Abstract: A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.

Abstract: Semiconductor leadframes are provided with selected coined and uncoined areas. The coined areas are arranged to coincide with connection sites for electrical couplings, and the uncoined areas are arranged to provide a secure mechanical bond between leadframe and die attach material or leadframe and encapsulant. Methods are disclosed for forming a leadframe including steps for providing a leadframe that has a die pad and leadfingers extending from the die pad, and coining a selected portion of the die pad using a high pressure coining tool configured to make contact with the selected portion of the die pad and to avoid contact with the remainder of the die pad. A leadframe coining tool is also disclosed for use in a high pressure press. The coining tool includes one or more contact area for coining a portion of the die pad, and at least one non-contact area, whereby a die pad of an aligned leadframe may be partially coined.

Abstract: An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Abstract: A QFN package and method of making same is provided comprising a substrate having a metal line extending from a connection element on a perimeter region of the substrate to a high current contact pad on interior region of the substrate. A semiconductor chip having an active surface generally faces the interior region of the substrate, wherein a heat-dissipating patterned metal distribution layer is formed over the active surface and electrically connected to an active component thereon. A solder strip electrically and thermally connects the high current contact pad and the metal distribution layer, and a mold compound generally encapsulates the semiconductor chip. The solder strip is generally uniform in depth and surface area, wherein low electrical resistance and inductance is provided between the high current contact pad and the metal distribution layer. An integrated heat sink may be further formed or placed on a passive surface of the chip.

Abstract: The invention provides small-feature identifying markings for tracing completed IC packages to individual mold cavities. Preferred embodiments of the invention include IC packages and associated methods for forming indicia in a surface of an integrated circuit package in an arrangement indicative of a particular mold cavity. The indicia may be read to determine the particular mold cavity associated with the manufacture of an individual integrated circuit package. Preferred embodiments of the invention are included using surface dot or indentation indicia configured in a binary code arrangement.

Abstract: For the prognosis of a value of a characteristic of a product which is to be produced with the aid of a neuronal network, the history of the product is taken into account when determining an input variable of an input neuron of the neuronal network.

Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

Abstract: A semiconductor package comprising a chip, a die pad adjacent the chip, said die pad having a side facing away from the chip, a portion of said side separated from an adjacent package surface by a distance greater than zero. The package further comprises mold compound abutting the chip and the die pad, wherein the distance between said portion and said adjacent package surface varies.

Abstract: A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.

Abstract: A method for coupling a heat slug to a lead frame, comprising aligning a heat slug and a lead frame depositing a material between the heat slug and the lead frame, and clamping together the heat slug and the lead frame.

Abstract: A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.

Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

Abstract: An arrangement for patient monitoring. The arrangement includes at least one body sensor to detect a physiological parameter as body signal data and at least one of a body signal processing unit connected to the body sensor for processing body signal data, and a therapy device designed to act on the patient. In addition, the arrangement includes a monitoring center having a signal field strength evaluation means, a mobile phone terminal designed to transmit the data from at least one of the body signal processing unit and the therapy device to the monitoring center and from the monitoring center to the therapy device, and a cellular mobile phone network. The mobile phone terminal is operable in the cellular mobile phone network. The arrangement further includes a base station coordinate storage unit for storage of coordinate data and a mobile phone exchange linked to the base station coordinate storage unit for the reception of position data of the mobile phone terminal.

Abstract: A patient monitoring system (1) is provided with at least one body sensor (2a) for measuring a physiological parameter, as well as with a body signal processing unit (3) connected downstream from the former and/or a therapy device (2) designed to act on the patient (P), and a mobile radiotelephone end unit (7) operable in a cellular mobile radiotelephone network (1B) for transmitting data from the body signal processing unit or the therapy device to a central monitoring station (1C) and/or from the central monitoring station to the therapy device. A base station coordinate memory unit (13; 13′) and a locator unit (12; 12.1′ through 12.3′) connected to the former serves for the rough determination of the location of the patient based on location information obtained from the current base station connection of the mobile radiotelephone end unit in the mobile radiotelephone network.

Abstract: A patient monitoring system (1) is provided with at least one body sensor (2a) for measuring a physiological parameter, as well as with a body signal processing unit (3) connected downstream from the former and/or a therapy device (2) designed to act on the patient (P), and a mobile radiotelephone end unit (7) operable in a cellular mobile radiotelephone network (1B) for transmitting data from the body signal processing unit or the therapy device to a central monitoring station (1C) and/or from the central monitoring station to the therapy device. A base station coordinate memory unit (13; 13′) and a locator unit (12, 12.1′ through 12.3′) connected to the former serves for the rough determination of the location of the patient based on location information obtained from the current base station connection of the mobile radiotelephone end unit in the mobile radiotelephone network.

Abstract: An arrangement of modular supporting structure or subassemblies constituted of interconnected circuit boards, especially for the assembly of a complex processing circuit in articles of ammunition possessing a search fuze or in airborne target-tracking bodies. The structures or modular subassemblies of the type considered herein consist of circuit boards arranged in a succession, in which between respectively two adjacent circuit boards, there are formed a series of optronic intersecting connections between coupling elements, wherein in the operational positioning of the circuit boards, a transmitting diode and a receiving detector are arranged opposite each other, which are connected with a multiplexer or, respectively, a demultiplexer.

Abstract: A pressure wave supercharger for internal combustion engines, particularly those in motor vehicles, has a rotor, driven in proportion to the engine speed, with a plurality of rotor cells oriented parallel to its axis of rotation. The cells are connected, at one end, in the exhaust gas flow between the exhaust manifold and the exhaust system and, at the other end, in the intake air stream between the air intake and the intake manifold. Placed on the rotor and concentric therewith is a rigid vibration damping ring, which is contacted by a support, firmly attached to the rotor, so as to create friction. The friction produced by sliding of the rigid ring on the support, acts to absorb a large part of the vibration energy of the rotor and thereby, correspondingly, to eliminate the production of annoying noise.