Abstract: An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

Abstract: A light-guiding structure with phosphor material layers includes a light-guiding unit, a light-emitting unit and a phosphor unit. The light-emitting unit is disposed beside an outer lateral side of the light-guiding unit. The phosphor unit is connected with the light-guiding unit and is disposed between the light-guiding unit and the light-emitting unit. In addition, the phosphor unit is formed or pasted on the lateral side of the light-guiding unit, and the light-emitting unit has a PCB substrate and a plurality of light-emitting elements electrically disposed on the PCB substrate and facing the light-guiding unit. Hence, light beams generated by the light-emitting elements of the light-emitting unit pass through the phosphor unit to form another light beams, and the light beams are guided into the light-guiding unit. Finally, the light beams are projected out from a light-exiting face of the light-guiding unit.

Abstract: A white light-emitting diode package structure for simplifying package process includes a substrate unit, a light-emitting unit, a phosphor unit and a conductive unit. The light-emitting unit is disposed on the substrate, and the light-emitting unit has a positive conductive layer and a negative conductive layer. The phosphor unit has a phosphor layer formed on the light-emitting unit and at least two openings for respectively exposing one partial surface of the positive electrode layer and one partial surface of the negative electrode layer. The conductive unit has at least two conductive wires respectively passing through the two openings in order to electrically connect the positive electrode layer with the substrate unit and electrically connect the negative electrode layer with the substrate unit.

Abstract: A reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency includes a reflection-type lampshade unit, a heat pipe unit and a light-emitting unit. The reflection-type lampshade unit has an open casing, a receiving space formed in the open casing, and a first reflective structure is disposed in the receiving space and on an inner surface of the open casing. The heat pipe unit is received in the receiving space and is disposed on the open casing. The light-emitting unit is disposed on the heat pipe unit, and the light-emitting unit has a light-emitting face facing the inner surface of the open casing.

Abstract: A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.

Abstract: A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.

Abstract: A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract: An optical object distance simulation device for reducing total optical path includes: a lens, an achromatic lens set, a first image lens, and a second image lens. The achromatic lens set disposes beside one side of the lens, the first image lens disposes beside one side of the achromatic lens set, and the second image lens disposes beside one side of the first image lens. The achromatic lens set is composed of a first lens and a second lens. The first lens is a double-concave lens. The second lens is a double-convex lens. One concave face of the double-concave tightly contacts with one convex face of the double-convex lens. Therefore, the lens, the achromatic lens set, the first image lens, and the second image lens match with each other in order to simulate real object distance for reducing an object distance between a test camera lens and a corresponding chart.

Abstract: A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information.

Abstract: A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.

Abstract: A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.

Abstract: A die defect inspecting system with a die defect inspecting function includes a wafer-positioning module, an image-capturing module, a die-sucking module, a die defect analyzing module, a die-classifying module and a control module. The image-capturing module is disposed beside one side of the wafer-positioning module in order to capture an image of each die. The die-sucking module is disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die. The die defect analyzing module is electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard.

Abstract: An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

Abstract: A light source module of a white light emitting diode comprising a blue LED, a packaging substrate, wherein the blue LED is mounted on and electrically connected to the packaging substrate, a cap layer, enclosing the blue LED, wherein the cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5, and a protective layer over the cap layer.

Abstract: A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.

Abstract: The present invention relates to an LED driving circuit and a serial LED illumination system. The LED driving circuit compares a data signal with a voltage threshold via a comparator to output a mode selection signal. The register unit includes an instruction register and a data register. The register unit is coupled to the comparator unit and controlled by the mode selection signal to perform an instruction or data transmission mode. The instruction register stores the instruction data under the instruction mode. The data register stores the illumination display data under the data transmission mode. When the data register is full, the register unit outputs a secondary data signal. The driving unit is controlled by the instruction data and drives an LED module according to the illumination display data. The serial LED illumination system includes a controller that is connected with at least one LED driving circuit in serial.

Abstract: An illumination device with a fire-fighting function includes a transparent hollow casing, fire-fighting water, a light-emitting unit, and a light-guiding unit. The transparent hollow casing has a receiving space. The fire-fighting water is filled into the receiving space of the transparent hollow casing. The light-emitting unit has a plurality of light-emitting elements disposed beside one or more lateral sides of the transparent hollow casing. The light-guiding unit is disposed over the transparent hollow casing. Hence, when fire accident happens, the transparent hollow casing will melt and crack due to the developed over-heat, and the fire-fighting water is sprayed out from the receiving spaces in order to extinguish one part of flames. Therefore, the present invention can be used as a lighting device or can be used as a fire-fighting device when fire accident happens.

Abstract: An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.