Abstract: A touch display panel including a thin-film transistor substrate comprising a thin-film transistor, a pixel defining layer disposed on the thin-film transistor substrate and including a first opening, a light emitting structure disposed in the first opening, a thin film encapsulation layer covering the light emitting structure and the pixel defining layer, a first metal pattern disposed on the thin film encapsulation layer, a first insulation pattern disposed on the first metal pattern and having a plane area the same as or smaller than that of the first metal pattern, a second metal pattern disposed on the first insulation pattern, and a second insulation layer disposed on the second metal pattern and the thin film encapsulation layer, and contacting the first metal pattern, the first insulation pattern, and the second metal pattern.

Abstract: A method of forming a thin film pattern includes providing a thin film on a substrate, providing a photoresist on the thin film, forming a first photoresist pattern having a first packing density by exposing and developing the photoresist, etching the thin film by using the first photoresist pattern as a mask, processing the first photoresist pattern to convert the first photoresist pattern into a second photoresist pattern having a second packing density, which is lower than the first packing density, and stripping the second photoresist pattern by spraying steam onto the second photoresist pattern.

Abstract: A touch display panel including a thin-film transistor substrate comprising a thin-film transistor, a pixel defining layer disposed on the thin-film transistor substrate and including a first opening, a light emitting structure disposed in the first opening, a thin film encapsulation layer covering the light emitting structure and the pixel defining layer, a first metal pattern disposed on the thin film encapsulation layer, a first insulation pattern disposed on the first metal pattern and having a plane area the same as or smaller than that of the first metal pattern, a second metal pattern disposed on the first insulation pattern, and a second insulation layer disposed on the second metal pattern and the thin film encapsulation layer, and contacting the first metal pattern, the first insulation pattern, and the second metal pattern.

Abstract: A photosensitive resin composition, an organic light emitting display device, and method for manufacturing an organic light emitting device, the composition including a photosensitive compound; a solvent; and a silsesquioxane-based copolymer, the silsesquioxane-based copolymer being obtained by copolymerizing a compound represented by the following Chemical Formula 1 with at least one of a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3; R1—R2—Si(R3)3??[Chemical Formula 1] R4—Si(R5)3??[Chemical Formula 2] Si(R6)4.

Abstract: A touch display panel including a thin-film transistor substrate including a thin-film transistor, a pixel defining layer disposed on the thin-film transistor substrate and including a first opening, a light emitting structure disposed in the first opening, a thin film encapsulation layer covering the light emitting structure and the pixel defining layer, a first metal pattern disposed on the thin film encapsulation layer, a first insulation pattern disposed on the first metal pattern and having the same shape as the first metal pattern in a plan view, a second metal pattern disposed on the first insulation pattern, and a second insulation layer disposed on the second metal pattern and the thin film encapsulation layer and covering the first metal pattern, the first insulation pattern and the second metal pattern.

Abstract: A manufacturing method of a display device according to some embodiments includes: forming a protrusion pattern on a carrier glass; coating a polymer on the protrusion pattern to form a polymer layer; forming a stacked structure on the polymer layer, including a transistor and an organic light emitting element connected to the transistor; and separating the carrier glass and the protrusion pattern from the polymer layer, wherein an opening penetrating the polymer layer is formed during the separation of the protrusion pattern.

Abstract: A manufacturing method of a display device according to some embodiments includes: forming a protrusion pattern on a carrier glass; coating a polymer on the protrusion pattern to form a polymer layer; forming a stacked structure on the polymer layer, including a transistor and an organic light emitting element connected to the transistor; and separating the carrier glass and the protrusion pattern from the polymer layer, wherein an opening penetrating the polymer layer is formed during the separation of the protrusion pattern.

Abstract: A method of forming a thin film pattern includes providing a thin film on a substrate, providing a photoresist on the thin film, forming a first photoresist pattern having a first packing density by exposing and developing the photoresist, etching the thin film by using the first photoresist pattern as a mask, processing the first photoresist pattern to convert the first photoresist pattern into a second photoresist pattern having a second packing density, which is lower than the first packing density, and stripping the second photoresist pattern by spraying steam onto the second photoresist pattern.

Abstract: A touch display panel including a thin-film transistor substrate including a thin-film transistor, a pixel defining layer disposed on the thin-film transistor substrate and including a first opening, a light emitting structure disposed in the first opening, a thin film encapsulation layer covering the light emitting structure and the pixel defining layer, a first metal pattern disposed on the thin film encapsulation layer, a first insulation pattern disposed on the first metal pattern and having the same shape as the first metal pattern in a plan view, a second metal pattern disposed on the first insulation pattern, and a second insulation layer disposed on the second metal pattern and the thin film encapsulation layer and covering the first metal pattern, the first insulation pattern and the second metal pattern.

Abstract: A photosensitive resin composition, an organic light emitting display device, and method for manufacturing an organic light emitting device, the composition including a photosensitive compound; a solvent; and a silsesquioxane-based copolymer, the silsesquioxane-based copolymer being obtained by copolymerizing a compound represented by the following Chemical Formula 1 with at least one of a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3; R1-R2—Si(R3)3??[Chemical Formula 1] R4—Si(R5)3??[Chemical Formula 2] Si(R6)4.

