Abstract: A semiconductor switching module including a housing having openings to remove pressure which occurs during a short circuit. The housing openings, which can be sealed by thin walls dimensioned so that so that parts which carry current cannot be touched from outside and the walls can be destroyed or removed by the pressure which occurs during a short circuit.

Abstract: A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

Abstract: An electromechanical switching device of at least one embodiment includes fixed contacts securely arranged in a housing and a moving contact bridge for bridging the fixed contacts, a moving contact carrier to carry the contact bridge, and a solenoid to act on the contact carrier. In at least one embodiment the solenoid includes a coil body fixed to the housing, an armature coupled to the contact carrier so as to move with it, a yoke to act together with the armature, and a fixing mechanism, which engages with the yoke and coil body for fixing the yoke to the coil body.

Abstract: An electromechanical switching device of at least one embodiment includes fixed contacts securely arranged in a housing and a moving contact bridge for bridging the fixed contacts, a moving contact carrier to carry the contact bridge, and a solenoid to act on the contact carrier. In at least one embodiment the solenoid includes a coil body fixed to the housing, an armature coupled to the contact carrier so as to move with it, a yoke to act together with the armature, and a fixing mechanism, which engages with the yoke and coil body for fixing the yoke to the coil body.

Abstract: A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

Abstract: A semiconductor switching module is disclosed, including a housing, the housing having openings to carry away pressure which occurs in the case of a short circuit. In at least one embodiment, the semiconductor switching module includes an inexpensive, compact housing construction. Further, after a short circuit, there is no danger to station parts or persons. In at least one embodiment, the semiconductor switching module includes a housing, the housing having openings, which can be sealed by thin walls, to carry away pressure which occurs in the case of a short circuit, the thin walls being dimensioned so that they can be destroyed or removed by the pressure which occurs in the case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside. The semiconductor switching module according to at least one embodiment, despite being compact, inexpensive construction, still achieves a high short circuit value.