Abstract: An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.

Abstract: A photolithographic method which produces a structure in a radiation-emitting semiconductor component by providing a semiconductor wafer having a semiconductor layer sequence, applying a first photoresist layer to the semiconductor wafer, providing a mask, and arranging the mask relative to the coated semiconductor wafer, exposing the first photoresist layer and imaging the mask in the first photoresist layer, arranging the mask or a different mask relative to the semiconductor wafer at another position different from a first position and again exposing the first photoresist layer and imaging the mask in the first photoresist layer or applying a second photoresist layer to the first photoresist layer, arranging the mask or a different mask relative to the semiconductor wafer at a second position, and exposing the second photoresist layer and imaging the mask in the second photoresist layer, forming a patterned photoresist layer and patterning the semiconductor wafer.

Abstract: An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.

Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.

Abstract: A dental implant inserted into a jawbone in order to fasten a tooth replacement is characterized by a shape corresponding to two partially overlapping cylinder-like members (29, 30) that have significantly different diameters. The axis of symmetry (14) of the first member (29) having the larger diameter extends perpendicular to the cortical bone (4) of the jawbone, while the axis of symmetry (15) of the second member (30) having the smaller diameter is tilted by an acute angle relative to the axis of symmetry (14) of the first member (29). The point of intersection (2) between the axes of symmetry (14, 15) lies on the axis of symmetry of the first member (29), within or outside said member (29).

Abstract: A method for producing an optoelectronic semiconductor component includes providing a first wafer having a patterned surface, wherein the patterned surface is formed at least in places by elevations having first and second heights, wherein the first height is greater than the second height; providing a second wafer; applying a photoresist to outer areas of the second wafer; patterning a surface of the photoresist facing away from the second wafer by impressing the patterned surface of the first wafer into the photoresist, wherein the elevations are impressed as trenches having a first and second depth into the photoresist; applying a patterning method to the patterned surface of the photoresist, wherein the structure applied on the photoresist is transferred at least in places to the outer area of the second wafer.

Abstract: A method for patterning a semiconductor surface is specified. A photoresist is applied to an outer area of a second semiconductor wafer. A surface of the photoresist that is remote from the second semiconductor wafer is patterned by impressing a patterned surface of the first wafer into the photoresist. A patterning method is applied to the surface of the photoresist, wherein a structure applied on the photoresist is transferred at least in places to the outer area of the second semiconductor wafer.

Abstract: A dental implant inserted into a jawbone in order to fasten a tooth replacement is characterized by a shape corresponding to two partially overlapping cylinder-like members (29, 30) that have significantly different diameters. The axis of symmetry (14) of the first member (29) having the larger diameter extends perpendicular to the cortical bone (4) of the jawbone, while the axis of symmetry (15) of the second member (30) having the smaller diameter is tilted by an acute angle relative to the axis of symmetry (14) of the first member (29). The point of intersection (2) between the axes of symmetry (14, 15) lies on the axis of symmetry of the first member (29), within or outside said member (29).

Abstract: The invention relates to a spoon for receiving soft or liquid food. Said spoon has a handle with an attached mouthpiece constructed of soft and flexible material. The aim of the invention is to significantly simplify the manner in which food is received by small children and people with facial paralysis. The spoon has a practical shape in that the mouthpiece is trough-shaped and concave and has a level defining upper edge, whereby the thickness of the mouthpiece in the front and on the lateral side is proportional so that its concave shape can be inverted by the pressure of the tongue (Z) during swallowing and the mouthpiece can adapt to the arched shape of the hard palate (G) in a sagital and transversal direction.

Abstract: An oral hygiene appliance has a spring-elastic working piece, comprising a stamped element made from foam, on the head of an handle. The stamped element is made from closed-cell foam, and only the cells located on the stamping face are opened by the stamping process.