Patents by Inventor Bi YI

Bi YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9726811
    Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: August 8, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Se Woong Na, Min Jae Kim, Bi Yi Kim, Hyun Gyu Park, In Hee Cho, Man Hue Choi, Seung Kwon Hong
  • Publication number: 20170003441
    Abstract: A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.
    Type: Application
    Filed: June 11, 2014
    Publication date: January 5, 2017
    Inventors: Man Hue CHOI, Min Jae KIM, Bi Yi KIM, Se Woong NA, Hyun Gyu PARK, In Hee CHO, Seung Kwon HONG
  • Publication number: 20160323995
    Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.
    Type: Application
    Filed: May 21, 2014
    Publication date: November 3, 2016
    Inventors: Bi YI, Fengchao MA, Yonghui REN, Wang XIONG, Yingxin WANG
  • Patent number: 9482810
    Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: November 1, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Man Hue Choi, Min Jae Kim, Bi Yi Kim, Se Woong Na, Hyun Gyu Park, In Hee Cho, Seung Kwon Hong
  • Publication number: 20160124141
    Abstract: Provided are a circuit board, and a lighting device and board housing module having the circuit board, the circuit board, including a support substrate having a first region and a second region bent from the first region, light emitting devices on the first region, and a protective support portion protruding more than the light emitting devices from the support substrate of the first region.
    Type: Application
    Filed: May 8, 2014
    Publication date: May 5, 2016
    Inventors: Se Woong NA, Min Jae KIM, Bi Yi KIM, Hyun Gyu PARK, In Hee CHO, Man Hue CHOI, Seung Kwon HONG
  • Publication number: 20150009710
    Abstract: Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.
    Type: Application
    Filed: May 30, 2014
    Publication date: January 8, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Min Jae KIM, Bi Yi KIM, Se Woong NA, Hyun Gyu PARK, In Hee CHO, Man Hue CHOI, Seung Kwon HONG
  • Publication number: 20150003110
    Abstract: Provided is a lighting unit, including: a support substrate; a light guide plate for guiding light generated from a light source; and a first stopper fixed to the support substrate and configured to support the light guide plate.
    Type: Application
    Filed: May 30, 2014
    Publication date: January 1, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Man Hue CHOI, Min Jae KIM, Bi Yi KIM, Se Woong NA, Hyun Gyu PARK, In Hee CHO, Seung Kwon HONG
  • Publication number: 20150003064
    Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.
    Type: Application
    Filed: June 25, 2014
    Publication date: January 1, 2015
    Inventors: Man Hue CHOI, Min Jae KIM, Bi Yi KIM, Se Woong NA, Hyun Gyu PARK, In Hee CHO, Seung Kwon HONG
  • Publication number: 20140376265
    Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.
    Type: Application
    Filed: May 29, 2014
    Publication date: December 25, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Se Woong NA, Min Jae KIM, Bi Yi KIM, Hyun Gyu PARK, In Hee CHO, Man Hue CHOI, Seung Kwon HONG