Abstract: A computer program product for fabricating an optical assembly having stored computer readable program code including a first program to place a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate upon a horizontally movable stage of a flip-chip bonder, a second program to vertically move a clamp through the stage opening to place the waveguide exposed end in a vertical position, a third program to vertically downwardly move a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide, a fourth program to fixably mount the optical component to the substrate edge, and a fifth program to release the optical component from the bond head while moving the clamp vertically downward through the stage opening unbending the flexible portion of the substrate with the optical component mounted thereon.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

Abstract: An optoelectronic packaging assembly having an optical interposer and a method of same. The assembly includes a photonic and/or optoelectronic device; a planar optical interposer coupled to the photonic and/or optoelectronic device on a first side of the optical interposer and including an optical transmission element on a second side opposite to the first side; a deflecting element; and at least one optical waveguide on the first side, in-plane with the optical interposer. The waveguide is coupled at one end to the photonic and/or optoelectronic device and at another end to the deflecting element. The deflecting element is configured to enable optical transmission between the waveguide and the optical transmission element through the optical interposer. The optical interposer includes a material allowing for optical transmission between the deflecting element and the optical transmission element.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: A method for fabricating an optical assembly by placing a flexible portion of a substrate, including a waveguide, upon a horizontally movable stage of a flip-chip bonder. Then moving a clamp through an opening in the stage to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position and vertically downwardly moving a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide and mounting the optical component to the substrate edge. Then releasing the optical component from the bond head while moving the clamp downward through the stage opening and unbending the flexible portion of the substrate with the optical component mounted thereon.

Abstract: A computer program product for fabricating an optical assembly, having a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code includes a first computer readable program code configured to horizontally position a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate; a second computer readable program code configured to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position; a third computer readable program code configured to vertically position a flip-chip bonder bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and a fourth computer readable program code configured to fixably mount the optical component to the substrate edge.

Abstract: An optoelectronic packaging assembly having an optical interposer and a method of same. The assembly includes a photonic and/or optoelectronic device; a planar optical interposer coupled to the photonic and/or optoelectronic device on a first side of the optical interposer and including an optical transmission element on a second side opposite to the first side; a deflecting element; and at least one optical waveguide on the first side, in-plane with the optical interposer. The waveguide is coupled at one end to the photonic and/or optoelectronic device and at another end to the deflecting element. The deflecting element is configured to enable optical transmission between the waveguide and the optical transmission element through the optical interposer. The optical interposer includes a material allowing for optical transmission between the deflecting element and the optical transmission element.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

Abstract: An optical waveguide device comprises a plurality of mirrors, wherein at least one mirror comprises a first and second reflective end that reflect and transmit light. The plurality of mirrors comprises at least one first material having at least one first refractive index; an axis line; a first cladding comprising a second material having a second refractive index; a second cladding, formed above the first, comprising a third material having a third refractive index; a core comprising a fourth material; and a plurality of core parts formed within at least one of the first or second claddings. The fourth material has a fourth refractive index that is greater than the second and third refractive indices and the core parts have a plurality of core part ends coupled to one of the reflective ends where at least one core part end is approximately parallel to one of the reflective ends.

Abstract: A method for assembling a ferrule for an optical wave guide connector, a ferrule for an optical wave guide connector, a wave guide ribbon and a tool for assembling the ferrule. The method includes aligning a first body of the ferrule with respect to an alignment body. The first body includes a longitudinal recess adapted to receive at least one wave guide ribbon. Each wave guide ribbon includes at least one optical wave guide. The method further includes aligning at least one wave guide ribbon with respect to the alignment body and inserting the at least one wave guide ribbon into the longitudinal recess of the first body. Lastly, the method further includes closing the longitudinal recess of the first body with a second body of the ferrule.

Abstract: An optical coupling device for coupling light with an optical waveguide comprises a mirror formed within an optical waveguide. The mirror comprises a first material, a first reflective end, and a second reflective end. The first material is light conducting and has a first refractive index. The first and second reflective ends reflect and transmit light. The mirror has an axis line. The optical coupling device is useful for extracting light from a waveguide and providing a backlight for a liquid crystal display.

Abstract: An optical waveguide device comprises a plurality of mirrors, wherein at least one mirror comprises a first and second reflective end that reflect and transmit light. The plurality of mirrors comprises at least one first material having at least one first refractive index; an axis line; a first cladding comprising a second material having a second refractive index; a second cladding, formed above the first, comprising a third material having a third refractive index; a core comprising a fourth material; and a plurality of core parts formed within at least one of the first or second claddings. The fourth material has a fourth refractive index that is greater than the second and third refractive indices and the core parts have a plurality of core part ends coupled to one of the reflective ends where at least one core part end is approximately parallel to one of the reflective ends.