Abstract: Embodiments of the present disclosure relate to the technical field of signal transmission, and in particular to a printed circuit board and a signal transmission system. In the printed circuit board, a first signal line (140) extends, by means of passing through a second hole segment (135) and a fourth hole segment (137), from one first differential signal hole pair (121) of a first column structural unit (120) to the side of a second column structural unit (130) that is away from the first column structural unit; or, a first signal line (340) extends, by means of passing through two adjacent second ground holes (332), from one first differential signal hole pair (321) of a first column structural unit (320) to the side of a second column structural unit (330) that is away from the first column structural unit (320).

Abstract: Provided in embodiments of the present disclosure are a cable connection structure, a cable connection component, and an electrical interconnection system. The cable connection structure includes a conductive part and a fixing part for fixing the conductive part. The conductive part includes at least one pair of first signal conductors arranged at an interval in a first direction, and at least one pair of second signal conductors arranged at an interval in a second direction. The first signal conductor is electrically connected to a first-type cable. The second signal conductor is electrically connected to a second-type cable with a diameter greater than that of the first-type cable. The first signal conductors are electrically connected to the second signal conductors in one-to-one correspondence. A width of the first signal conductor in the first direction is less than a width of the second signal conductor in the second direction.

Abstract: A magnetic coupling device according to an embodiment of the present invention includes a first bobbin including an upper surface, a lower surface, and an outer surface, a groove portion which is disposed on the inner side of the outer surface and is concave from the upper surface toward the lower surface, and a first terminal portion and a second terminal portion which are disposed on the outer surface and spaced apart from each other; a second bobbin disposed on the groove portion and accommodating a magnetic substance core; and a first coil and a second coil which are wound on the second bobbin and spaced apart from each other, wherein the first coil includes a first winding portion and a first extension portion, and the second coil includes a second winding portion, and a second extension portion.

Abstract: Provided are a method for determining parameters of a waveguide core in an optical-electronic printed circuit board, an optical-electronic printed circuit board, an electronic device, and a storage medium. The method includes: determining, according to a refractive index of a material from which the waveguide core is made and a refractive index of a material from which a base layer is made, a critical angle of total reflection at an interface between the waveguide core and the base layer; and determining the parameters of the waveguide core according to a relative positional relationship between one end port of the waveguide core and the other end port of the waveguide core in the optical-electronic printed circuit board, a condition of a region through which the waveguide core passes, and the critical angle, so that steering of the waveguide core is achieved without introducing a curved surface to the waveguide core.

Abstract: The present application relates to a circuit technology, and discloses a printed circuit board, including: a board body portion comprising a plurality of core boards and a plurality of dielectric layers, the plurality of core boards including a plurality of conductor layers, and the plurality of conductor layers including a differential signal transmission layer located on a surface layer of the board body portion and a differential signal line out layer located on an inner layer of the board body portion; two opposite differential signal holes located on the board body portion, the two differential signal holes being passed sequentially from the differential signal transmission layer to the differential signal line out layer through at least a portion of the core boards and connect the differential signal transmission layer to the differential signal line out layer; and two slotted conductive posts located between the two differential signal holes.

Abstract: An inductor according to an embodiment includes a core unit and a coil unit wherein a first coil unit includes a first upper conductive pattern and a first lower conductive pattern, wherein the second coil unit includes a second upper conductive pattern and a second lower conductive pattern, wherein the coil unit includes a center portion, a first pattern lead-out portion, and a second pattern lead-out portion, and wherein, in the second pattern lead-out portion, the second upper conductive pattern and the second lower conductive pattern overlap each other in a vertical direction such that at least a portion of the second upper conductive pattern and at least a portion of the second lower conductive pattern intersect each other when viewed in a plan view.

Abstract: A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Abstract: Disclosed is a magnetic component. The magnetic component of the disclosure includes a core unit including an upper core and a lower core, a bobbin unit having at least a portion disposed inside the core unit, and a coil unit including primary coils and secondary coils wound around the bobbin unit in a second direction, which is perpendicular to a first direction oriented from the upper core toward the lower core. The bobbin unit includes a first terminal accommodation portion and a second terminal accommodation portion. The first terminal accommodation portion accommodates first terminal pins, connected to at least some of the secondary coils in the second direction and having end portions bent in the first direction. The second terminal accommodation portion accommodates second terminal pins, connected to the remaining ones of the secondary coils in the second direction and having end portions bent in the first direction.

Abstract: A pressure sensing insole according to an embodiment of the present invention includes: a first electrode layer including a first conductive region; a first adhesive layer disposed on the first electrode layer and including an insulating region; an intermediate layer disposed on the first adhesive layer; a second adhesive layer disposed on the intermediate layer and including an insulating region; and a second electrode layer disposed on the second adhesive layer and including a second conductive region.

Abstract: Embodiments of the present disclosure relate to the field of communication device technology, which provide a circuit board including a first signal line and a second signal line that are disposed adjacent to each other, a ground plane, and a conductive layer connected to the ground plane. The conductive layer is disposed between the first signal line and the second signal line. Embodiments of the present disclosure further provide a communication device.

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Abstract: A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

Abstract: A pressure sensing element may include: an intermediate layer having a structure in which at least two functional layers are stacked on each other; a first electrode layer including a plurality of first electrode patterns; and a second electrode layer to overlap the first electrode layer with the intermediate layer between the first and second electrode layers. Among the two functional layers, the first functional layer has a thickness linearly varying in a first pressure section, and the second functional layer has a thickness linearly varying in a second pressure section. The maximum pressure in the first pressure section is lower than that in the second pressure section, and the minimum pressure in the second pressure section is included in the first pressure section.

Abstract: A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a second region and connected to the plurality of signal electrodes, the first electrode layer being made of a conductive fiber; an elastic dielectric layer arranged in the first region; and a second electrode layer arranged in the elastic dielectric layer, the second electrode layer being made of a conductive fiber.

Abstract: A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.

Abstract: A pressure sensing insole according to an embodiment of the present invention includes: a first electrode layer including a first conductive region; a first adhesive layer disposed on the first electrode layer and including an insulating region; an intermediate layer disposed on the first adhesive layer; a second adhesive layer disposed on the intermediate layer and including an insulating region; and a second electrode layer disposed on the second adhesive layer and including a second conductive region.

Abstract: A sensor device may include an elastic dielectric; a sensing unit including a first wiring and a second wiring for outputting sensing signals, and a flexible printed circuit board provided with a first connection terminal to which the first wiring is connected, and with a second connection terminal to which the second wiring is connected. The first wiring is formed on one surface of the dielectric and may be connected to the first connection terminal. The second wiring is formed on another surface of the dielectric facing the surface on which the first wiring is formed and may be connected to the second connection terminal.

Abstract: A sensor device may detect pressure. The sensor device may comprise: an elastic dielectric; a first wiring formed on one surface of the elastic dielectric; a second wiring formed on another surface of the elastic dielectric facing the surface on which the first wiring is formed; and a flexible printed circuit board, which is connected to the first wiring and the second wiring, for receiving signals transferred from the first wiring and the second wiring.

Abstract: A pressure sensor formed in a sheet type is provided, including conductive fibers, nonconductive fibers, and piezoresistive fibers, which are woven together, wherein the pressure sensor includes a first electrode layer including the conductive fibers and the nonconductive fibers, a second electrode layer including the conductive fibers and the nonconductive fibers, and a piezoresistive layer including the piezoresistive fibers and disposed between the first electrode layer and the second electrode layer.