Abstract: An embodiment comprises: a voltage generation unit for providing a direct current signal for driving a light emitting unit; a sensing resistor; and a dimming unit which is connected between the light emitting unit and the sensing resistor and controls a current flowing in the sensing resistor and the light emitting unit, wherein the dimming unit adjusts the level of the direct current signal on the basis of a first sensing voltage as a result of sensing the voltage of a first node where a switch is connected to the light emitting unit, and a second sensing voltage as a result of sensing the voltage of a second node where the switch is connected to the sensing resistor.

Abstract: A light emitting module of an embodiment comprises: (1-1)th to (1-M)th (where M is a positive integer equal to or greater than 2) light emitting elements connected with each other; (2-1)th to (2-N)th (where N is a positive integer equal to or greater than 1) light emitting elements connected in parallel with a (1-m)th (1?m?M) light emitting elements which is one of the (1-1)th to (1-M)th light emitting elements; and an on/off controller controlling to turn the (1-1)th to (1-M)th light emitting elements and (2-1)th to (2-N)th light emitting elements on or off according to a level of an operation signal.

Abstract: A touch sensing system and a method for driving the same are disclosed. The touch sensing system includes a touch screen including touch sensors and a touch sensing circuit applying a driving signal to the touch sensors. The touch sensing circuit applies at least one first driving signal to a first position of the touch screen and applies at least one second driving signal to a second position of the touch screen. When RC delay of the first position is less than RC delay of the second position, at least one of a width and a voltage of the second driving signal is greater than the first driving signal, or the number of second driving signals is more than the number of first driving signals.

Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.

Abstract: A lighting module may be provided that comprises: an optical plate; a base frame including a central frame disposed on the optical plate, a first frame coupled to the central frame, and a second frame coupled to the first frame; a side frame coupled between the optical plate and the second frame of the base frame; and a light source including a substrate disposed on the side frame and a light emitter disposed on the substrate, wherein the second frame is disposed on the light source, and wherein the second frame has an inner surface reflecting light from the light source to at least one of the first frame and the central frame.

Abstract: The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

Abstract: The purpose of the present invention is to provide an LED power source current control device having a high power factor and a low total harmonic distortion (THD) for supplying current to an LED by a semiconductor chip which uses a current distribution scheme, not a switching scheme.

Abstract: The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

Abstract: A method of tracking a position of an eye is provided. The method of tracking a position of an eye includes converting an obtained image into a binary number image, classifying the corner of the eye, maximum and minimum values of a pupil of the eye, and extracting a feature point from the binary number image on which the binarization step is completed, calculating a distance and inclination between the corner and the pupil of the eye using the feature point extracted through the feature point extraction step, and determining a gaze direction of the eye based on the distance and inclination calculated through the distance and inclination calculation step.

Abstract: A lighting device may be provided that includes: a first to a fourth light emitting devices which are disposed on a substrate a first and a second pulse width modulation controllers which perform a pulse width modulation on currents applied to the first and the second light emitting devices respectively; and a first and a second controllers which control respectively currents applied to the third and the fourth light emitting devices having color temperatures different from those of the first and the second light emitting devices, wherein an (x, y) coordinate, which is determined by the mixture of the lights emitted from the first to the fourth light emitting devices and is located within a 1931 CIE chromaticity diagram, is moved onto a black body radiation curve within the 1931 CIE chromaticity diagram through the pulse width modulation of the first and the second pulse width modulation controllers and the control of the first and the second controllers.

Abstract: A lighting module may be provided that comprises: an optical plate; a base frame including a central frame disposed on the optical plate, a first frame coupled to the central frame, and a second frame coupled to the first frame; a side frame coupled between the optical plate and the second frame of the base frame; and a light source including a substrate disposed on the side frame and a light emitter disposed on the substrate, wherein the second frame is disposed on the light source, and wherein the second frame has an inner surface reflecting light from the light source to at least one of the first frame and the central frame.

Abstract: A touch sensing system and a method for driving the same are disclosed. The touch sensing system includes a touch screen including touch sensors and a touch sensing circuit applying a driving signal to the touch sensors. The touch sensing circuit applies at least one first driving signal to a first position of the touch screen and applies at least one second driving signal to a second position of the touch screen. When RC delay of the first position is less than RC delay of the second position, at least one of a width and a voltage of the second driving signal is greater than the first driving signal, or the number of second driving signals is more than the number of first driving signals.

Abstract: A method of tracking a position of an eye is provided. The method of tracking a position of an eye includes converting an obtained image into a binary number image, classifying the corner of the eye, maximum and minimum values of a pupil of the eye, and extracting a feature point from the binary number image on which the binarization step is completed, calculating a distance and inclination between the corner and the pupil of the eye using the feature point extracted through the feature point extraction step, and determining a gaze direction of the eye based on the distance and inclination calculated through the distance and inclination calculation step.

Abstract: A method of manufacturing an SOI substrate for semiconductor devices is described. The method includes forming a low density impurity region in a first semiconductor substrate and a high density impurity region in the low density impurity region, forming a trench surrounding the low density impurity region and the high density impurity region, the depth of the trench being deeper than the high density impurity region and shallower than the low density impurity region, forming an insulating layer on the surface of the first semiconductor substrate to fill the inside of the trench, attaching a second semiconductor substrate on the surface of the insulating layer, and removing a part of the first semiconductor substrate so that the bottom of the trench is exposed.

Abstract: A method of manufacturing an SOI substrate for semiconductor devices is described. The method includes forming a low density impurity region in a first semiconductor substrate and a high density impurity region in the low density impurity region, forming a trench surrounding the low density impurity region and the high density impurity region, the depth of the trench being deeper than the high density impurity region and shallower than the low density impurity region, forming an insulating layer on the surface of the first semiconductor substrate to fill the inside of the trench, attaching a second semiconductor substrate on the surface of the insulating layer, and removing a part of the first semiconductor substrate so that the bottom of the trench is exposed.

Abstract: A method of manufacturing an SOI substrate for semiconductor devices is described. The method includes forming a low density impurity region in a first semiconductor substrate and a high density impurity region in the low density impurity region, forming a trench surrounding the low density impurity region and the high density impurity region, the depth of the trench being deeper than the high density impurity region and shallower than the low density impurity region, forming an insulating layer on the surface of the first semiconductor substrate to fill the inside of the trench, attaching a second semiconductor substrate on the surface of the insulating layer, and removing a part of the first semiconductor substrate so that the bottom of the trench is exposed.

Abstract: A method of manufacturing an SOI substrate for semiconductor devices is described. The method includes forming a low density impurity region in a first semiconductor substrate and a high density impurity region in the low density impurity region, forming a trench surrounding the low density impurity region and the high density impurity region, the depth of the trench being deeper than the high density impurity region and shallower than the low density impurity region, forming an insulating layer on the surface of the first semiconductor substrate to fill the inside of the trench, attaching a second semiconductor substrate on the surface of the insulating layer, and removing a part of the first semiconductor substrate so that the bottom of the trench is exposed.