Abstract: A solar cell including a first conductive type semiconductor substrate; a first intrinsic semiconductor layer on a front surface of the semiconductor substrate; a first conductive type first semiconductor layer on at least one surface of the first intrinsic semiconductor layer; a second conductive type second semiconductor layer on a back surface of the semiconductor substrate; a second intrinsic semiconductor layer between the second semiconductor layer and the semiconductor substrate; a first conductive type third semiconductor layer on the back surface of the semiconductor substrate, the third semiconductor layer being spaced apart from the second semiconductor layer; and a third intrinsic semiconductor layer between the third semiconductor layer and the semiconductor substrate.

Abstract: A method of manufacturing a photoelectric device, the method including: forming a first semiconductor layer on a semiconductor substrate through a first ion implantation; forming a second semiconductor layer having an inverted conductive type on a part of the first semiconductor layer through a second ion implantation; and performing thermal processing to restore lattice damage of the semiconductor substrate and activate a dopant into which ion implanted. According to one or more embodiments of the present invention, a photoelectric device having a reduction in the number of processes for manufacturing the photoelectric device and improved output characteristics is provided.

Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

Abstract: A technique may improve LDP-IGP synchronization in a MPLS network when an interface of a router coupled to a communications link along a shortest path between a source router and a destination router becomes newly active. Specifically, an IGP adjacency may be held down over the newly active link while a LDP adjacency is established over the link. The router may inject a temporary, non-redistributable route having a large administrative weight into its routing table utilizing addresses learned during establishment of the LDP adjacency. The injected route ensures that there is a reachable route to a peer router so that LDP may converge. After LDP has converged and all needed label bindings have been distributed in the MPLS network utilizing the injected route, IGP executing on the router may advertise a normal cost metric for the link associated with the newly active interface, and IGP convergence may be completed.

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminium surfaces solderable using the flux and conventional solders.

Abstract: A solar cell including a first conductive type semiconductor substrate; a first intrinsic semiconductor layer on a front surface of the semiconductor substrate; a first conductive type first semiconductor layer on at least one surface of the first intrinsic semiconductor layer; a second conductive type second semiconductor layer on a back surface of the semiconductor substrate; a second intrinsic semiconductor layer between the second semiconductor layer and the semiconductor substrate; a first conductive type third semiconductor layer on the back surface of the semiconductor substrate, the third semiconductor layer being spaced apart from the second semiconductor layer; and a third intrinsic semiconductor layer between the third semiconductor layer and the semiconductor substrate.

Abstract: A technique may improve LDP-IGP synchronization in a MPLS network when an interface of a router coupled to a communications link along a shortest path between a source router and a destination router becomes newly active. Specifically, an IGP adjacency may be held down over the newly active link while a LDP adjacency is established over the link. The router may inject a temporary, non-redistributable route having a large administrative weight into its routing table utilizing addresses learned during establishment of the LDP adjacency. The injected route ensures that there is a reachable route to a peer router so that LDP may converge. After LDP has converged and all needed label bindings have been distributed in the MPLS network utilizing the injected route, IGP executing on the router may advertise a normal cost metric for the link associated with the newly active interface, and IGP convergence may be completed.

Abstract: A technique may improve LDP-IGP synchronization in a MPLS network when an interface of a router coupled to a communications link along a shortest path between a source router and a destination router becomes newly active. Specifically, an IGP adjacency may be held down over the newly active link while a LDP adjacency is established over the link. The router may inject a temporary, non-redistributable route having a large administrative weight into its routing table utilizing addresses learned during establishment of the LDP adjacency. The injected route ensures that there is a reachable route to a peer router so that LDP may converge. After LDP has converged and all needed label bindings have been distributed in the MPLS network utilizing the injected route, IGP executing on the router may advertise a normal cost metric for the link associated with the newly active interface, and IGP convergence may be completed.

Abstract: A photoelectric device includes a first semiconductor structure and a second semiconductor structure on a substrate, and the first semiconductor structure includes a different conductivity type from the second semiconductor structure. The photoelectric device also includes a first electrode on the first semiconductor structure and a second electrode on the second semiconductor structure, and an interlayer insulating structure adjacent to the second semiconductor structure. The interlayer insulating structure separates the first semiconductor structure from the second semiconductor structure and separates the first semiconductor structure from the second electrode.

Abstract: A photoelectric device includes: a semiconductor substrate including monocrystalline silicon and has first and second surfaces that are opposite to each other; a doping unit formed on the first surface of the semiconductor substrate; and an insulating layer that is formed between the doping unit and the second surface of the semiconductor substrate, wherein the doping unit includes: a first semiconductor layer including a first dopant doped in the monocrystalline silicon; and a second semiconductor layer including a second dopant doped in the monocrystalline silicon.

