Abstract: The invention relates to a machining head for coupling a laser beam into a liquid jet. This machining head comprises an optical unit having at least one optical element for focusing the laser beam, and a coupling unit having a liquid chamber that is delimited by a wall, wherein a nozzle having a nozzle opening for generating a liquid jet is disposed in the wall. In a state in which the coupling unit is connected to the optical unit, the laser beam that is capable of being focused by the optical unit is directable in a beam direction through the liquid chamber of the coupling unit into the nozzle opening, and is capable of being coupled into the liquid jet that is generatable by the nozzle and runs in the beam direction.

Abstract: A method for determining a spatial position of a liquid jet, in particular of a liquid jet for optically guiding a laser beam, comprises the steps: providing a collision object having a measuring point for interacting with the liquid jet, detecting a state of the liquid jet in a first configuration between collision object and liquid jet, changing the configuration so that the state of the liquid jet changes, detecting the configuration change between the first and second configuration.

Abstract: The invention relates to a device (1) for cutting wafers (2) into a number of chips with a laser beam (6) injected into a liquid jet (7). A thin flowing liquid layer (9) having a blasting effect is produced on the surface (5) of the wafer (2). This makes it possible to prevent projections resulting during laser cutting from depositing once again on the surface of the wafer. The result is a very high cleanness of the surface after the cutting process. The liquid layer (9) is produced, in particular, so that it is thinner in a machining area (10) around the machining point (8) than outside of the machining area (10). This ensures that the liquid layer is sufficiently thin (14) at the machining point (8) so that enough laser energy for removing material is applied to the wafer surface, and ensures that the liquid layer is sufficiently thick (15) outside of the machining area so that no area of the surface (5) of the wafer (2) dries out.

Abstract: The invention relates to a method and device for generating a jet of fluid which is suitable, in the manner of a waveguide, to carry a laser beam injected into it and which is used to process a work piece. Said device comprises a fluid nozzle for generating a jet of fluid and a gas outlet nozzle, disposed at a distance from the fluid nozzle and producing a flow of gas enclosing the jet of fluid on the exterior thereof. A gas storage is defined between the fluid nozzle and the gas outlet nozzle. The jet of fluid is passed or ejected through the gas outlet nozzle. The jet of fluid has a diameter of preferably 60 m or less and the flow of gas has a diameter of 1-2 mm.

Abstract: The invention relates to a device (1) for cutting wafers (2) into a number of chips with a laser beam (6) injected into a liquid jet (7). A thin flowing liquid layer (9) having a blasting effect is produced on the surface (5) of the wafer (2). This makes it possible to prevent projections resulting during laser cutting from depositing once again on the surface of the wafer. The result is a very high cleanness of the surface after the cutting process. The liquid layer (9) is produced, in particular, so that it is thinner in a machining area (10) around the machining point (8) than outside of the machining area (10). This ensures that the liquid layer is sufficiently thin (14) at the machining point (8) so that enough laser energy for removing material is applied to the wafer surface, and ensures that the liquid layer is sufficiently thick (15) outside of the machining area so that no area of the surface (5) of the wafer (2) dries out.

Abstract: The invention relates to an object (1) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier (3) that is provided with an adhesive and can be transparent for the radiation used in the water beam (7). The carrier can be a solid body and preferably a fibrous mat (3). Said body or mat is penetrated by the water beam. The object (1) or the cut material thereof is held on the carrier (3) before, during and after cutting through in such a way that said object or material does not change position. In a preferred embodiment, a silicon wafer is used as the object because of the high cutting exactness to be obtained. Other materials can also be used.

Abstract: The invention relates to an object (1) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier (3) that is provided with an adhesive and can be transparent for the radiation used in the water beam (7). The carrier can be a solid body and preferably a fibrous mat (3). Said body or mat is penetrated by the water beam. The object (1) or the cut material thereof is held on the carrier (3) before, during and after cutting through in such a way that said object or material does not change position. In a preferred embodiment, a silicon wafer is used as the object because of the high cutting exactness to be obtained. Other materials can also be used.

Abstract: An arrangement for processing material with a liquid jet comprising a laser for emitting a laser beam. The arrangement includes a processing module having a nozzle duct connected to a liquid supply line for forming a liquid jet. The nozzle duct has an intake opening lying in an intake opening plane. An optical element couples the laser beam into the liquid jet, and the optical element of the laser beam is focused in a focusing point range and into the intake opening plane of the nozzle duct. The liquid supply line for the nozzle duct defines an area formed above the nozzle intake opening having a height dimensioned relative to the cross-sectional area of the intake opening such that the area above the nozzle intake opening does not include a liquid retaining chamber.