Abstract: Embodiments of the present disclosure relate to the technical field of signal transmission, and in particular to a printed circuit board and a signal transmission system. In the printed circuit board, a first signal line (140) extends, by means of passing through a second hole segment (135) and a fourth hole segment (137), from one first differential signal hole pair (121) of a first column structural unit (120) to the side of a second column structural unit (130) that is away from the first column structural unit; or, a first signal line (340) extends, by means of passing through two adjacent second ground holes (332), from one first differential signal hole pair (321) of a first column structural unit (320) to the side of a second column structural unit (330) that is away from the first column structural unit (320).

Abstract: A cable assembly, a circuit board, a connection structure, and an electronic device are disclosed. The cable assembly may include: a cable, including a signal line and a shielding layer; a first connecting member, including a first connecting portion and a second connecting portion, the first connecting portion is connected to the signal line, the second connecting portion is elastically deformable, and the second connecting portion is configured to be elastically connected to a circuit board provided with a first conductive interface; and a second connecting member, including a third connecting portion and a fourth connecting portion, the third connecting portion is connected to the shielding layer, the fourth connecting portion is elastically deformable, and the fourth connecting portion is configured to be elastically connected to the circuit board provided with a second conductive interface.

Abstract: The present application relates to a circuit technology, and discloses a printed circuit board, including: a board body portion comprising a plurality of core boards and a plurality of dielectric layers, the plurality of core boards including a plurality of conductor layers, and the plurality of conductor layers including a differential signal transmission layer located on a surface layer of the board body portion and a differential signal line out layer located on an inner layer of the board body portion; two opposite differential signal holes located on the board body portion, the two differential signal holes being passed sequentially from the differential signal transmission layer to the differential signal line out layer through at least a portion of the core boards and connect the differential signal transmission layer to the differential signal line out layer; and two slotted conductive posts located between the two differential signal holes.

Abstract: Embodiments of the present disclosure relate to the technical field of signal transmission, and in particular to a printed circuit board and a signal transmission system. In the printed circuit board, a first signal line (140) extends, by means of passing through a second hole segment (135) and a fourth hole segment (137), from one first differential signal hole pair (121) of a first column structural unit (120) to the side of a second column structural unit (130) that is away from the first column structural unit; or, a first signal line (340) extends, by means of passing through two adjacent second ground holes (332), from one first differential signal hole pair (321) of a first column structural unit (320) to the side of a second column structural unit (330) that is away from the first column structural unit (320).

Abstract: Provided in embodiments of the present disclosure are a cable connection structure, a cable connection component, and an electrical interconnection system. The cable connection structure includes a conductive part and a fixing part for fixing the conductive part. The conductive part includes at least one pair of first signal conductors arranged at an interval in a first direction, and at least one pair of second signal conductors arranged at an interval in a second direction. The first signal conductor is electrically connected to a first-type cable. The second signal conductor is electrically connected to a second-type cable with a diameter greater than that of the first-type cable. The first signal conductors are electrically connected to the second signal conductors in one-to-one correspondence. A width of the first signal conductor in the first direction is less than a width of the second signal conductor in the second direction.

Abstract: Provided are a method for determining parameters of a waveguide core in an optical-electronic printed circuit board, an optical-electronic printed circuit board, an electronic device, and a storage medium. The method includes: determining, according to a refractive index of a material from which the waveguide core is made and a refractive index of a material from which a base layer is made, a critical angle of total reflection at an interface between the waveguide core and the base layer; and determining the parameters of the waveguide core according to a relative positional relationship between one end port of the waveguide core and the other end port of the waveguide core in the optical-electronic printed circuit board, a condition of a region through which the waveguide core passes, and the critical angle, so that steering of the waveguide core is achieved without introducing a curved surface to the waveguide core.

Abstract: The present application relates to a circuit technology, and discloses a printed circuit board, including: a board body portion comprising a plurality of core boards and a plurality of dielectric layers, the plurality of core boards including a plurality of conductor layers, and the plurality of conductor layers including a differential signal transmission layer located on a surface layer of the board body portion and a differential signal line out layer located on an inner layer of the board body portion; two opposite differential signal holes located on the board body portion, the two differential signal holes being passed sequentially from the differential signal transmission layer to the differential signal line out layer through at least a portion of the core boards and connect the differential signal transmission layer to the differential signal line out layer; and two slotted conductive posts located between the two differential signal holes.

Abstract: A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Abstract: Embodiments of the present disclosure relate to the field of communication device technology, which provide a circuit board including a first signal line and a second signal line that are disposed adjacent to each other, a ground plane, and a conductive layer connected to the ground plane. The conductive layer is disposed between the first signal line and the second signal line. Embodiments of the present disclosure further provide a communication device.

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Abstract: A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.

Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.