Abstract: A new and distinct Camellia L. plant named ‘Pink Cascade’, characterized by its lanceolate leave shape, the width of its leaves measuring at about 1.8 cm to about 2.2 cm, its cascade stem shape, its flower stage at early March to early April, its light pink flower color, its single flower shape, and its diameter of the flower measuring at about 2 cm to about 4 cm.

Abstract: A method of manufacturing a photoelectric device, the method including: forming a first semiconductor layer on a semiconductor substrate through a first ion implantation; forming a second semiconductor layer having an inverted conductive type on a part of the first semiconductor layer through a second ion implantation; and performing thermal processing to restore lattice damage of the semiconductor substrate and activate a dopant into which ion implanted. According to one or more embodiments of the present invention, a photoelectric device having a reduction in the number of processes for manufacturing the photoelectric device and improved output characteristics is provided.

Abstract: A technique may improve LDP-IGP synchronization in a MPLS network when an interface of a router coupled to a communications link along a shortest path between a source router and a destination router becomes newly active. Specifically, an IGP adjacency may be held down over the newly active link while a LDP adjacency is established over the link. The router may inject a temporary, non-redistributable route having a large administrative weight into its routing table utilizing addresses learned during establishment of the LDP adjacency. The injected route ensures that there is a reachable route to a peer router so that LDP may converge. After LDP has converged and all needed label bindings have been distributed in the MPLS network utilizing the injected route, IGP executing on the router may advertise a normal cost metric for the link associated with the newly active interface, and IGP convergence may be completed.

Abstract: A photovoltaic device includes a substrate, the substrate having a base region and an emitter region, the base region having a first width and the emitter region having a second width, a first electrode in contact with and electrically connected to the base region, the first electrode having a third width where it overlies the base region, the third width being greater than the first width such that the first electrode overhangs the base region at at least one side thereof, and a second electrode in contact with and electrically connected to the emitter region, the second electrode having a fourth width where it overlies the emitter region, a ratio of the third width to the fourth width being about 0.3 to about 3.4.

Abstract: A solar cell includes a semiconductor substrate, a first intrinsic semiconductor layer and a second intrinsic semiconductor layer on the semiconductor substrate, the first intrinsic semiconductor layer and the second intrinsic semiconductor layer being spaced apart from each other, a first conductive semiconductor layer and a second conductive semiconductor layer respectively disposed on the first intrinsic semiconductor layer and the second intrinsic semiconductor layer, and a first electrode and a second electrode, each including a bottom layer on the first conductive semiconductor layer and the second conductive semiconductor layer, respectively, the bottom layer including a transparent conductive oxide, and an intermediate layer on the bottom layer, the intermediate layer being including copper.

Abstract: A solar cell including a crystalline semiconductor substrate having a first conductive type; a first doping layer on a front surface of the substrate and being doped with a first conductive type impurity; a front surface antireflection film on the front surface of the substrate; a back surface antireflection film on a back surface of the substrate; an intrinsic semiconductor layer, an emitter, and a first auxiliary electrode stacked on the back surface antireflection film and the substrate; a second doping layer on the back surface of the substrate and being doped with the first impurity; an insulating film on the substrate and including an opening overlying the second doping layer; a second auxiliary electrode in the opening and overlying the second doping layer; a first electrode on the first auxiliary electrode; and a second electrode on the second auxiliary electrode and being separated from the first electrode.

Abstract: A solar cell including a first conductive type semiconductor substrate; a first intrinsic semiconductor layer on a front surface of the semiconductor substrate; a first conductive type first semiconductor layer on at least one surface of the first intrinsic semiconductor layer; a second conductive type second semiconductor layer on a back surface of the semiconductor substrate; a second intrinsic semiconductor layer between the second semiconductor layer and the semiconductor substrate; a first conductive type third semiconductor layer on the back surface of the semiconductor substrate, the third semiconductor layer being spaced apart from the second semiconductor layer; and a third intrinsic semiconductor layer between the third semiconductor layer and the semiconductor substrate.

Abstract: A solar cell includes a silicon substrate including a front surface for receiving light, and a rear surface opposite the front surface, an emitter diffusion region on the rear surface and doped with a first polarity that is opposite to a polarity of the silicon substrate, a base diffusion region on the rear surface of the substrate and doped with a second polarity that is the same as the polarity of the silicon substrate, and an insulation gap between the emitter diffusion region and the base diffusion region, wherein the base diffusion region has a closed polygonal shape, and wherein the insulation gap is adjacent the base diffusion region.

Abstract: A new and distinct Camellia L. plant named ‘Pink Cascade’, characterized by its lanceolate leave shape, the width of its leaves measuring at about 1.8 cm to about 2.2 cm, its cascade stem shape, its flower stage at early March to early April, its light pink flower color, its single flower shape, and its diameter of the flower measuring at about 2 cm to about 4 cm.