Patents by Inventor Bernhard Lang
Bernhard Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7531895Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.Type: GrantFiled: October 25, 2006Date of Patent: May 12, 2009Assignee: Texas Instruments IncorporatedInventors: Bernhard Lange, William David Boyd
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Publication number: 20090105972Abstract: The invention relates to a method for the determination of the electrical work in systems in which the voltage is switched. At preset times for this purpose current values are measured and interpolated between the measurement. With the help of the switched voltage a classification of each interpolated current path is performed. The interpolated current value is then multiplied or integrated by the voltage value/values between the preset times respectively for the determination of the work. Along with the electrical work moreover in accordance with a further method similarly the electrical power in such systems can be determined.Type: ApplicationFiled: April 21, 2008Publication date: April 23, 2009Applicant: VOITH PATENT GMBHInventors: Andreas Lange, Rolf Hoffmann, Volker Weber, Bernhard Lang
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Patent number: 7488623Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: GrantFiled: July 9, 2007Date of Patent: February 10, 2009Assignee: Texas Instruments IncorporatedInventors: Steven A Kummerl, Anthony L Coyle, Bernhard Lange
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Publication number: 20080093715Abstract: An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.Type: ApplicationFiled: October 18, 2007Publication date: April 24, 2008Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventors: Bernhard Lange, Steven Kummerl
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Publication number: 20080020517Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.Type: ApplicationFiled: July 31, 2007Publication date: January 24, 2008Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Steven Kummerl, Bernhard Lange, Anthony Coyle
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Publication number: 20070290303Abstract: A semiconductor device (10) comprises a die (11) provided between a first leadframe (12) and a second leadframe (13), such that a first surface of the die (11) is connected to the first leadframe (12) and a second surface of the die (11) is connected to a second leadframe (13). Mold compound (15) includes side recesses (16) into which end portions (18) of leadframe (12) can be fit.Type: ApplicationFiled: June 5, 2007Publication date: December 20, 2007Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventor: Bernhard Lange
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Publication number: 20070259484Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: ApplicationFiled: July 9, 2007Publication date: November 8, 2007Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Steven Kummerl, Anthony Coyle, Bernhard Lange
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Patent number: 7256482Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: GrantFiled: August 12, 2004Date of Patent: August 14, 2007Assignee: Texas Instruments IncorporatedInventors: Steven Alfred Kummerl, Anthony L. Coyle, Bernhard Lange
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Publication number: 20070181652Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.Type: ApplicationFiled: April 11, 2007Publication date: August 9, 2007Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Bernhard Lange, Steven Kummerl
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Publication number: 20070119173Abstract: The invention relates to an actuator comprising an actuator element movably supported at an actuator housing, a pyrotechnic pressure element to move the actuator element and a control means to control a force exerted onto the actuator element by the pressure element to move the actuator element.Type: ApplicationFiled: December 5, 2006Publication date: May 31, 2007Inventors: Anton Bretfeld, Uwe Albrecht, Bernhard Lang
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Patent number: 7221055Abstract: According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.Type: GrantFiled: May 23, 2005Date of Patent: May 22, 2007Assignee: Texas Instruments IncorporatedInventor: Bernhard Lange
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Publication number: 20070057361Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.Type: ApplicationFiled: October 25, 2006Publication date: March 15, 2007Applicant: Texas Instruments IncorporatedInventors: Bernhard Lange, William Boyd
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Publication number: 20070048996Abstract: A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip with metallization traces, copper lines in contact with the traces, and copper bumps located in an orderly and repetitive arrangement on each line so that the bumps of one line are positioned about midway between the corresponding bumps of the neighboring lines. A substrate is provided which has elongated copper leads with first and second surfaces, the leads oriented at right angles to the lines. The first surface of each lead is connected to the corresponding bumps of alternating lines using solder elements. Finally, the assembly is encapsulated in molding compound so that the second lead surfaces remain un-encapsulated.Type: ApplicationFiled: September 1, 2005Publication date: March 1, 2007Inventors: Bernhard Lange, Anthony Coyle, Quang Mai
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Publication number: 20070040237Abstract: A high current semiconductor device (for example QFN for 30 to 70 A) with low resistance and low inductance is encapsulated by molding compound (401, height 402 about 0.9 mm) so that the second lead surfaces 110b remain unencapsulated. A copper heat slug (404) may be attached to chip surface (101b) using thermally conductive adhesive (403). Chip surface (101a), protected by an overcoat (103) has metallization traces (102). Copper-filled windows (107) contact the traces and copper layers (105) parallel to traces (102). Copper bumps (108) are formed on each line in an orderly and repetitive arrangement so that the bumps of one line are positioned about midway between the bumps of the neighboring lines. A substrate has elongated leads (110) oriented at right angles to the lines; the leads connect the corresponding bumps of alternating lines.Type: ApplicationFiled: August 22, 2005Publication date: February 22, 2007Inventors: Anthony Coyle, Bernhard Lange
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Publication number: 20070034993Abstract: A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads (140 . . . ) oriented with one end (140a . . . ) towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.Type: ApplicationFiled: August 15, 2005Publication date: February 15, 2007Inventor: Bernhard Lange
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Publication number: 20060289971Abstract: A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.Type: ApplicationFiled: June 27, 2005Publication date: December 28, 2006Inventors: Bernhard Lange, Steven Kummerl
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Publication number: 20060278682Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.Type: ApplicationFiled: June 9, 2005Publication date: December 14, 2006Inventors: Bernhard Lange, Steven Kummeri
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Publication number: 20060273432Abstract: According to an embodiment of the invention, a package comprises a lead frame, a first passive component, a first wire bond connection, and a mold compound. The lead frame has a first pair of resilient arms. The first passive component is disposed between the first pair of resilient arms. The first wire bond connection is disposed between the die and a portion of the lead frame adjacent the first passive component. The first wire bond connection is operable for communication between the die and the first passive component. The mold compound is disposed at least partially around the lead frame, the first passive component, the first wire bond connection, and the die.Type: ApplicationFiled: June 6, 2005Publication date: December 7, 2006Inventors: Bernhard Lange, Steven Kummerl
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Publication number: 20060263944Abstract: According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.Type: ApplicationFiled: May 23, 2005Publication date: November 23, 2006Inventor: Bernhard Lange
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Publication number: 20060258051Abstract: According to one embodiment of the invention, a method of solder die attach includes providing a wafer disposed outwardly from a carrier tape, partitioning the wafer into a plurality of wafer sections, partially partitioning at least some of the wafer sections, picking up a first wafer section of the partially partitioned wafer sections, and placing the first wafer section onto molten solder disposed outwardly from a substrate.Type: ApplicationFiled: May 10, 2005Publication date: November 16, 2006Inventor: Bernhard Lange