Semiconductor based switching device

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Description

FIG. 1 is a front elevational view of a first embodiment of a semiconductor based switching device showing our new design;

FIG. 2 is rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a front elevational view of a second embodiment of a semiconductor based switching device showing our new design;

FIG. 9 is rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a perspective view thereof;

FIG. 15 is a front elevational view of a third embodiment of a semiconductor based switching device showing our new design;

FIG. 16 is rear elevational view thereof;

FIG. 17 is a bottom plan view thereof;

FIG. 18 is a top plan view thereof;

FIG. 19 is a right side elevational view thereof;

FIG. 20 is a left side elevational view thereof;

FIG. 21 is a perspective view thereof;

FIG. 22 is a front elevational view of a fourth embodiment of a semiconductor based switching device showing our new design;

FIG. 23 is rear elevational view thereof;

FIG. 24 is a bottom plan view thereof;

FIG. 25 is a top plan view thereof;

FIG. 26 is a right side elevational view thereof;

FIG. 27 is a left side elevational view thereof;

FIG. 28 is a perspective view thereof;

FIG. 29 is a front elevational view of a fifth embodiment of a semiconductor based switching device showing our new design;

FIG. 30 is rear elevational view thereof;

FIG. 31 is a top plan view thereof;

FIG. 32 is a bottom plan view thereof;

FIG. 33 is a right side elevational view thereof;

FIG. 34 is a left side elevational view thereof;

FIG. 35 is a perspective view thereof;

FIG. 36 is a front elevational view of a sixth embodiment of a semiconductor based switching device showing our new design;

FIG. 37 is rear elevational view thereof;

FIG. 38 is a top plan view thereof;

FIG. 39 is a bottom plan view thereof;

FIG. 40 is a right side elevational view thereof;

FIG. 41 is a left side elevational view thereof; and,

FIG. 42 is a perspective view thereof.

The broken line portion of the figure drawings is included to show unclaimed subject matter only and forms no part of the claimed design.

Claims

The ornamental design for a semiconductor based switching device, as shown.

Referenced Cited
U.S. Patent Documents
5652420 July 29, 1997 Innes et al.
D468687 January 14, 2003 Hamada et al.
D479204 September 2, 2003 Nurdogan
D480364 October 7, 2003 Bluemel
D480365 October 7, 2003 Nurdogan
D480690 October 14, 2003 Nurdogan
D481362 October 28, 2003 Nurdogan
D487253 March 2, 2004 Nurdogan
D493145 July 20, 2004 Nurdogan
6856503 February 15, 2005 Apfelbacher et al.
D519086 April 18, 2006 Bluemel
Other references
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  • Crydom, Series CKR 480, Rev. 09122006, pp. 1-2.
  • Crydom, Series CKR 600, Rev. 091406, pp. 1-2.
  • Crydom, Series CMRD/CMRA 24, Rev. 111403, pp. 1-6.
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  • ABB Semiconductor contactors, Solid-state relays, pp. 337-352.
  • AEG, Thyristor Power Controller Thyro-A.
  • Carlo Gawazzi, Solid State Relays, pp. 74-85.
  • Celduc, Solid state relays, pp. 1-19.
  • Crouzet, Solid state relays, pp. 1-28.
  • Crydom, Series 53 TP, Rev. 111003, pp. 1-2.
  • Dold, BF 9250/02, pp. 1-4.
  • Dold, BF 9250, pp. 1-8.
  • Dold, BH 9251, pp. 1-4.
  • Dold, BH 9253, pp. 1-4.
  • Omron, Controllers & SSR's, pp. 1-6.
Patent History
Patent number: D619969
Type: Grant
Filed: Feb 23, 2007
Date of Patent: Jul 20, 2010
Assignee: Siemens Aktiengesellschaft (Munich)
Inventors: Walter Apfelbacher (Freihung), Bertrand Viala (Amberg)
Primary Examiner: Daniel D Bui
Assistant Examiner: Thomas J Johannes
Attorney: Harness, Dickey & Pierce, P.L.C.
Application Number: 29/272,945
Classifications
Current U.S. Class: Relay (D13/159)