Abstract: A method for manufacturing a display panel, including defining a desorbing area of a support substrate by forming one of a release layer or a recess portion in the desorbing area, cleaning a surface of the support substrate, disposing a thin film substrate on the support substrate, directly bonding, in an adsorbing area external to the desorbing area, the thin film substrate to the support substrate, forming a pixel and a sealing member on the thin film substrate, cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area, and separating the support substrate from the thin film substrate.

Abstract: An organic light emitting diode display may include a display substrate including an organic light emitting diode, a sealing member facing the display substrate to cover the organic light emitting diode, a sealant positioned between the display substrate and the sealing member and bonding the display substrate and the sealing member, and a reinforcing member positioned at an outer surface of the sealant and a space between the display substrate and the sealing member, in which shear stress and hardness of the reinforcing member are a function of a sum of thicknesses of the display substrate and the sealing member.

Abstract: A method for manufacturing a flexible display device includes forming a separation layer on a carrier substrate, laminating a flexible substrate having an area that is larger than an area of the separation layer, to the separation layer; forming a dummy pattern on and along an edge of the flexible substrate; exposing a portion of the separation layer by removing a portion of the flexible substrate at a side of the flexible substrate; and separating the separation layer and the flexible substrate from each other.

Abstract: A substrate cleaning system including a carrying unit having a plurality of rollers for carrying a substrate, wherein each of the rollers includes a roller shaft and a plurality of division rollers coupled to the roller shaft, and wherein a gap between adjacent ones of the roller shafts is larger than a radius of each of the division rollers; a first rinse unit located along the carrying unit and configured to apply a first cleaning liquid onto the substrate; and a cleaning unit comprising a slit nozzle and configured to apply a second cleaning liquid to the substrate after it encounters the first rinse unit.

Abstract: A manufacturing method of an organic light emitting diode (“OLED”) display includes: forming a contact pattern on a panel region of a surface of a board glass, where the board glass includes the panel region, and a peripheral area which surrounds the panel region; contacting the paper glass with a surface of the contact pattern corresponding to the panel region and the surface of the board glass corresponding to the peripheral area; adhering the surface of the board glass corresponding to the peripheral area to a surface of the paper glass; forming an organic light emitting element on the paper glass corresponding to the panel region; and separating the paper glass from the board glass by cutting the paper glass at a position corresponding to an end portion of the panel region adjacent to the peripheral area.

Abstract: A mother panel for a display panel includes a first mother substrate and a second mother substrate that are spaced apart from each other to face each other, each of which includes at least one usable area that is usable as the display panel, and at least one unusable area that surrounds the usable area. The mother panel also includes a plurality of display panel patterns between the first mother substrate and the second mother substrate that are spaced apart from one another in the usable area, a seal pattern that adheres the first mother substrate with the second mother substrate and seals each of the plurality of display panel patterns, and an etching stopping unit that prevents an etchant from permeating between the first mother substrate and the second mother substrate and prevents a boundary area of an etching target surface from being etched.

Abstract: A method for manufacturing a display panel, including defining a desorbing area of a support substrate by forming one of a release layer or a recess portion in the desorbing area, cleaning a surface of the support substrate, disposing a thin film substrate on the support substrate, directly bonding, in an adsorbing area external to the desorbing area, the thin film substrate to the support substrate, forming a pixel and a sealing member on the thin film substrate, cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area, and separating the support substrate from the thin film substrate.

Abstract: An organic light emitting diode display may include a display substrate including an organic light emitting diode, a sealing member facing the display substrate to cover the organic light emitting diode, a sealant positioned between the display substrate and the sealing member and bonding the display substrate and the sealing member, and a reinforcing member positioned at an outer surface of the sealant and a space between the display substrate and the sealing member, in which shear stress and hardness of the reinforcing member are a function of a sum of thicknesses of the display substrate and the sealing member.

Abstract: A manufacturing method of an organic light emitting diode (“OLED”) display includes: forming a contact pattern on a panel region of a surface of a board glass, where the board glass includes the panel region, and a peripheral area which surrounds the panel region; contacting the paper glass with a surface of the contact pattern corresponding to the panel region and the surface of the board glass corresponding to the peripheral area; adhering the surface of the board glass corresponding to the peripheral area to a surface of the paper glass; forming an organic light emitting element on the paper glass corresponding to the panel region; and separating the paper glass from the board glass by cutting the paper glass at a position corresponding to an end portion of the panel region adjacent to the peripheral area.

Abstract: A method for manufacturing a flexible display device includes forming a separation layer on a carrier substrate, laminating a flexible substrate having an area that is larger than an area of the separation layer, to the separation layer; forming a dummy pattern on and along an edge of the flexible substrate; exposing a portion of the separation layer by removing a portion of the flexible substrate at a side of the flexible substrate; and separating the separation layer and the flexible substrate from each other.