruments Incorporated
    Inventors: Paul Merle Emerson, Benjamin Stassen Cook
  • Methods for depositing a measured amount of a species in a sealed cavity
    Patent number: 10544039
    Abstract: Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: January 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Kurt Wachtler, Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs
  • Contactless interface for mm-wave near field communication
    Patent number: 10547350
    Abstract: A system is provided in which a first waveguide has a first resonator coupled to an end of the first waveguide. A second waveguide has a second resonator coupled to the second waveguide. The first resonator is spaced apart from the second resonator by a gap distance. Transmission of a signal propagated by the first waveguide across the gap to the second waveguide is enhanced by a confined near field mode magnetic field produced by the first resonator in response to the propagating wave that is coupled to the second resonator.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: January 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Swaminathan Sankaran
  • Integrated circuit nanoparticle thermal routing structure over interconnect region
    Patent number: 10529641
    Abstract: An integrated circuit has a thermal routing structure above a top interconnect level. The top interconnect level includes interconnects connected to lower interconnect levels, and does not include bond pads, probe pads, input/output pads, or a redistribution layer to bump bond pads. The thermal routing structure extends over a portion, but not all, of a plane of the integrated circuit containing the top interconnect level. The thermal routing structure includes a layer of nanoparticles in which adjacent nanoparticles are attached to each other. The layer of nanoparticles is free of an organic binder material. The thermal routing structure has a thermal conductivity higher than the metal in the top interconnect level. The layer of nanoparticles is formed by an additive process.
    Type: Grant
    Filed: November 26, 2016
    Date of Patent: January 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Archana Venugopal, Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering
  • Galvanic isolation device
    Patent number: 10529796
    Abstract: A galvanic isolation device includes a first integrated circuit (IC) die that has communication circuitry formed in a circuit layer below the top surface. A first conductive plate is formed on the IC die proximate the top surface, and is coupled to the communication circuitry. A dielectric isolation layer is formed over a portion of the top surface of the IC after the IC is fabricated such that the dielectric isolation layer completely covers the conductive plate. A second conductive plate is juxtaposed with the first conductive plate but separated by the dielectric isolation layer such that the first conductive plate and the second conductive plate form a capacitor. The second conductive plate is configured to be coupled to a second communication circuit.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: January 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Barry Jon Male, Robert Alan Neidorff
  • Methods and apparatus for magnetically compensated chip scale atomic clock
    Patent number: 10520900
    Abstract: In described examples, an apparatus includes a physics cell and an electronic circuit. The physics cell includes an atomic chamber, a laser source, a modulator, a photodetector and a field coil. The electronic circuit includes a frequency synthesizer, a controller and a digital to analog converter.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: December 31, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bradley Allen Kramer, Benjamin Stassen Cook, Juan Alejandro Herbsommer
  • Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Patterned Into Zones Of Electrical Conductance And Insulation
    Publication number: 20190371624
    Abstract: A device comprises a substrate and an adhesive nanoparticle layer patterned into zones of electrical conductance and insulation on top of the substrate surface. A diffusion region adjoining the surface comprises an admixture of the nanoparticles in the substrate material. When the nanoparticle layer is patterned from originally all-conductive nanoparticles, the insulating zones are created by selective oxidation; when the nanoparticle layer is patterned from originally all-non-conductive nanoparticles, the conductive zones are created by depositing selectively a volatile reducing agent. A package of insulating material is in touch with the nanoparticle layer and fills any voids in the nanoparticle layer.
    Type: Application
    Filed: July 1, 2019
    Publication date: December 5, 2019
    Inventors: Benjamin Stassen Cook, Yong Lin
  • Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
    Patent number: 10497651
    Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. An electromagnetic interference (EMI) shield is provided by a photonic bandgap (PBG) structure that is included within the encapsulation material. The PBG structure is configured to have a photonic bandgap with a frequency range approximately equal to a range of frequencies that may cause EMI.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: December 3, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Hermetically sealed molecular spectroscopy cell with dual wafer bonding
    Patent number: 10493722
    Abstract: A method includes forming a plurality of layers of an oxide and a metal on a substrate. For example, the layers may include a metal layer sandwiched between silicon oxide layers. A non-conductive structure such as glass is then bonded to one of the oxide layers. An antenna can then be patterned on the non-conductive structure, and a cavity can be created in the substrate. Another metal layer is deposited on the surface of the cavity, and an iris is patterned in the metal layer to expose the one of the oxide layers. Another metal layer is formed on a second substrate and the two substrates are bonded together to thereby seal the cavity.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 3, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Simon Joshua Jacobs
  • Launch structures for a hermetically sealed cavity
    Patent number: 10498001
    Abstract: An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction. Various types of launch structures are disclosed herein.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: December 3, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Benjamin Stassen Cook, Juan Alejandro Herbsommer, Swaminathan Sankaran
  • Launch topology for field confined near field communication system
    Patent number: 10461810
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. A reflective surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic towards the port region.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: October 29, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun
  • BOND WIRE SUPPORT SYSTEMS AND METHODS
    Publication number: 20190326247
    Abstract: A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 24, 2019
    Inventors: MATTHEW DAVID ROMIG, BENJAMIN STASSEN COOK
  • Galvanic signal path isolation in an encapsulated package using a photonic structure
    Patent number: 10444432
    Abstract: An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: October 15, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Pressure measurement based on electromagnetic signal output of a cavity
    Patent number: 10444102
    Abstract: A pressure transducer includes a cavity, dipolar molecules disposed within the cavity, and pressure measurement circuitry. The pressure measurement circuitry is configured to measure a width of an absorption peak of the dipolar molecules, and to determine a value of pressure in the cavity based on the width of the absorption peak.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: October 15, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan Alejandro Herbsommer, Adam Joseph Fruehling, Swaminathan Sankaran, Benjamin Stassen Cook
  • Staggered back-to-back launch topology with diagonal waveguides for field confined near field communication system
    Patent number: 10425793
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. The port region is offset laterally from the NFC coupler. The field confiner is skewed to provide a pathway between the NFC coupler and the port region.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 24, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Swaminathan Sankaran, Benjamin Stassen Cook, Nathan Brooks, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun
  • Hermetically sealed molecular spectroscopy cell with buried ground plane
    Patent number: 10424523
    Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 24, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, Benjamin Stassen Cook
  • NANOPARTICLE BACKSIDE DIE ADHESION LAYER
    Publication number: 20190279955
    Abstract: In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.
    Type: Application
    Filed: March 7, 2018
    Publication date: September 12, 2019
    Applicant: Texas Instruments Incorporated
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury
  • Integrated artificial magnetic launch surface for near field communication system
    Patent number: 10389410
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. An artificial magnetic conductor surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic energy with a phase shift of approximately zero degrees.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: August 20, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Nathan Brooks, Benjamin Stassen Cook, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher S Haroun