Abstract: A semiconductor device includes a microelectromechanical system (MEMS) die, a lid, and an integrated circuit die. The lid is over the MEMS die and defines a cavity between the lid and the MEMS die. The integrated circuit die is attached to an inner side of the lid. The integrated circuit die is electrically coupled to the MEMS die.

Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract: A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Abstract: An exhaust system has an exhaust tailpipe cover provided in an outlet region and, on the inside, contains inner exhaust pipes which are disposed spaced apart from the exhaust tailpipe cover by a passage. The passage in the exhaust tailpipe cover results in the exhaust tailpipe cover being exposed to as little thermal loading as possible and avoids transmitting heat to a surrounding vehicle rear part, in particular made of plastic.

Abstract: A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.

Abstract: A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.

Abstract: A rear muffler assembly for an internal combustion engine has a first and a second muffler through which exhaust gases flow and which are separated from one another. The first and second mufflers have in each case an exhaust gas delivery and discharge through an exhaust gas routing pipe issuing into an exhaust pipe which follows downstream and in which an exhaust gas shutoff flap which can be closed temporarily is disposed. The rear muffler assembly contains two exhaust gas routing pipes, the first exhaust gas routing pipe having within the rear muffler an issue orifice for exhaust gases positively emerging from the second exhaust gas routing pipe, with the exhaust gas shutoff flap closed, into which first exhaust gas routing pipe the exhaust gases from the internal combustion engine flow directly.

Abstract: The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.

Abstract: A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Abstract: A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

Abstract: The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.

Abstract: A rear muffler assembly for an internal combustion engine has a first and a second muffler through which exhaust gases flow and which are separated from one another. The first and second mufflers have in each case an exhaust gas delivery and discharge through an exhaust gas routing pipe issuing into an exhaust pipe which follows downstream and in which an exhaust gas shutoff flap which can be closed temporarily is disposed. The rear muffler assembly contains two exhaust gas routing pipes, the first exhaust gas routing pipe having within the rear muffler an issue orifice for exhaust gases positively emerging from the second exhaust gas routing pipe, with the exhaust gas shutoff flap closed, into which first exhaust gas routing pipe the exhaust gases from the internal combustion engine flow directly.

Abstract: An exhaust system has an exhaust tailpipe cover provided in an outlet region and, on the inside, contains inner exhaust pipes which are disposed spaced apart from the exhaust tailpipe cover by a passage. The passage in the exhaust tailpipe cover results in the exhaust tailpipe cover being exposed to as little thermal loading as possible and avoids transmitting heat to a surrounding vehicle rear part, in particular made of plastic.

Abstract: A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.

Abstract: On a roof rack fixedly connected with the vehicle roof, a so-called loading aid is arranged which, in a loading position, can be swung out inclinedly on the sides of the vehicle, so that bicycles or the like can be placed on this loading aid by corresponding transport fixtures and, after being fitted with the bicycles, the loading aid can be pushed back into a transport position onto the roof.

Abstract: A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.