Patents by Inventor Bernd Goller

Bernd Goller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11040872
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: June 22, 2021
    Assignee: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Patent number: 10793419
    Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: October 6, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Marc Fueldner, Niccolo De Milleri, Bernd Goller, Ulrich Krumbein, Gerhard Lohninger, Giordano Tosolini, Andreas Wiesbauer
  • Patent number: 10707158
    Abstract: A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: July 7, 2020
    Assignee: Infineon Technologies AG
    Inventors: Alexander Heinrich, Bernd Goller, Thorsten Meyer, Gerald Ofner
  • Patent number: 10570007
    Abstract: A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: February 25, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Gunar Lorenz, Bernd Goller
  • Publication number: 20200039820
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Applicant: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Patent number: 10549985
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 4, 2020
    Assignee: Infineon Technologies AG
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Publication number: 20190359481
    Abstract: A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.
    Type: Application
    Filed: April 16, 2019
    Publication date: November 28, 2019
    Inventors: Gunar Lorenz, Bernd Goller
  • Patent number: 10435292
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Publication number: 20190270639
    Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 ?m into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.
    Type: Application
    Filed: February 7, 2019
    Publication date: September 5, 2019
    Inventors: Gunar Lorenz, Alfons Dehe, Marc Fueldner, Bernd Goller, Ulrich Krumbein, Andreas Wiesbauer
  • Publication number: 20190270637
    Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.
    Type: Application
    Filed: February 7, 2019
    Publication date: September 5, 2019
    Applicant: Infineon Technologies AG
    Inventors: Marc Fueldner, Niccolo De Milleri, Bernd Goller, Ulrich Krumbein, Gerhard Lohninger, Giordano Tosolini, Andreas Wiesbauer
  • Publication number: 20190259716
    Abstract: A device package includes a semiconductor device. The semiconductor device is disposed on a substrate. The device package further includes a covering. The covering is disposed on the substrate and surrounds the semiconductor device. The covering includes a void, a first layer, and a second layer. The void is between an interior surface of the covering and the semiconductor device. The first layer has a first electrical conductivity and a first thickness. The second layer is disposed under the first layer. The second layer has a second electrical conductivity and a second thickness. The first electrical conductivity is greater than the second electrical conductivity. The first thickness is less than the second thickness.
    Type: Application
    Filed: May 3, 2019
    Publication date: August 22, 2019
    Inventors: Pedro Augusto Borrego Lambin Torres Amaral, Ewa Brox-Napieralska, Bernd Goller, Andreas Wiesbauer
  • Patent number: 10377626
    Abstract: The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: August 13, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Bernd Goller, Matthias Steiert
  • Publication number: 20190079055
    Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 14, 2019
    Inventors: Rui Miguel Moreira Araujo, Bernd Goller, Dominic Maier
  • Patent number: 10161908
    Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: December 25, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Rui Miguel Moreira Araujo, Bernd Goller, Dominic Maier
  • Publication number: 20180366424
    Abstract: A device package includes a semiconductor device. The semiconductor device is disposed on a substrate. The device package further includes a covering. The covering is disposed on the substrate and surrounds the semiconductor device. The covering includes a void, a first layer, and a second layer. The void is between an interior surface of the covering and the semiconductor device. The first layer has a first electrical conductivity and a first thickness. The second layer is disposed under the first layer. The second layer has a second electrical conductivity and a second thickness. The first electrical conductivity is greater than the second electrical conductivity. The first thickness is less than the second thickness.
    Type: Application
    Filed: June 20, 2017
    Publication date: December 20, 2018
    Inventors: Pedro Augusto Borrego Lambin Torres Amaral, Ewa Brox-Napieralska, Bernd Goller, Andreas Wiesbauer
  • Publication number: 20180305200
    Abstract: The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 25, 2018
    Inventors: Bernd Goller, Matthias Steiert
  • Publication number: 20180148322
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Application
    Filed: August 31, 2017
    Publication date: May 31, 2018
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Publication number: 20180022601
    Abstract: The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 25, 2018
    Applicant: Infineon Technologies AG
    Inventors: Claus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
  • Publication number: 20170317016
    Abstract: A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.
    Type: Application
    Filed: April 26, 2017
    Publication date: November 2, 2017
    Inventors: Alexander HEINRICH, Bernd GOLLER, Thorsten MEYER, Gerald OFNER
  • Publication number: 20170276646
    Abstract: Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 28, 2017
    Inventors: Rui Miguel Moreira Araujo, Bernd Goller, Dominic Maier