Patents by Inventor Bin Mo
Bin Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240129384Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determine a current data transmission sequence number for a next packet in a communication session with a remote computing device. An interruption in the communication session is detected. Checkpointed data for the communication session is determined that is indicative of a previous sequence number used for a previous packet sent to the remote computing device. A resolution procedure is performed to determine the current data transmission sequence number for the next packet in the communication session, including determining an estimated next sequence number for transmitting data in the communication session based on the checkpointed data, transmitting a first packet to the remote computing device, receiving a second packet from the remote computing device that has an associated sequence number, and determining the current sequence number for the next packet in the communication session.Type: ApplicationFiled: July 21, 2023Publication date: April 18, 2024Applicant: Casa Systems, Inc.Inventors: Shane Hooker, Bin Mo, Jacob Eipe, Gaurav Paliwal
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Publication number: 20240076985Abstract: For the problem of difficult roof anchor withdrawal at the end of a working face, a static crushing directional anchor withdrawal method at the end of a large-mining-height working face is provided. The method includes the following steps: designing key parameters of boreholes for static crushing, including a borehole position, a spacing between boreholes, a borehole depth, and a borehole diameter at the end of a working face; then determining parameters of a static crushing agent grouting technology device for the construction of a static crushing process; and carrying out an anchor withdrawal operation at the end.Type: ApplicationFiled: May 23, 2023Publication date: March 7, 2024Inventors: Xuandong LI, Fuqi WANG, Zhixiang LI, Jun WU, Chao GAO, Bin TIAN, Jiangning WANG, Yuanda REN, Dongdong WANG, Longfei WANG, Hua ZHANG, Jianhua CHEN, Zhenghu MO, Xiaogang LI
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Publication number: 20240001319Abstract: Provided are an apparatus for producing inorganic powder, and a method of producing inorganic powder by using such. The apparatus includes a vaporization part where a condensed-phase precursor is vaporized to obtain a gas-phase precursor, a partial precipitation part where the gas-phase precursor obtained in the vaporization part is partially precipitated to a condensed phase, and a reaction part where the gas-phase precursor remaining after being partially precipitated to a condensed phase in the partial precipitation part reacts with a reaction gas to obtain inorganic powder. An equilibrium vapor pressure of the gas-phase precursor in the partial precipitation part is lower than a vapor pressure of the gas-phase precursor obtained in the vaporization part, and an equilibrium vapor pressure of the precursor in the reaction part is equal to or higher than a vapor pressure of the gas-phase precursor partially precipitated to a condensed phase in the partial precipitation part.Type: ApplicationFiled: September 18, 2023Publication date: January 4, 2024Inventors: Seung Min YANG, Kyung Hoon KIM, Gun Hee KIM, Young Kyu JEONG, O Hyung KWON, Chan Bin MO, Yong Su JO, Hye Min PARK, Gwang Hwa JIN
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Publication number: 20230405917Abstract: A mobile phone screen protective film having dust removal function and a film pasting auxiliary device are provided. An electrostatic protective film is disposed on an upper side of a mobile phone film body. A pulling film is disposed on an upper side of the electrostatic protective film. A connecting structure is disposed at front ends of the electrostatic protective film and the pulling film. An opening is defined on a main housing of the film pasting auxiliary device. A positioning frame is distributed in the main housing. A film body placing groove is extended out from the positioning frame in a direction of the opening. A positioning avoiding groove is defined on a first side of the positioning frame. A pulling opening is defined on a second side of the positioning frame. A positioning connecting mechanism is disposed between the main housing and the mobile phone film body.Type: ApplicationFiled: July 8, 2022Publication date: December 21, 2023Inventor: BIN MO
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Patent number: 11794160Abstract: Provided are an apparatus for producing inorganic powder, and a method of producing inorganic powder by using such. The apparatus includes a vaporization part where a condensed-phase precursor is vaporized to obtain a gas-phase precursor, a partial precipitation part where the gas-phase precursor obtained in the vaporization part is partially precipitated to a condensed phase, and a reaction part where the gas-phase precursor remaining after being partially precipitated to a condensed phase in the partial precipitation part reacts with a reaction gas to obtain inorganic powder. An equilibrium vapor pressure of the gas-phase precursor in the partial precipitation part is lower than a vapor pressure of the gas-phase precursor obtained in the vaporization part, and an equilibrium vapor pressure of the precursor in the reaction part is equal to or higher than a vapor pressure of the gas-phase precursor partially precipitated to a condensed phase in the partial precipitation part.Type: GrantFiled: December 7, 2021Date of Patent: October 24, 2023Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Seung Min Yang, Kyung Hoon Kim, Gun Hee Kim, Young Kyu Jeong, O Hyung Kwon, Chan Bin Mo, Yong Su Jo, Hye Min Park, Gwang Hwa Jin
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Patent number: 11750725Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determine a current data transmission sequence number for a next packet in a communication session with a remote computing device. An interruption in the communication session is detected. Checkpointed data for the communication session is determined that is indicative of a previous sequence number used for a previous packet sent to the remote computing device. A resolution procedure is performed to determine the current data transmission sequence number for the next packet in the communication session, including determining an estimated next sequence number for transmitting data in the communication session based on the checkpointed data, transmitting a first packet to the remote computing device, receiving a second packet from the remote computing device that has an associated sequence number, and determining the current sequence number for the next packet in the communication session.Type: GrantFiled: December 3, 2021Date of Patent: September 5, 2023Assignee: Casa Systems, Inc.Inventors: Shane Hooker, Bin Mo, Jacob Eipe, Gaurav Paliwal
