Abstract: An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

Abstract: An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

Abstract: A lamp body is an enclosing structure that encloses a blue light-emitting crystal to form a LED structure. In a method of manufacturing frame body of the LED, resin, titanium, and fluorescent powder are mixed uniformly to constitute a composition of frame body, then the composing materials being placed into a mould for processing a thermally pressing procedure to thus form a frame body. By the blue light emitted from the blue light-emitting crystal, the fluorescent powder of the frame body may be excited to emit uniform yellow light, which may be further mixed with the blue light to become white light.

Abstract: A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed.

Abstract: A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.

Abstract: A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.

Abstract: An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

Abstract: An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.

Abstract: A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.

Abstract: A micro-tracking device for tracing action track of animals is disclosed. The micro-tracking device has a weight between 1 and 10 grams and is fastened on any animal's any position (especially a flight animal's concave ring portion between its body and tail), for capturing action track information (for example, a current height value and a speed value of about flight animal, current position and time information about the flight animal) of the animal using GPS and controlling action statuses of the animal effectively.

Abstract: An optical object distance simulation device is disclosed. The device has an optical lens module composed of a plurality of optical lens and the optical lens module is arranged between an optical lens and a chart for simulating the real object distance and reducing the space required for testing an optical lens. Moreover, the optical lens module is separated from a light-emitting element, a power supply or any heat-generating elements all separated from the optical lens module. Furthermore, the heat-dissipating elements are arranged near elements that generate substantial heat. Hence, not only does the present invention have a good heat-dissipating effect, but it also prevents external dust from polluting the optical lens module because of the positioning of the heat-dissipating element and the heat-dissipating hole.

Abstract: An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.

Abstract: A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.

Abstract: A uniform light generating system for adjusting output brightness, including a light-generating unit, a light-transmitting unit, a hollow spheroid unit, a light-sensing unit, and a control unit. The light-generating unit has a light-emitting element for generating light beams and a brightness control element for adjusting the luminous flux of the light beam. The hollow spheroid unit is communicated with the other side of the light-transmitting unit for guiding the light beams into an external casing of the hollow spheroid unit. The light-sensing unit detects electric power values in the external casing. The control unit is electrically connected to the light-generating unit and the light-sensing unit. Thereby a user can obtain a real illumination value via adjusting the illumination values of the light beams that are projected from the hollow spheroid unit.

Abstract: An electronic device shell providing waterproofing and non-screw functions includes a first shell, a second shell, and a waterproof ring. The first shell covers the second shell via the waterproof ring. Via the fixing structure of the fist shell and the second shell, the waterproof ring is pressed tightly against the fist shell and the second shell. Thus, waterproofing and non-screw functions are provided.

Abstract: An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit.

Abstract: A portable wireless earphone apparatus with a global positioning system integrates a wireless earphone with a wireless global positioning system to create a personnel portable apparatus. The user can carry this apparatus and access a Bluetooth wireless cell phone. When the user is driving, the apparatus can be used as a GPS Bluetooth wireless receiver. The apparatus has more than two functions. The apparatus also provides the functions of GPS tracking record, GPS traveling location record, GPS special traveling location record and a portable flash disc. The portable wireless earphone apparatus with a global positioning system includes a microcontroller, a GPS module, a Bluetooth wireless module, a memory module, a display module, a sound output module, an input device and a power supply module.

Abstract: A micro-tracking device for tracing action track of animals is disclosed. The micro-tracking device has a weight between 1 and 10 grams and is fastened on any animal's any position (especially a flight animal's concave ring portion between its body and tail), for capturing action track information (for example, a current height value and a speed value of about flight animal, current position and time information about the flight animal) of the animal using GPS and controlling action statuses of the animal effectively.

Abstract: The present invention is related to a color-mixture display unit and an image display apparatus using the same, wherein the image display apparatus includes at least one color-mixture pixel which is pre-disposed at plates of a light box so that a pattern is formed. Each of the color-mixture pixels is equipped with a red filter, a green filter and a blue filter, or equipped with a black filter or equipped with a transparent filter. At least one color-mixture LED is disposed within the light box and provides a backlight for the color-mixture pixel. In this regard, the color-mixture LEDs are controlled by an image controller and provide various color light beams with the color-mixture pixels. In addition, arrangement of each color filter within the color-mixture pixel is utilized so that color-mixture effect of dynamic image is shown.

Abstract: An optical object distance simulation device is disclosed. The device has an optical lens module composed of a plurality of optical lens and the optical lens module is arranged between an optical lens and a chart for simulating the real object distance and reducing the space required for testing an optical lens. Moreover, the optical lens module is separated from a light-emitting element, a power supply or any heat-generating elements all separated from the optical lens module. Furthermore, the heat-dissipating elements are arranged near elements that generate substantial heat. Hence, not only does the present invention have a good heat-dissipating effect, but it also prevents external dust from polluting the optical lens module because of the positioning of the heat-dissipating element and the heat-dissipating hole.