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Publication number: 20230144295Abstract: Provided are an apparatus for producing inorganic powder, and a method of producing inorganic powder by using such. The apparatus includes a vaporization part where a condensed-phase precursor is vaporized to obtain a gas-phase precursor, a partial precipitation part where the gas-phase precursor obtained in the vaporization part is partially precipitated to a condensed phase, and a reaction part where the gas-phase precursor remaining after being partially precipitated to a condensed phase in the partial precipitation part reacts with a reaction gas to obtain inorganic powder. An equilibrium vapor pressure of the gas-phase precursor in the partial precipitation part is lower than a vapor pressure of the gas-phase precursor obtained in the vaporization part, and an equilibrium vapor pressure of the precursor in the reaction part is equal to or higher than a vapor pressure of the gas-phase precursor partially precipitated to a condensed phase in the partial precipitation part.Type: ApplicationFiled: December 7, 2021Publication date: May 11, 2023Inventors: Seung Min YANG, Kyung Hoon KIM, Gun Hee KIM, Young Kyu JEONG, O Hyung KWON, Chan Bin MO, Yong Su JO, Hye Min PARK, Gwang Hwa JIN
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Patent number: 11390054Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: GrantFiled: July 13, 2020Date of Patent: July 19, 2022Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20220094771Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determine a current data transmission sequence number for a next packet in a communication session with a remote computing device. An interruption in the communication session is detected. Checkpointed data for the communication session is determined that is indicative of a previous sequence number used for a previous packet sent to the remote computing device. A resolution procedure is performed to determine the current data transmission sequence number for the next packet in the communication session, including determining an estimated next sequence number for transmitting data in the communication session based on the checkpointed data, transmitting a first packet to the remote computing device, receiving a second packet from the remote computing device that has an associated sequence number, and determining the current sequence number for the next packet in the communication session.Type: ApplicationFiled: December 3, 2021Publication date: March 24, 2022Applicant: Casa Systems, Inc.Inventors: Shane Hooker, Bin Mo, Jacob Eipe, Gaurav Paliwal
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Patent number: 11218578Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determine a current data transmission sequence number for a next packet in a communication session with a remote computing device. An interruption in the communication session is detected. Checkpointed data for the communication session is determined that is indicative of a previous sequence number used for a previous packet sent to the remote computing device. A resolution procedure is performed to determine the current data transmission sequence number for the next packet in the communication session, including determining an estimated next sequence number for transmitting data in the communication session based on the checkpointed data, transmitting a first packet to the remote computing device, receiving a second packet from the remote computing device that has an associated sequence number, and determining the current sequence number for the next packet in the communication session.Type: GrantFiled: February 5, 2020Date of Patent: January 4, 2022Assignee: Casa Systems, Inc.Inventors: Shane Hooker, Bin Mo, Jacob Eipe, Gaurav Paliwal
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Publication number: 20200338859Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: ApplicationFiled: July 13, 2020Publication date: October 29, 2020Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20200252489Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to determine a current data transmission sequence number for a next packet in a communication session with a remote computing device. An interruption in the communication session is detected. Checkpointed data for the communication session is determined that is indicative of a previous sequence number used for a previous packet sent to the remote computing device. A resolution procedure is performed to determine the current data transmission sequence number for the next packet in the communication session, including determining an estimated next sequence number for transmitting data in the communication session based on the checkpointed data, transmitting a first packet to the remote computing device, receiving a second packet from the remote computing device that has an associated sequence number, and determining the current sequence number for the next packet in the communication session.Type: ApplicationFiled: February 5, 2020Publication date: August 6, 2020Applicant: Casa Systems, Inc.Inventors: Shane Hooker, Bin Mo, Jacob Eipe, Gaurav Paliwal
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Patent number: 10710336Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.Type: GrantFiled: August 29, 2014Date of Patent: July 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Patent number: 10535628Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: November 2, 2011Date of Patent: January 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Michael T. Marczi, Bawa Singh, Monnir Boureghda
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Patent number: 10481005Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.Type: GrantFiled: October 11, 2018Date of Patent: November 19, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Se Jin Oh, Tae Kyun Kang, Yu Sin Kim, Jae Ik Kim, Chan Bin Mo, Doug Yong Sung, Seung Bin Ahn, Kul Inn, Yun Kwang Jeon
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Publication number: 20190323893Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.Type: ApplicationFiled: October 11, 2018Publication date: October 24, 2019Inventors: SE JIN OH, TAE KYUN KANG, YU SIN KIM, JAE IK KIM, CHAN BIN MO, DOUG YONG SUNG, SEUNG BIN AHN, KUL INN, YUN KWANG JEON
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Patent number: 10065274Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.Type: GrantFiled: August 29, 2014Date of Patent: September 4, 2018Inventors: Ranjit Pandher, Bawa Singh, Rahul Raut, Sanyogita Arora, Ravindra Bhatkal, Bin Mo
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Patent number: D908195Type: GrantFiled: July 1, 2020Date of Patent: January 19, 2021Inventor: Bin Mo
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Patent number: D931989Type: GrantFiled: September 29, 2020Date of Patent: September 28, 2021Inventor: Bin Mo
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Patent number: D992542Type: GrantFiled: January 25, 2022Date of Patent: July 18, 2023Inventor: Bin Mo